• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.174-175
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• 2005

Initial growth stage was investigated for SiC homoepitaxial film growth using 'step controlled epitaxy' technique. When the off angel direction is located parallel along to the gas flow direction, the smoother surface can be obtained. On the on axis substrates, selective etching was detected both the etching and growth condition. It was deduced that the high ratio of C/Si in the source gas results in well developed steps and etched spiral around micropipes.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.149-149
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• 2016

Ceramic is widely known material due to its outstanding mechanical property. Besides, Zirconia(ZrO2) has a low thermal conductivity so it is advantage in a heat insulation. Because of these superior properties, ZrO2 is attracted to many fields using ultra high temperature for example vehicle engines, aerospace industry, turbine, nuclear system and so on. However brittle fracture is a disadvantage of the ZrO2. In order to overcome this problem, we can make the ceramic materials to the forms of ceramic nanoparticles, ceramic nanowhiskers and these forms can be used to an agent of composite materials. In this work, we selected Au catalyzed Vapor-Liquid-Solid mechanism to synthesize ZrO2 nanowhiskers. The ZrO2 whiskers are grown through Hot-wall Chemical Vapor Deposition(Hot wall CVD) using ZrCl4 as a powder source and Au film as a catalyst. This Hot wall CVD method is known to comparatively cost effective. The synthesis condition is a temperature of $1100^{\circ}C$, a pressure of 760torr(1atm) and carrier gas(Ar) flow of 500sccm. To observe the morphology of ZrO2 scanning electron microscopy is used and to identify the crystal structure x-ray diffraction is used.

• 한국결정성장학회지
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• 제12권4호
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• pp.215-221
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• 2002

$SiH_2Cl_2/H_2$ 기체혼합물을 원료로 사용하여 (100) Si 기판 위에 고온벽 화학기상증착법(hot-wall CVD)으로 에피 실리콘을 증착시켰다. 공정변수(증착온도, 반응기 압력, 입력 기체의 조성비($H_2/SiH_2Cl_2$)등)가 실리콘 증착에 미치는 영향을 조사하기 위해 열화학적 전산모사를 수행하였으며, 전산모사를 통해 얻은 공정조건의 범위를 바탕으로 실험한 결과, 전산모사의 결과와 실험이 잘 일치함을 알 수 있었다. 실험을 통해 얻은 최적 증착 조건은 증착온도가 850~$950^{\circ}C$, 반응기 압력은 2~5 Torr, $H_2/SiH_2Cl_2$비는 30~70 정도임을 알 수 있었고, 증착된 에피 실피콘은 두께 및 비저항의 균일도가 우수하고 불순물 함량이 낮은 양질의 박막임을 확인할 수 있었다.

• 한국결정성장학회지
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• 제12권2호
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• pp.101-109
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• 2002

Hot-wall CVD법으로 SiC/C 경사기능재료를 증착시키는 공정을 열역학적으로 해석하였다. Si-C-H-Cl계에 대한 열역학적 계산을 통해 공정변수(증착온도, 반응기 압력 원료 기체의 C/[Si+C]비와 H/[Si+C]비)가 증착층의 조성과 증착 수율에 미치는 영향을 조사하였고, 이를 통해 SiC/C 경사기능재료 증착에 있어서의 CVD 상평형도와 최적 공정 조건의 범위를 예측할 수 있었다.

• 대한기계학회논문집B
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• 제32권2호
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• pp.149-157
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• 2008

During CVD process of semiconductor wafer fabrication, maintaining the uniformity of temperature distribution at wafer top surface is one of the key factors affecting the quality of final products. Effect of contact conductance between wafer and hot plate on predicted temperature of wafer was investigated. The validity of opaque wafer assumption was also examined by comparing the predicted results with Discrete Ordinate solutions accounting for semitransparent radiative characteristics of silicon. As the contact conductance increases predicted wafer temperature increases and the differences between maximum and minimum temperatures within wafer and between wafer and hot plate top surface temperatures decrease. The opaque assumption always overpredicted the wafer temperature compared to semitransparent calculation. The influences of surrounding reactor inner wall temperature and hot plate configuration are then discussed.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1998년도 PROCEEDINGS OF THE 14TH KACG TECHNICAL MEETING AND THE 5TH KOREA-JAPAN EMGS (ELECTRONIC MATERIALS GROWTH SYMPOSIUM)
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• pp.173-176
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• 1998

