• Korean Journal of Optics and Photonics
• /
• v.18 no.6
• /
• pp.383-388
• /
• 2007

A color filter was demonstrated incorporating a patterned metal grating in a quartz substrate. The filter is created in a metal layer perforated with a symmetric two-dimensional array of circular holes, with the pitch smaller than the wavelength of the visible light. A finite-difference time-domain simulation was performed to analyze the device by investigating the effect of structural parameters like the grating height, the period, the hole size, and the refractive index of the hole-filling material on its performance. The device performance was especially optimized by controlling the refractive index of the material comprising the holes of the grating. And two different devices were fabricated by means of the e-beam direct writing with the following design parameters: the grating height of 50 nm, the two pitches of 340 nm for the red color and 260 nm for the green color. For the prepared device with the period of 340 nm, the center wavelength was 680 nm and the peak transmission 57%. And for the other device with the pitch of 260 nm, the center wavelength was 550 nm and the peak transmission was 50%. The filling of the hole with a material whose refractive index is matched to that of the substrate has led to an increase of ${\sim}15%$ in the transmission efficiency.

• Proceedings of the KWS Conference
• /
• 2010.05a
• /
• pp.75-75
• /
• 2010

3D 패키징 기술은 전기소자의 소형화, 고용량화, 저전력화, 높은 신뢰성등의 요구와 함께 그 중요성이 대두대고 있다. 이러한 3D 패키징의 연결방법은 와이어 본딩 또는 플립칩등의 기존의 방법에서 TSV(Through Silicon Via)를 이용하여 적층하는 방법이 주목받고 있다. TSV는 기존의 와이어 본딩과 비교하여 고집적도, 빠른 신호전달, 낮은 전력소비 등의 장점을 가지고 있어 많은 연구가 진행되고 있다. TSV의 세부 공정 중 비아필링(Via filling)기술은 I/O수 증가와 미세피치화에 따른 비아(Via) 직경의 감소 및 종횡비(Via Aspect Ratio)증가로 인해 기존 필링 공정으로는 한계가 있다. 기존의 비아 홀(Via hole)에 금속을 필링하기 위한 방법으로 전기도금법이 많이 사용되고 있으나, 전기도금법은 전기도금액 조성, 첨가제의 종류, 전류밀도, 전류모드 등에 따라 결과물에 큰 차이가 발생되어, 최적공정조건의 도출이 어렵다. 또한 20um이하의 비아직경과 높은 종횡비로 인하여 충진시 void형성등의 문제점이 발생하기도 한다. 본 연구에서는 용융솔더와 진공을 이용하여 비아를 필링시켰다. 이 방법은 관통된 비아가 형성된 웨이퍼 양단에 압력차를 주어, 작은 직경을 갖는 비아 홀의 표면장력을 극복하고, 용융상태의 솔더가 관통된 비아 홀 내부로 필링되는 방법이다. 관통 비아홀이 형성 된 웨이퍼 위에 솔더페이스트를 $250^{\circ}C$이상 온도를 가해 용융상태로 만든 후 웨이퍼 하부에 진공을 형성하여 필링하는 방법과 용융솔더를 노즐을 통하여 위쪽으로 유동시켜 그 위에 비아홀이 형성된 웨이퍼를 접촉하고 웨이퍼 상부에 진공을 형성하여 필링하는 방법으로 실험을 각각 실시하였다. 이 때, 웨이퍼 두께는 100um이하이며 홀 직경은 20, 30um, 웨이퍼 상부와 하부의 진공차는 약 0.02~0.08Mpa, 진공 유지시간은 1~3s로 실시하여 최적 조건을 고찰하였다. 각 조건에 따른 필링 후 단면을 전자현미경(FE-SEM)을 통해 관찰하였다. 실험 결과 0.04Mpa 이상에서 1s내의 시간에 모든 비아홀이 기공(Void)없이 완벽하게 필링되는 것을 관찰하였으며 이 결과는 기존의 방법에 비하여 공정시간을 감소시켜 생산성이 대폭 향상 될 수 있는 방법임을 확인하였다.

