• 한국공간구조학회논문집
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• 제17권4호
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• pp.35-42
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• 2017

This study develops a new hybrid passive energy dissipation device for seismic rehabilitation of an existing structure. The device is composed of a friction damper combined with a steel plate with vertical slits as a hysteretic damper. Analytical model is developed for the device, and the capacity of the hybrid device to satisfy a given target performance is determined based on the ASCE/SEI 7-10 process. The effect of the device is verified by nonlinear dynamic analyses using seven earthquake records. The analysis results show that the dissipated inelastic energy is concentrated on the hybrid damper and the maximum interstory drift of the SMRF with damping system satisfies the requirement of the current code.

• Current Photovoltaic Research
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• 제3권4호
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• pp.116-120
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• 2015

A hybrid transparent conducting layer was applied for Si photodetector. To realize the hybrid transparent conducting layer, a 200 nm-thick ITO layer was deposited onto a Si substrate, following by a solution-processed AgNWs-coating on the ITO. The hybrid transparent conducting layer showed an excellent low electric resistance of $15.9{\Box}/{\Omega}$ with a high optical transparency of 86.89%. Due to these optical and electrical benefits, the hybrid transparent conductor-embedding Si diode provides an extremely high rectifying ratio of 3386. Under light-illumination, the hybrid transparent conductor device provides extremely high photoresponses for broad wavelengths. This implies that a functional design for hybrid transparent conductor is crucial for photoelectric devices and applications.

• 조명전기설비학회논문지
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• 제29권3호
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• pp.81-87
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• 2015

In order to effectively protect electrical and electronic circuits which are extremely susceptible to lightning surges, multi-stage surge protection circuits are required. This paper presents the operational characteristics of the two-stage hybrid surge protection circuit in extra-low voltage DC power lines. The hybrid surge protective device consists of the gas discharge tube, transient voltage suppressor, and series inductor. The response characteristics of the proposed hybrid surge protective device to combination waves were investigated. As a result, the proposed two-stage surge protective device to combination wave provides the tight clamping level of less than 50V. The firing of the gas discharge tube to lightning surges depends on the de-coupling inductance and the rate-of-change of the current flowing through the transient voltage suppressor. The coordination between the upstream and downstream components of the hybrid surge protective device was satisfactorily achieved. The inductance of a de-coupler in surge protective circuits for low-voltage DC power lines, relative to a resistance, is sufficiently effective. The voltage drop and power loss due to the proposed surge protective device are ignored during normal operation of the systems.

• Structural Engineering and Mechanics
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• 제53권5호
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• pp.1031-1049
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• 2015

This paper highlights the role of innovative vibration control system based on two promising properties in a parallel configuration. Hybrid device consists of two main components; recentering wires of shape memory alloy (SMA) and steel pipe section as an energy dissipater element. This approach concentrates damage in the steel pipe and prevents the main structural members from yielding. By regulation of the main adjustable design parameter, an optimum performance of the device is obtained. The effectiveness of the device in passive control of structures is evaluated through nonlinear time history analyses of a five-story steel frame with and without the hybrid device. Comparing the results proves that the hybrid device has a considerable potential to mitigate the residual drift ratio, peak absolute acceleration and peak interstory drift of the structure.

• 한국건축친환경설비학회 논문집
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• 제12권6호
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• pp.618-626
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• 2018

In this paper, the hybrid dehumidification system using thermoelectric device is based on the idea of utilizing waste heat from the heat dissipation side of thermoelectric device as a heat source to regenerate chemical desiccant. We would like to apply this system to spaces required dehumidification due to continuous moisture generation or local high humidity in the houses. And, we want to confirm the possibility of developing the hybrid dehumidification system that combines passive dehumidification using chemical desiccant with active dehumidification using thermoelectric device.

• 한국재료학회지
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• 제30권8호
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• pp.421-425
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• 2020

A transparent quantum dot (QD)-based light-emitting diode (LED) with silver nanowire (Ag NW) and indium-tin oxide (ITO) hybrid electrode is demonstrated. The device consists of an Ag NW-ITO hybrid cathode (-), zinc oxide, poly (9-vinylcarbazole) (PVK), CdSe/CdZnS QD, tungsten trioxide, and ITO anode (+). The device shows pure green-color emission peaking at 548 nm, with a narrow spectral half width of 43 nm. Devices with hybrid cathodes show better performances, including higher luminance with higher current density, and lower threshold voltage of 5 V, compared with the reference device with a pure Ag NW cathode. It is worth noting that our transparent device with hybrid cathode exhibits a lifetime 9,300 seconds longer than that of a device with Ag NW cathode. This is the reason that the ITO overlayer can protect against oxidization of Ag NW, and the Ag NW underlayer can reduce the junction resistance and spread the current efficiently. The hybrid cathode for our transparent QD LED can applicable to other quantum structure-based optical devices.

• 한국전자통신학회논문지
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• 제4권4호
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• pp.301-305
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• 2009

Pt 나노입자의 합성과 이를 이용한 hybrid Pt-$SiO_2$ 나노입자의 합성을 성공적으로 수행하였으며, self-assembled Pt nanoparticles monolayer를 charge trapping layer로 활용하는 metal-oxide-semiconductor(MOS) type memory의 한 예로 non-volatile memory(NVM)의 응용을 보임으로써 나노입자의 활용 가능성을 보이고, 또한, hybrid Pt-$SiO_2$ 나노입자 박막 층의 제어를 통한 MOS type memory device에의 보다 더 넓은 활용 가능성을 보이고자 하였다.

• 한국재료학회지
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• 제17권4호
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• pp.185-191
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• 2007

The purpose of this study is to evaluate the thin fihn dielectric made of hybrid sol, which consist of barium titanate powder, polymeric sol and other polymers. This sol will be used dielectric applied to small, thin electric passive components such as MLCC(Multi Layer Ceramic Condenser), resister, inductor. This sol is composed of mixed fine barium titanate powder and polymeric sol including Ba, Ti-precursor, solvent, chelating agent, chemical reaction catalyst, the additive sols to improve fired densification and temperature reliability. First at all, we mixed hybrid sol to be dispersed and be stabilized by ball milling for 24hrs. By spin coating method, we makes thin film dielectric on the convectional green sheet for MLCC. After heat treatments, we analyzes the structure morphology, physical, electrical properties and X5R Temperature properties.

• 한국공간구조학회논문집
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• 제22권4호
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• pp.23-30
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• 2022

It is effective to apply hybrid damping device that combine separate damping device to cope with various seismic load. In this study, HRS hybrid damper(hybrid rubber slit damper) in which high damping rubber and steel slit plate are combined in parallel was proposed and structural performance tests were performed to review the suitability for seismic performance. Cyclic Loading tests were performed in accordance with criteria presented in KDS 41 17 00 and MOE 2019. As a result of the test, the criteria of KDS 41 17 00 and MOE2019 was satisfied, and the amount of energy dissipation increased due to the shear deformation of the high-damping rubber at low displacement. Result of performing the RC frame test, the allowable story drift ratio was satisfied, and the amount of energy dissipation increased in the reinforced specimen compared to the non-reinforced specimen.

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.