Epitaxial Si layers were deposited on n- or p-type Si(100) substrates by hot-wall chemical vapor deposition (CVD) technique using the {{{{ {SiH }_{ 2} {Cl }_{2 } - {H }_{ 2} }}}}chemistry. Thermodynamic calculations if the Si-H-Cl system were carried out to predict the window of actual Si deposition procedd and to investigate the effects of process variables(i.e., the deposition temperature, the reactor pressure, and the source gas molar ratios) on the growth of epitaxial layers. The calculated optimum process conditions were applied to the actual growth runs, and the results were in good agreement with the calculation. The expermentally determined optimum process conditions were found to be the deposition temperature between 900 and 9$25^{\circ}C$, the reactor pressure between 2 and 5 Torr, and source gad molar ration({{{{ {H }_{2 }/ {SiH }_{ 2} {Cl }_{2 } }}}}) between 30 and 70, achieving high-quality epitaxial layers.

• 한국분말재료학회지
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• 제28권4호
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• pp.325-330
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• 2021

In this study, a ZnS film of 8-mm thickness was prepared on graphite using a hot-wall-type CVD technique. The ZnS thick film was then hot isostatically pressed under different pressures (125-205 MPa) in an argon atmosphere. The effects of pressure were systematically studied in terms of crystallographic orientation, grain size, density, and transmittance during the HIP process. X-ray diffraction pattern analysis revealed that the preferred (111) orientation was well developed after a pressure of 80 MPa was applied during the HIP process. A high transmittance of 61.8% in HIP-ZnS was obtained under the optimal conditions (1010℃, 205 MPa, 6 h) as compared with a range of approximately 10% for the CVD-ZnS thick film under a 550-nm wavelength. In addition, the main cause of the improvement in transmittance was determined to be the disappearance of the scattering factor due to grain growth and the increase in density.

• 열처리공학회지
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• 제7권2호
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• pp.129-138
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• 1994

The purpose of this study is to clarify the influence of the reaction temperature and $AlCl_3$ content on the aluminide coating formation on Ni-based superalloy IN713C in CVD process and to compare its throwing power with that of Pack Cementation process. Aluminide coating was formed by CVD in hot-wall stainless tube reactor from an $AlCl_3-H_2$ mixture in the temperature range $850{\sim}1050^{\circ}C$. At reaction temperature $850^{\circ}C$, the coating thickness and the content of aluminium at the surface were increased as $AlCl_3$ heating temperature was raised. At reaction temperature $1050^{\circ}C$, they were not influenced by the variation of $AlCl_3$ heating temperature. When $AlCl_3$ heating temperature was fixed $125^{\circ}C$, the phases of the coatings were varied from $Ni_2Al_3$ to Al-rich NiAl and to Ni-rich NiAl with the reaction temperature. Therefore, in this study the reaction temperature has been found to be a major factor in determining the phase formed in CVD process. The throwing power of CVD was superior to that of Pack Cementation.

• 한국결정학회:학술대회논문집
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• 한국결정학회 2007년도 추계학술연구발표회 및 정기총회
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• pp.41-41
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• 2007

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1997년도 Proceedings of the 12th KACG Technical Meeting and the 4th Korea-Japan EMGS (Electronic Materials Growth Symposium)
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• pp.7-11
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• 1997

SiC/C functionally gradient material (FGMs) were formed on graphite substrates by hot-wall chemical vapor deposition (CVD) technique using the SiCl$_4$-C$_3$H8-H$_2$ chemistry. Thermochemical equilibrium calculations were carried out to investigate the deposition process. The effect of process variables on the deposition yield and the SiC/C ratio in deposited layers was studied in detail. Calculated results showed a reasonable agreement with the experiment in a qualitative sense. SiC/C FGMs with excellent mechanical and thermal properties could be successfully formed on graphite substrates by carefully controlling the compositions in the deposited layers.