• KOREAN JOURNAL OF CROP SCIENCE
• /
• v.27 no.3
• /
• pp.283-288
• /
• 1982

This experiment was carried out to improve the cultural practices of seedlings and to investigate the proper planting density in aromatic tobacco, Sohang. Two different cultural practices of seedling were employed; Temporary transplanting (TT; Conventional practices) and non temporary transplanting (N.T.). Vinyl pot sizes were $3.5cm{\times}3.5cm, \;4cm{\times}4cm$ and $5cm{\times}5cm$ Plants per hole were 1, 3, 5, 7 and 9. There were little difference among the vinyl pot sizes in all characters except the survival ratio. But it may be little problem on cultural practices by 7 plants per hole in $5cm\times$5cm vinyl pot. There were not significant in price per kg, yield per 10a and value per 10a between two cultural practices of seedlings and among three pot sizes. Mildness and filling power were increased by increasing the plants per hole. Combustibility of 5-9 plants were better than those of 1-3 plants per hole. The growing of 6 seedlings per hole in $5cm\times$5cm vinyl pot by non temporary transplanting resulted the best cultural practices for an aromatic tobacco, Sohyang.

• Korea-Australia Rheology Journal
• /
• v.19 no.4
• /
• pp.183-190
• /
• 2007

Injection molding is one of the most common operations in polymer processing. Good quality products are usually obtained and major post-processing treatment is not required. However, residual stresses which exist in plastic parts affect the final shape and mechanical properties after ejection. Residual stresses are caused by polymer melt flow, pressure distribution, non-uniform temperature field, and density distribution. Residual stresses are predicted in this study by numerical methods using commercially available softwares, $Hypermesh^{TM},\;Moldflow^{TM}\;and\;ABAQUS^{TM}$. Cavity filling, packing, and cooling stages are simulated to predict residual stress field right after ejection by assuming an isotropic elastic solid. Thermo-viscoelastic stress analysis is carried out to predict deformation and residual stress distribution after annealing of the part. Residual stresses are measured by the hole drilling method because the automotive part selected in this study has a complex shape. Residual stress distribution predicted by the thermal stress analysis is compared with the measurement results obtained by the hole drilling method. The molded specimen has residual stress distribution in tension, compression, and tension from the surface to the center of the part. Viscoelastic deformation of the part is predicted during annealing and the deformed geometry is compared with that measured by a three dimensional scanner. The viscoelastic stress analysis with a thermal cycle will enable us to predict long term behavior of the injection molded polymeric parts.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.5
• /
• pp.388-396
• /
• 2010

In this study, we propose characteristics improvement methods according to via hole plating method for FBAR Duplexer with bandwidth($T_x4: 1850 MHz ~ 1910 MHz, $R_x$:1930 MHz ~ 1990 MHz) which is used for wireless systems. Also, we designed and fabricated $3.8{\times}3.8{\times}1.8mm$ size microminiature FBAR Duplexer based on this proposal. First of all, in this study, we fabricated pentagon shape resonators by different size to make filter combination, and their quality factor(Q) are 687 with 6.6% of ${k_{eff}}^2$. Using this resonators, we designed $3{\times}2$ Type $T_x$ filter and $3{\times}4$ Type $R_x$ filter. The transmission line, which works as phase shifter, is designed with 210 ${\mu}m$ in width and 18 mm in length Stripline type. Inductor, which is used for matching component, is designed with width of 75 ${\mu}m$, a technically achievable minimum width. And adopted plating method of filling via hole with conductive epoxy for improved grounding and thermal conductivity. Using these configuration with all of the matching component values, we found Duplexer characteristics of -1.57 dB ~ -1.73 dB in insertion loss, -56 dB in attenuation at 1850 MHz ~ 1910 MHz of $T_x$ band. Also, found -2.71 dB ~ -3.23 dB in insertion loss, -58 dB in attenuation at 1930 MHz ~ 1990 MHz of $R_x$ band.

