• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1025-1029
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• 2003

We studied the cross-sectional profiles of deformed thermoplastics in hot embossing process and compared with melt flow index for various embossing conditions such as embossing temperature, embossing pressure and initial thickness of the thermoplastics. The fastest embossing times for complete penetration of the cavities were obtained at temperature greater than $60^{\circ}C$ above glass transition temperature (Tg). When the melt flow index of polymer is low, the penetration ratio does not become large even if the embossing pressure increases. The complete occupation of the cavities was easier obtained with high melt flow index polymer than low melt flow index polymer at the same process condition. We believe these results can be very useful for optimizing nanostructured hot embossing also known nanoimprinting process conditions.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.5
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• pp.68-74
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• 2015

In the present work, a series of numerical calculations have been conducted on the cooling of a hot surface using an air/water mist jet. In some cooling processes, such as in the glass-tempering process, direct contact between the cold water drops and the hot surface should be avoided, because this may cause surface cracks due to the sharp temperature gradients. Thus, the main focus of this study is finding the appropriate operating conditions for maximum cooling without direct contact between the drops and the surface. A series of numerical experiments have been performed, and, at the same time, those results were compared with those of the previous experiments for verification purposes. The effects of droplet impinging velocity, hot plate temperature, and liquid loading ratio for mono-dispersed drops of various sizes were studied in detail.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1998.10a
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• pp.175-180
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• 1998

This paper describes evaluation of oxidation stability for diesel engine oils by Hot-tube oxidation tester at high temperature. Evaluation was rated by visual inspection of lacquer in capillary glass tube and TAN determination of used oil. Air, NO$_2$-air and SO$_2$-air mixed gases were used as oxidizing gas. One oil which has low oxidation stability is selected and reformulated by addition of some additives such as antioxidant, detergent and disperant to improve oxidation stability. As a results of reformulation, antioxidant and detergent was effective for improvement of high temperture oxidation stability on diesel engine oil.

• Journal of the Korean Ceramic Society
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• v.29 no.2
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• pp.143-151
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• 1992

Partially stabilized alpha-sialon composition (X=0.1) powder was hot-pressed at 1800~200$0^{\circ}C$ for 0~90 min with 30 MPa. Sintering behavior, phase changes and mechanical properties for the specimens were studied. As sintering temperature was raised from 1800 to 190$0^{\circ}C$, the relative density tended to increase and reached 99% of theoretical at 190$0^{\circ}C$. However the amount of alpha-sialon decreased because alpha-sialon transformed to beta-Si3N4 and yttrium rich silicate glass. In the case of hot-pressing at 190$0^{\circ}C$ for various times, densification increased with sintering time and full densification above 99% of theoretical was attained by 30 min. The amount of alpha-sialon decreased with sintering time. The maximum strength of 825 MPa was obtained by hot-pressing at 190$0^{\circ}C$ for 60 min.

• Journal of Powder Materials
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• v.9 no.6
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• pp.394-408
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• 2002

Nanostructured high strength metastable Al-, Mg- and Ti-based alloys containing different amorphous, quasicrystalline and nanocrystalline phases are synthesized by non-equilibrium processing techniques. Such alloys can be prepared by quenching from the melt or by powder metallurgy techniques. This paper focuses on one hand on mechanically alloyed and ball milled powders containing different volume fractions of amorphous or nano-(quasi)crystalline phases, consolidated bulk specimens and, on the other hand. on cast specimens containing different constituent phases with different length-scale. As one example. $Mg_{55}Y_{15}Cu_{30}$- based metallic glass matrix composites are produced by mechanical alloying of elemental powder mixtures containing up to 30 vol.% $Y_2O_3$ particles. The comparison with the particle-free metallic glass reveals that the nanosized second phase oxide particles do not significantly affect the glass-forming ability upon mechanical alloying despite some limited particle dissolution. A supercooled liquid region with an extension of about 50 K can be maintained in the presence of the oxides. The distinct viscosity decrease in the supercooled liquid regime allows to consolidate the powders into bulk samples by uniaxial hot pressing. The $Y_2O_3$ additions increase the mechanical strength of the composites compared to the $Mg_{55}Y_{15}Cu_{30}$ metallic glass. The second example deals with Al-Mn-Ce and Al-Cu-Fe composites with quasicrystalline particles as reinforcements, which are prepared by quenching from the melt and by powder metallurgy. $Al_{98-x}Mn_xCe_2$ (x =5,6,7) melt-spun ribbons containing a major quasicrystalline phase coexisting with an Al-matrix on a nanometer scale are pulverized by ball milling. The powders are consolidated by hot extrusion. Grain growth during consolidation causes the formation of a micrometer-scale microstructure. Mechanical alloying of $Al_{63}Cu_{25}Fe_{12}$ leads to single-phase quasicrystalline powders. which are blended with different volume fractions of pure Al-powder and hot extruded forming $Al_{100-x}$$(Al_{0.63}Cu_{0.25}Fe_{0.12})_x$ (x = 40,50,60,80) micrometer-scale composites. Compression test data reveal a high yield strength of ${\sigma}_y{\geq}$700 MPa and a ductility of ${\varepsilon}_{pl}{\geq}$5% for than the Al-Mn-Ce bulk samples. The strength level of the Al-Cu-Fe alloys is ${\sigma}_y{\leq}$550 MPa significantly lower. By the addition of different amounts of aluminum, the mechanical properties can be tuned to a wide range. Finally, a bulk metallic glass-forming Ti-Cu-Ni-Sn alloy with in situ formed composite microstructure prepared by both centrifugal and injection casting presents more than 6% plastic strain under compressive stress at room temperature. The in situ formed composite contains dendritic hcp Ti solid solution precipitates and a few $Ti_3Sn,\;{\beta}$-(Cu, Sn) grains dispersed in a glassy matrix. The composite micro- structure can avoid the development of the highly localized shear bands typical for the room temperature defor-mation of monolithic glasses. Instead, widely developed shear bands with evident protuberance are observed. resulting in significant yielding and homogeneous plastic deformation over the entire sample.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.3
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• pp.199-203
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• 2017

