• 한국지반신소재학회논문집
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• 제8권3호
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• pp.45-52
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• 2009

최근 국내에서는 시공성 및 경제성이 우수하고, 수려한 경관을 연출할 수 있는 보강토옹벽의 적용이 급증하고 있는 추세이다. 일반적으로 블록식 보강토옹벽 시공시 전면블록과 보강재 사이의 연결은 블록에 미리 형성시킨 돌기(전단키형 방식) 또는 플라스틱 핀(핀형 방식)을 이용하여 보강재를 블록에 정착시키는 방식으로 이루어지고 있다. 그러나 이와 같은 연결방식은 시공중 보강재에 부분적인 손상의 원인이 되며, 이로 인해 보강토옹벽의 안정성에 문제를 야기시킬 수 있다. 따라서 본 연구에서는 기존 연결방식의 문제점을 해결하고자, 안정성을 보다 높이고 경제성은 기존 방식과 유사한 I형 연결장치를 이용한 전면블록/지오그리드 보강재의 연결방법을 개발하였으며, 현장 적용을 위하여 연결강도 특성을 평가하였다.

• 수산해양기술연구
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• 제36권2호
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• pp.126-131
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• 2000

본 연구에서는 장어 통발어선 자동화 조업장치 개발의 첫 단계로서 통발을 모릿줄에 기계적으로 연결, 분리할 수 있는 장치인 집게식 통발연결장치 및 통발자동분리장치를 개발하여 해상성능실험을 실시하였다. 본 연구에서 얻어진 결과를 요약하면 다음과 같다. 1. 집게식 통발연결장치가 무른 꼬임 트와인 고다리 및 된 꼬임 트와인 고다리에 각각 연결되었을 때, 그 사이의 최대 인장하중은 각각 1379 N및 1,603 N 이었다. 2. 집게식 통발연결장치에 대한 해상성능시험 결과 성능이 양호함을 확인하였으며, 통발 회수율은 100% 이었다. 3. 통발자동분리장치에 대한 해상성능시험 결과 성능이 양호함을 확인하였으며, 통발 분리율은 100% 이었다.

• 한국정보과학회논문지:컴퓨팅의 실제 및 레터
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• 제12권2호
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• pp.102-110
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• 2006

본 논문에서는 인터넷과 연결되어 사용되는 일반 PC가 아닌 소형의 임베디드 인터넷 라디오수신 단말기의 구현에 대하여 논의한다. 이러한 시스템의 표준이 아직 정하여 있지 않으며 알고리즘 또한 비공개 상태이다. 따라서 PC의 인터넷 라디오 수신 방식을 분석하여 끊김이 없는 고음질의 임베디드 인터넷 라디오 시스템을 구현을 위하여 여러 업체의 PC 인터넷 수신 알고리즘은 분석하고 하드웨어는 자체 개발하였다. 본 인터넷 라디오 시스템은 실시간 인터넷 라디오의 멀티스트리밍 기능, 임베디드 프로세서, 플래쉬 메모리, TCP/IP 인터훼이스, MP3 디코더 등으로 구성되어있다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 B
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• pp.806-808
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• 2004

The series and parallel connection is essential for increasing power ratings of resistive type for fault current limiters. To increase voltage class, components are connected in series and to increase current level to the nominal value, they are connected in parallel. There are two ways to connect components in series and parallel. First, connected in series and then the module connects to the parallel. Second, connected in parallel and the module connects to the series. We have studied for the two ways. In this paper, we particularly investigated way to connect components in parallel first This way has the advantage of inducing effective simultaneous quench without any other devices, for example, the thing which is inducing magnetic field to the limiting and shunt resistors. And also we studied for the endurance of component which is patterned to the bi-spiral for prospective fault current. It is very important to understand this, because SFCL will use as the only device to decrease burden of circuit breaker. As experimental results, limiting component patterned to bi-spiral endures fault current up to 30kA and it works well, in parallel to series connection,

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Steel and Composite Structures
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• 제18권6호
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• pp.1423-1450
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• 2015

The paper presents the details and results of an experimental study on bolted end-plate joints of industrial type steel building frames. The investigated joints are commonly used in Lindab-Astron industrial buildings and are optimized for manufacturing, erection and durability. The aim of the research was to provide an experimental background for the design model development by studying load-bearing capacity of joints, bolt force distribution, and end-plate deformations. Because of the special joint details, (i.e., joints with four bolts in one bolt-row and HammerHead arrangements), the Eurocode 3 standardized component model had to be improved and extended. The experimental programme included six different end-plate and bolt arrangements and covered sixteen specimens. The steel grade of test specimens was S355, the bolt diameter M20, whereas the bolt grade was 8.8 and 10.9 for the two series. The end-plate thickness varied between 12 mm and 24 mm. The specimens were investigated under pure bending conditions using a four-point-bending test arrangement. In all tests the typical displacements and the bolt force distribution were measured. The end-plate plastic deformations were measured after the tests by an automatic measuring device. The measured data were presented and evaluated by the moment-bolt-row force and moment-distance from centre of compression diagrams and by the deformed end-plate surfaces. From the results the typical failure modes and the joint behaviour were specified and presented. Furthermore the influence of the end-plate thickness and the pretension of the bolts on the behaviour of bolted joints were analysed.