• The Journal of Advanced Prosthodontics
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• v.5 no.1
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• pp.36-43
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• 2013

PURPOSE. The objective of this study was to compare the fracture toughness ($K_{Ic}$) obtained from the single edge V-notched beam (SEVNB) and the fractographic analysis (FTA) of a glass-infiltrated and a zirconia ceramic. MATERIALS AND METHODS. For each material, ten bar-shaped specimens were prepared for the SEVNB method ($3mm{\times}4mm{\times}25mm$) and the FTA method ($2mm{\times}4mm{\times}25mm$). The starter V-notch was prepared as the fracture initiating flaw for the SEVNB method. A Vickers indentation load of 49 N was used to create a controlled surface flaw on each FTA specimen. All specimens were loaded to fracture using a universal testing machine at a crosshead speed of 0.5-1 mm/min. The independent-samples t-test was used for the statistical analysis of the $K_{Ic}$ values at ${\alpha}$=0.05. RESULTS. The mean $K_{Ic}$ of zirconia ceramic obtained from SEVNB method ($5.4{\pm}1.6\;MPa{\cdot}m^{1/2}$) was comparable to that obtained from FTA method ($6.3{\pm}1.6\;MPa{\cdot}m^{1/2}$). The mean $K_{Ic}$ of glass-infiltrated ceramic obtained from SEVNB method ($4.1{\pm}0.6\;MPa{\cdot}m^{1/2}$) was significantly lower than that obtained from FTA method ($5.1{\pm}0.7\;MPa{\cdot}m^{1/2}$). CONCLUSION. The mean $K_{Ic}$ of the glass-infiltrated and zirconia ceramics obtained from the SEVNB method were lower than those obtained from FTA method even they were not significantly different for the zirconia material. The differences in the $K_{Ic}$ values could be a result of the differences in the characteristics of fracture initiating flaws of these two methods.

• The KIPS Transactions:PartA
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• v.10A no.3
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• pp.255-260
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• 2003

In recent, as a typical example of RFID, the contactless IC card is widely used in traffic, access control system and so forth. And its use becomes a general tendency more and more because of the development of RF technology and improvement of requirement for user convenience. This paper describes the hardware module to process embedded contactless protocol for implementation contactless IC card. And the hardware module consists of analog circuits and specific digital logic circuits. This paper also describes more effective design method of contactless IC card, which method separates into analog circuit parts, digital logic circuit part, and software parts according to the role of the design parts.

• Proceedings of the Korean Environmental Health Society Conference
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• 2002.04a
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• pp.40.1-43
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• 2002

The purpose of this study was to evaluate a new sampling and analytical method for the determination of hexavalent chromium, Cr(VI) in mist from field plating operation. The Procedures of this new method (Shin & Paik's Method) are as the following: Airborne hexavalent chromium is collected on polyvinyl chloride (PVC) filter according to the National Institute for Occupational Safety and Health (NIOSH) Method 7600, and the filter sample is placed in a screw-capped vial and soaked with 2％ NaOH/3％ Na₂CO₃ solution immediately after sampling. The Cr(VI) sample is analyzed by ion chromatography/visible spectrophotometry (IC/VS) according to the U.S. Environmental Protection Agency (EPA) Method 218.6. The airborne Cr(VI) concentrations measured by this method were compared with those determined by three reference methods: One (NIOSH/EPA Method) consisted of sampling airborne Cr(VI) on PVC filters and storing the sample filters in screw-capped vials according to the NIOSH method, and analyzing Cr(VI) in samples using IC/VS according to the EPA method. The second method (Impinger Method/NaHCO₃) consisted of absorbing airborne Cr(VI) into 0.02 MN/sub a/Hco₃ solution in midget impinger, and analyzing the Cr(VI) in samples using IC/VS. The third method was the OSHA Method Id-215. Using these four different methods, four replicates of air samples were collected at an electroplating process and analyzed simultaneously. Two-way ANOVA and Paired t-test were used to test difference among values determined by the methods. There was no significant difference and a strong correlation (r/sup 2/=0.99) between Cr(VI) concentrations measured by the shin & Paik's Method and an impinger method (p＞0.05). However, Cr(VI) concentrations determined by Shin & Paik's Method were Significantly different form those by the NIOSH/EPA Method (p＜0.05) or the OSHA method (p＜0.05). The Cr(VI) concentrations of Shin & Paik's Method were Significantly higher than those of the NIOSH/EPA Method or the OSHA method. We concluded that the Shin & Paik's Method could prevent Cr(VI) losses caused by reduction and give more reliable results of airborne Cr(VI) concentrations in work environments.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.997-998
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• 2006

This paper proposes an design of the OLED(Organic Light Emitting Diodes) driver IC using novel verification method. This method using the HDL(hardware description language) simulator, PLI(Programing Language Interface) and image viewer. The proposed method can be used efficiently to function verification in display driver IC.