Hot embossing techniques are used to engrave patterns on plastic substrates. Roll based hot embossing uses a heated roll for a continuous process. A heated roll with relief patterns is impressed on a preheated plastic substrate. Then, the substrate is cooled down quickly to prevent thermal shrinkage. The roll speed is normally very slow to ensure substrate temperature increase up to the glass transition temperature. In this paper, we propose a noncontact preheating technique using focused infrared light. The infrared light is focused as a line beam on a plastic substrate using an elliptical mirror just before entering the hot embossing roll. The mid range infrared light efficiently raises the substrate temperature. For preliminary tests, substrate deformation and temperature changes were monitored according to substrate speed. The experiments show that the proposed technique is a good possibility for high speed hot embossing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.66-69
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• 2002

This paper presents deposition and characterizations of microcrystalline silicon$({\mu}c-Si:H)$ films prepared by hot wire chemical vapor deposition at substrate temperature below $300^{\circ}C$. The $SiH_{4}$ concentration$[F(SiH_{4})/F(SiH_{4})+F(H_{2})]$ is critical parameter for the formation of Si films with microcrystalline phase. At 6% of silane concentration, deposited intrinsic ${\mu}c-Si:H$ films shows sufficiently low dark conductivity and high photo sensitivity for solar cell applications. P-type ${\mu}c-Si:H$ films deposited by Hot-Wire CVD also shows good electrical properties by varying the rate of $B_{2}H_{6}$ to $SiH_{4}$ gas. The solar cells with structure of Al/nip ${\mu}c-Si:H$/TCO/glass was fabricated with single chamber Hot-Wire CVD. About 3% solar efficiency was obtained and applicability of HWCVD for thin film solar cells was proven in this research.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.228-232
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• 2003

Mircolens and microlens arrays are realized using a novel fabrication technology based on the exposure of a resist, usually PMMA, to deep X-rays and subsequent thermal treatment. Hot embossing process is also studied for mass production. The fabrication technology is very simple and produces microlenses and microlens arrays with good surface roughness of several nm. The molecular weight and glass transition temperature of PMMA is reduced when it is irradiated with deep X-rays. The microlenses were produced through the effects of volume change, surface tension. and reflow during thermal treatment of irradiated PMMA. A hot embossing machine is designed and manufactured with a servo motor transfer system. The hot embossing process follows the steps of heating mold to the desired temperature, embossing a mold insert on substrate. cooling mold to the de-embossing temperature. and de-embossing. Microlenses were produced with diameters ranging from 30 to 1500 ${\mu}{\textrm}{m}$. The surface X-ray mask is also fabricated to realize microlens arrays on PMMA sheet with a large area.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.11
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• pp.3706-3713
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• 1996

A numerical study on natural convection induced by free surface heat flux and cold left and hot right walls in glass melting furnaces has been performed. A function of heat flux derived from the combustion environments of actual glass melting furnace is applied to thermal boundary condition at free surface. Fundamentally there exist two flow cells in cavity (left counterclockwise one and right clockwise one). The effects of heat flux and Rayleigh number are investigated through two-dimensional steady-state assumption. The convection strength of two flow cell located in left region continuously increases. In the mean time the strength of flow cell in right region increases and then decreases. Critical Rayleigh number in which two flow cells take place above and below show linear dependence on the free surface heat flux. To maintain the traditional flow pattern (left and right flow cells) in glass melting furnace, Rayleigh number is recommended to be below 10$^{5}$ .