• The monthly packaging world
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• s.137
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• pp.80-83
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• 2004

• The monthly packaging world
• /
• s.137
• /
• pp.84-87
• /
• 2004

• The monthly packaging world
• /
• s.177
• /
• pp.100-103
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• 2008

• The monthly packaging world
• /
• s.164
• /
• pp.84-93
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• 2006

• The monthly packaging world
• /
• s.163
• /
• pp.100-106
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• 2006

• The monthly packaging world
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• s.174
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• pp.74-77
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• 2007

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• Corrugated packaging logistics
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• no.56 s.12
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• pp.85-89
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• 2004

신용 카드나 정기권 등 본격적으로 IC카드가 보급되고 있다. 앞으로 단말기 등의 플랫폼이 구축되어 IC카드만 있으면 모든 것을 할 수 있는 서비스가 실행되길 기대해도 좋을 것이다. 한편,RFID는 다양한 애플리케이션이 검토되기 시작하고 있다. RFID의 보급확대를 위해서는 먼저 표준화가 선행되어야 한다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.3-7
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• 2000

In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.