• Research in Plant Disease
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• v.16 no.2
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• pp.121-124
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• 2010

Immunocapture reverse transcription polymerase chain reaction (IC-RT-PCR) was applied to the detection of Cucumber green mottle mosaic virus (CGMMV), Kyuri green mottle mosaic virus (KGMMV), and Zucchini green mottle mosaic virus (ZGMMV) on Cucurbitaceae crops. These seed-borne tobamoviruses were accurately detected from the infected leaves and seeds by IC-RT-PCR. This method was estimated to be about 100 times more sensitive than ELISA, and also it allowed the direct confirmation of ELISA results by using the captured antigens from a completed ELISA microwell. This convenient and reliable method could be used routinely for large-scale field surveys or seed tests of Cucurbitaceae crops.

• The KIPS Transactions:PartA
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• v.19A no.1
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• pp.51-60
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• 2012

IC(Integrated circuits)card, generally be named smard card, embedded MPU(Micro Processor Unit) of small-size, memory, EEPROM, Card Operating System(COS) and security algorithm. The IC card is used in almost all industry such as a finance(credit, bank, stock etc.), a traffic, a communication, a medical, a electronic passport, a membership management and etc. Recently, a application field of IC card is on the increase by method for payments of T-commerce, as T-commerce is becoming a new growth engine of the broadcating industry by trend of broadcasting and telecommunication convergence, smart mechanization of TV. For example, we can pay in IC credit card(or IC cash card) on T-Commerce. or we can be provided TV banking service in IC cash card such as ATM. However, so far, T-commerce payment services have weakness in security such as storage and disclosure of card information as well as dropping sharply about custom ease because of taking advantage of card information input method using remote control. To solve this problem, This paper developed processing payment module for implementing TV electronic payment system using IC credit card payment standard, EMV.

• Journal of the Korean Society of Safety
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• v.6 no.4
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• pp.73-80
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• 1991

Interest in fracture of structure has increased significantly over the past decade. New approaches to analyze structural performance have been accompanied by the development of test methods to characterize material behavior in a manner compatible with the analysis. Several test methods have been developed as a results of advances in fracture mechanics, for example, $K_{IC}$ , $J_{IC}$, R-curve tearing instability and CTOD approaches. Among the rest, fracture toughness $K_{IC}$ and $J_{IC}$ can be used as an effective design criterion in fracture mechanics. Generally, the determintion of $J_{IC}$ was performed according to ASTM E 813 or JSME S 001 and $K_{IC}$ was performed according to ASTM E 399. In this study, the test method for $K_{IC}$ and $J_{IC}$ were discussed.scussed.

• International Journal of Railway
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• v.7 no.3
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• pp.80-84
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• 2014

The purpose of this paper was to review Intelligent Compaction (IC) techniques, which is regarded relatively new to the railroad roadbed construction activity. Most of civil structures are built on roadbed that supposed to provide adequate load bearing support to the upper structure through the qualified compaction process. However, it is not uncommon for structure failure attributed to inadequate compaction control take place in field sites. Unlike traditional compaction control method to check field density at several locations, IC techniques continuously measure various compaction quality indices that represent compaction uniformity. In this paper, a series of literature review relevant to IC techniques was conducted to provide concise summary on the following categories: 1) background of IC technique; 2) Summary of IC vendors and basic principles; 3) modeling of IC behavior, and 4) case study along with correlation between IC with other measurements. In summary, IC technologies seem to be promising in future railroad construction to achieve better compaction quality control so that the serviceability of railroad can be ensured with minimizing rehabilitation and maintenance activities.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.34S no.7
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• pp.102-111
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• 1997

In this paper, a patern recognition method of surface mount device(SMD) IC using wavelet transform and neural network is proposed. We chose the feature parameter according to the characteristics of coefficient matrix which is obtained from four level discrete wavelet transform (DWT). These feature parameters are normalized and then used for the input vector of neural network which is capable of adapting the surroundings such as variation of illumination, arrangement of objects and translation. Experimental results show that when the same form of feature pattern, as is used for learning, is put into neural network and gained 100% rate ofrecognition irrespective of SMD IC kinds, location and variation of illumination. In the case of unused feature pattern for learning, the recognition rate is 85.9% under the similar surroundings, where as an average recognition rate is 96.87% for the case of reregulated value of illumination. Proosed method is relatively simple compared with the traditional space domain method in extracting the feature parameter and is also well suited for recognizing the pattern's class, position and existence. It can also shorten the processing tiem better than method extracting feature parameter with the use of discrete cosine transform(DCT) and adapt the surroundings such as variation of illumination, the arrangement and the translation of SMD IC.

• Journal of Ocean Engineering and Technology
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• v.8 no.2
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• pp.38-46
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• 1994

The method of JSME S001-83 and ASTM E813-87 have been adapted for evaluation of the elastic-plastic fracture toughness J sub(IC) of SB41 steel. This SB41 steel have the characteristics of low-stength CT specimens. The test results obtained have been considered and compared on the basis of resulted data from two kinds of methods(JSME S001-83, ASTM E813-87) and two kinds of specimen configurations(smooth, side-grooved). On the basis of results from consideration and comparison, the difficulties for its application were presented in case when the standard ASTM E813-87 method was employed for the measurement of J sub(IC) in SB41 steel. A modified method was applied for measuring J sub(IC) in SB41 steel that it used the blunting line real-measured by experiment instead of the standard blunting line theoretically determined, and the result from that procedure was analyzed and the usefulness of that method was examined and considered.