• Proceedings of the KIPE Conference
• /
• 2002.07a
• /
• pp.233-236
• /
• 2002

The solution for PFC(Power Factor Correction), as a regulation in energy Policy, is becoming a hot Issue in every country because of the shortage of electrical energy. Therefore, a new improved idea for PFC problem has been introduced in this study. A lot of merits, effective cost by simple circuit, reduced PCB size, lighter than reactor in the view of weight, lower level of screen noise by leakage inductance in CTV applications, have been stated by comparing to the earlier method of using a Reactor. All test results in this statement were done by using a power device of STR-G9600 series based on the real load condition of color television. furthermore, the study shows that the test results also meets the IEC-1000-3-2 class D, which regulates the PFC when input power of a set is more than 75watts. More improved PFC in other applications hopes to be implemented by using the proposed method.

• Journal of Welding and Joining
• /
• v.16 no.4
• /
• pp.92-97
• /
• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.18 no.5
• /
• pp.431-438
• /
• 2005

In this paper, we propose the built-in current testing circuit for improving reliability As the integrated CMOS circuits in a chip are increased, the testability on design and fabrication should be considered to reduce the cost of testing and to guarantee the reliability In addition, the high degree of integration makes more failures which are different from conventional static failures and introduced by the short between transistor nodes and the bridging fault. The proposed built-in current testing method is useful for detecting not only these failures but also low current level failures and faster than conventional method. In normal mode, the detecting circuit is turned off to eliminate the degradation of CUT(Circuits Under Testing). The differential input stage in detecting circuit prevents the degradation of CUT in test mode. It is expected that this circuit improves the quality of semiconductor products, the reliability and the testability.

• Structural Engineering and Mechanics
• /
• v.56 no.3
• /
• pp.473-490
• /
• 2015

This paper presents the analysis of intermediate crack-induced (IC) debonding failure loads for reinforced concrete (RC) beams strengthened with adhesively-bonded fiber-reinforced polymer (FRP) plates or sheets. The analysis consists of the energy release and simple ACI methods. In the energy release method, a fracture criterion is employed to predict the debonding loads. The interfacial fracture energy that indicates the resistance to debonding is related to the bond-slip relationships obtained from the shear test of FRP-to-concrete bonded joints. The section analysis that considers the effect of concrete's tension stiffening is employed to develop the moment-curvature relationships of the FRP-strengthened sections. In the ACI method, the onset of debonding is assumed when the FRP strain reaches the debonding strain limit. The tension stiffening effect is neglected in developing a moment-curvature relationship. For a comparison purpose, both methods are used to numerically investigate the effects of relevant parameters on the IC debonding failure loads. The results show that the debonding failure load generally increases as the concrete compressive strength, FRP reinforcement ratio, FRP elastic modulus and steel reinforcement ratio increase.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.12a
• /
• pp.33-34
• /
• 2006

The effects of Ba and Ce addition has been investigated in YBCO prepared by trifluoroacetate (TFA) metalorganic depostition (MOD) method. Precursor solutions with cation ratios of Y:Ba:Cu:Ce = 1:2+x:3:x (x = 0, 0.05, 0.1 and 1.5) have been prepared by adding an excess amount of cerium and barium. Coated film was calcined at lower temperature and conversion heat treatment at temperature of $780{\sim}810^{\circ}C$. It has been shown that the critical current (Ic) of YBCO film was degraded by doping of Ba and Ce atoms. But Ic was increased as the amount of doped Ba and Ce content increased from 5 % to 15 %. It was observed that there was little increase of a flux pinning force with Ba and Ce addition in YBCO film prepared by TFA-MOD process.

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.7 no.2
• /
• pp.223-232
• /
• 1997

The accuracy and precision of a modified method of NIOSH Method 7600 and EPA method 218.6 was determined for analyzing hexavalent chromium, Cr(VI), collected on PVC filter from workplace air. The method was designed to extract from Cr(VI) on PVC filter with a alkali solution, 2% NaOH/3% $Na_2CO_3$, and to analyze it using ion chromatography/visible absorbance detection(IC/VAD). The results and conclusion are as the following. 1. The peak of Cr(VI) was separated sharply on chromatogram and was linearly related with Cr(VI) concentration in sloution. The correlation coefficient was 0.9999 in a calibration curve. The limit of detection was 0.25 $0.25{\mu}g/sample$. 2. The accuracy(% recovery) was 93.3% in a set of sample($9-50{\mu}g$) stored for a day, and 100.1%($10-60{\mu}g$) in another set of samples stored for 2 hours. It is assumed that the difference in recovery by storage time was due to reduction of Cr(VI) to Cr(III). 3. The precision(coefficient of variation, CV) of the method was 0.015 in spiked samples with Cr(VI) standard solution, and 0.010 in spiked samples with plating solution from a chrome electroplating factory. The overall CV in all types of samples was 0.0013. 4. The Cr(VI) was stable in 2% NaOH/3% $Na_2CO_3$ at least for 10 hours. In conclusion, the IC/VAD method is appropriate for determining low-level Cr(VI) in workplace air containing various interferences.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1993.11a
• /
• pp.43-46
• /
• 1993

Superconducting cable (Ic: 60 A at 77K. 10 filaments) with Bi high-Tc superconducting system was developed by powder - in - tube method. Pressing and sintering process of the cables were repeated for growth of 2223 high-Tc superconducting phase. The cable can be fabricate by twist method that is nessary for high current density and cooled circulative system. This cab1e system can be used for commercial.

• Proceedings of the IEEK Conference
• /
• 2001.06d
• /
• pp.105-108
• /
• 2001

This paper proposed an efficient memory scheduling method (E$^2$M$^2$) by which the real-time image compression using 2-dimensional discrete wavelet transform(2-D DWT) is possible in an FPGA chip. In this paper, we assumed that the 2-D DWT was performed as the Mallat-tree. After the memory mapping method was proved in software, the memory controller was designed for an commercial SDRAM IC.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.22 no.5
• /
• pp.1036-1044
• /
• 1997

We modify the montgomery modeular multikplication to extract the common parts in common-multiplicand multi-plications. Since the modified method computes the common parts in two modular multiplications once rather than twice, it can speed up the exponentiations and reduce the amount of storage tables in m-ary or windowexponentiation. It can be also applied to an exponentiation mehod by folding the exponent in half. This method is well-suited to the memory limited environments such as IC card due to its speed and requirement of small memory.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.2
• /
• pp.31-36
• /
• 1999

An efficient method for thermal modeling of QFP is Proposed. Thermal measurement data are given to verify the method. In parallel with the experiment, an exact full 3-D model calculation is also provided. One fonds that there is an excellent agreement between validation data and the efficient model data.