• Journal of the Korean Geosynthetics Society
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• v.8 no.3
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• pp.45-52
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• 2009

The use of geogrid-reinforced earth wall technologies has progressed rapidly over the past 10 years in Korea because these technologies have advantages such as economical efficiency, graceful appearance, and easy construction. The geogrid used in the reinforced earth wall with concrete block facing can be subjected to damage among the upper and lower blocks and at the interface between the block and the geogrid. Therefore, when design of the geogrid-reinforced soil walls the required connection strength of the geogrid to the wall facing is an issue. In this study, new connection system between facing block and geogrid is developed to improve the damages of geogrid in the existing connection systems. The new connection devices are made of steel and have I-shape. This paper describes the test method and results of the laboratory testing for determination of connection strength in connection system using the I-type connection device.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.36 no.2
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• pp.126-131
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• 2000

Capability and performance of the pliers type coupling device for connection of sea eel pots to loop of main line and automatic separating system were investigated at sea as first trial of developing automatic operating system for sea eel pot fishing boat. Obtained main results are as follows. 1. Maximum tensile load of the pliers type coupling device when connection with high twist PP dan-line as a loop of main line was 1603 N, higher than when connection with low twist PP twine 1379 N. 2. A retention ratio of sea eel pots from main line by connecting with coupling device was successful 100% with high performance without any loss in the sea. 3. A ratio of automatic disconnection between sea eel pots using coupling device and loop of main line was perfect 100% without any trouble.

• Journal of KIISE:Computing Practices and Letters
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• v.12 no.2
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• pp.102-110
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• 2006

This paper explains the design and development of the stand-alone high sound quality Internet Radio system, which is aimed for a small embedded type audio device rather than a general PC type. This device is designed to work with an Internet connection. This kind of system is not standardized so far, and also the related algorithm is not open to the public. So it is necessary to analyze several receiving algorithms of current radio receivers, and develop our own hardware in order to overcome these obstacles, finally to get the high quality of sound radio. The main electronic components of this Internet Radio are TCP/IP interfaces, an audio MP3 decoder, an I/O interface, and a Flash Memory Card with advanced audio multicasting for the next-generation Internet Radio. Basic structures and implementation issues of the next-generation most-versatile digital music player, and Internet Radio receivers, are discussed.

• Proceedings of the KIEE Conference
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• summer
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• pp.806-808
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• 2004

The series and parallel connection is essential for increasing power ratings of resistive type for fault current limiters. To increase voltage class, components are connected in series and to increase current level to the nominal value, they are connected in parallel. There are two ways to connect components in series and parallel. First, connected in series and then the module connects to the parallel. Second, connected in parallel and the module connects to the series. We have studied for the two ways. In this paper, we particularly investigated way to connect components in parallel first This way has the advantage of inducing effective simultaneous quench without any other devices, for example, the thing which is inducing magnetic field to the limiting and shunt resistors. And also we studied for the endurance of component which is patterned to the bi-spiral for prospective fault current. It is very important to understand this, because SFCL will use as the only device to decrease burden of circuit breaker. As experimental results, limiting component patterned to bi-spiral endures fault current up to 30kA and it works well, in parallel to series connection,

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Steel and Composite Structures
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• v.18 no.6
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• pp.1423-1450
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• 2015

The paper presents the details and results of an experimental study on bolted end-plate joints of industrial type steel building frames. The investigated joints are commonly used in Lindab-Astron industrial buildings and are optimized for manufacturing, erection and durability. The aim of the research was to provide an experimental background for the design model development by studying load-bearing capacity of joints, bolt force distribution, and end-plate deformations. Because of the special joint details, (i.e., joints with four bolts in one bolt-row and HammerHead arrangements), the Eurocode 3 standardized component model had to be improved and extended. The experimental programme included six different end-plate and bolt arrangements and covered sixteen specimens. The steel grade of test specimens was S355, the bolt diameter M20, whereas the bolt grade was 8.8 and 10.9 for the two series. The end-plate thickness varied between 12 mm and 24 mm. The specimens were investigated under pure bending conditions using a four-point-bending test arrangement. In all tests the typical displacements and the bolt force distribution were measured. The end-plate plastic deformations were measured after the tests by an automatic measuring device. The measured data were presented and evaluated by the moment-bolt-row force and moment-distance from centre of compression diagrams and by the deformed end-plate surfaces. From the results the typical failure modes and the joint behaviour were specified and presented. Furthermore the influence of the end-plate thickness and the pretension of the bolts on the behaviour of bolted joints were analysed.