• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.4
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• pp.286-290
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• 2020

The formation of inorganic thin films in low-temperature solution processes is necessary for a wide range of commercial applications of organic electronic devices. Aluminum oxide thin films can be utilized as barrier films that prevent the deterioration of an electronic device due to moisture and oxygen in the air. In addition, they can be used as the gate insulating layers of a thin film transistor. In this study, aluminum oxide thin film were formed using two methods simultaneously, a thermal process and the DUV process, and the properties of the thin films were compared. The result of converting aluminum nitrate hydrate to aluminum oxide through a hybrid process using a thermal treatment and DUV was confirmed by XPS measurements. A film-based a-IGZO TFT was fabricated using the formed inorganic thin film as a gate insulating film to confirm its properties.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.13 no.2
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• pp.536-564
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• 2019

Soft faults are inherent in wireless sensor networks (WSNs) due to external and internal errors. The failure of processes in a protocol stack are caused by errors on various layers. In this work, impact of errors and channel misbehavior on process execution is investigated to provide an error classification mechanism. Considering implementation of WSN protocol stack, inter-process correlations of stacked and peer layer processes are modeled. The proposed model is realized through local and global decision trees for fault diagnosis. A hybrid framework is proposed to implement local decision tree on sensor nodes and global decision tree on diagnostic cluster head. Local decision tree is employed to diagnose critical failures due to errors in stacked processes at node level. Global decision tree, diagnoses critical failures due to errors in peer layer processes at network level. The proposed model has been analyzed using fault tree analysis. The framework implementation has been done in Castalia. Simulation results validate the inter-process correlation model-based fault diagnosis. The hybrid framework distributes processing load on sensor nodes and diagnostic cluster head in a decentralized way, reducing communication overhead.

• Journal of applied mathematics & informatics
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• v.35 no.3_4
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• pp.313-321
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• 2017

In this note we establish a new non-convex hybrid iteration algorithm corresponding to Khan iterative process [4] and prove strong convergence theorems of common fixed points for a uniformly closed asymptotically family of countable quasi-Lipschitz mappings in Hilbert spaces. Moreover, the main results are applied to get the common fixed points of finite family of quasi-asymptotically nonexpansive mappings. The results presented in this article are interesting extensions of some current results.

• KEPCO Journal on Electric Power and Energy
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• v.5 no.2
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• pp.113-120
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• 2019

We have developed 1 kW-class PEMFC-battery hybrid system independently powering to the building, through the process of system design, current load characteristics analysis, power system configuration for demonstration site and performance evaluation. In order to use the fuel cell and battery as the hybrid type, a control technology for the charging/discharging decision and charging speed of the battery is required rather than using fuel cell. Also output power distribution between PEMFC and the battery is a core of energy management technology. It is confirmed that it is possible to supply independently 1kW powering the building to ensure optimal energy management through the power control experiment of the hybrid system.

• Transactions of Materials Processing
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• v.30 no.5
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• pp.242-246
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• 2021

Aluminum alloy sheet is being applied to automobiles continuously for the purpose of reducing car body weight. However, due to low formability, there's a limit to application of products with a deep forming depth such as door inner parts. Therefore, the difficult-to-form parts are mainly segmented formed then joined together, which is also disadvantageous as it increases the cost of manufacturing. This study proposes a hybrid cold-hot stamping method for the 1-piece door inner part to reduce cost. To design the stamping process, numerical simulation method is established by using the temperature-dependent mechanical properties of AA6016. The formability according to the hybrid cold-hot stamping method is evaluated using numerical analysis. The suitability of the proposed stamping method is then verified through the stamping tryout.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.361-363
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• 2007

The light weight aluminum subframe for automobile chassis part was developed using hybrid process, i.e. extruforming, press stamping and MIG welding. To achieve a 30 % weight reduction compared with conventional steel subframe keeping satisfactory performance, the design of cross-section of extruforming part was introduced, then forming simulation was performed and the final design was determined. In addition, we tried to estibilish optimun aluminum welding conditions for good penetration depth and few pore defact, finally the prototype of aluminum subframe was assembled using MIG welding method.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.78-81
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• 2005

The aluminum Subframe for automobile was developed using hybrid process, i.e. extruforming and press forming. To achieve a $30\%$ weight reduction compared with convensional steel subframe keeping satisfactory performance, the design of cross-section of extrusion part was initiated, then forming simulation was performed and the final design was determined. In addition, we tried to estibilish proper aluminum welding conditions for good penetration depth and few pore defact, finally the prototype of aluminum subframe was assembled using MIG welding method.

• Corrosion Science and Technology
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• v.11 no.1
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• pp.15-19
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• 2012

Both electrogalvanized and hot-dip galvanized steel sheets have been finally produced via organic-inorganic surface coating process on the zinc surface to enhance corrosion resistance and afford additional functional properties. Recently, POSCO has been developed a variety of chromate-free coated steels that are widely used in household, construction and automotive applications. New organic-inorganic hybrid coating solutions as chromate alternatives are comprised of surface modified silicate with silane coupling agent and inorganic corrosion inhibitors as an aqueous formulation. In this paper we have prepared new type of hybrid coatings and evaluated quality performances such as corrosion resistance, spot weldability, thermal tolerance, and paint adhesion property etc. The electrogalvanized steels with these coating solutions exhibit good anti-corrosion property compared to those of chromate coated steels. Detailed components composition of coating solutions and experimental results suggest that strong binding between organic-inorganic hybrid coating layer and zinc surface plays a key role in the advanced quality performances.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.2
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• pp.160-167
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• 2018

The purpose of this study is to develop a process for forming a MPa ultra-high strength steel sheet to reduce weight and improve product strength. To do this, we performed the initial process design based on empirical formulas in a handbook and experience of skilled engineers, and researched the effects of major process variables on spring back by analyzing the forming analysis and experimental results. This paper suggests an optimal process design of the seat rail lower parts, using a MPa ultra-high strength steel sheet. This satisfies the dimensional accuracy and strength requirements for the product.