• Journal of the Korean Electrochemical Society
• /
• v.2 no.4
• /
• pp.237-241
• /
• 1999

The characteristics of copper thin films and via hole filling capability were investigated by pulsed electrodeposition method. Especially, the effects of additives on the properties of copper thin films were studied. Copper films, which were deposited by pulsed electrodeposition using commercial additives, had low tensile stress value under 83.4 MPa and high preferred Cu (111) texture. Via holes with $0.25{\mu}m$ in diameter and 6 : 1 aspect ratio were successfully filled without any defects by superfilling. It was observed that copper microstructure deformed by twining. After heat treatment at $500^{\circ}C$ for 1 k in vacuum furnace, grain size was 1 or 2 times as large as film thickness and the bamboo structure was formed. Heat treated copper films showed good resistivities of $1.8\~2.0{\mu}{\Omega}{\cdot}cm$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2003.10a
• /
• pp.201-206
• /
• 2003

Plastic injection mould have two kinds of trouble, one is in mould another in injection parts. Most of defects of the former take the cause in a design like in structure and working, the later weld line, transforming, sink mark, burning, flow mark, scratching, shading, black hole and so on. Most of problems of the later is difficult for making a clear definitely the reason of defects because of complexible. The purpose of this paper is to improve the quality of plastic injection mould and parts with inquiring the counter plan and rouble of the part of Flat TV Front Cover by flow control method and gas- assisted injection moulding. For minimizing defects from injection moulding parts, this paper was investigated with using computer aided injection mold filling simulations. Based on these numerical results, I established guidelines mould design and injection processing condition. As a results I got the improve of quality, minimizing surface defects moulded parts and troubles in mould.

• Proceedings of the Korean Society of Broadcast Engineers Conference
• /
• 2011.07a
• /
• pp.517-519
• /
• 2011

본 논문에서는 DIBR(Depth image-based rendering)을 통해 생성되는 3D 영상의 홀을 고품질로 채우는 방법을 제안한다. 이를 위해, 생성된 영상의 깊이도를 고려한 희소성(Sparsity) 기반의 인페인팅 알고리즘을 홀 채우기에 적용하였다. 본 논문에서 제안하는 알고리즘은 홀 주변의 전경 텍스쳐를 제외한 배경 텍스쳐 정보만을 이용하기 때문에, 홀 채우기 시 전경 텍스쳐와 배경 텍스쳐가 혼합되는 문제점이 발생하지 않는다. 또한 희소성 기반의 인페인팅을 이용하기 때문에 에지 정보를 활용한 고품질의 홀 채우기가 가능하다. 본 논문에서 제안하는 알고리즘과 기존의 홀 채우기 알고리즘과의 주관적 화질 비교 결과, 본 논문에서 제안하는 알고리즘의 우수성을 확인할 수 있었다.

• Proceedings of the KAIS Fall Conference
• /
• 2012.05b
• /
• pp.531-534
• /
• 2012

본 논문에서는 Active Contour 기반의 영역 분할에서 이미지의 초점값을 이용하여 분할된 영역 사이의 경계를 생성하여 기존의 Active Contour에서 발생할 수 있는 중첩 객체의 동일 객체 인식을 방지하는 기법을 제안한다. Active Contour는 영상에서 객체의 윤곽을 검출하여 윤곽을 기준으로 영상을 분할하지만 중첩되거나 근접한 객체에서의 분할이 정확하게 이루어지지 않아 동일 객체로 인식하는 단점이 있다. 이러한 객체에서의 분할을 위해 영상의 초점값을 이용하여 영상 내에 존재하는 객체의 유사 경계 영역을 생성하고 Active Contour의 결과에 적용하여 경계를 생성한 뒤 초점값 적용으로 인해 생성될 수 있는 홀 영역을 hole filling 과정을 수행하여 보완함으로써 보다 정확한 객체를 추출하였다.

• Proceedings of the Korean Information Science Society Conference
• /
• 2011.06a
• /
• pp.442-445
• /
• 2011

본 논문에서는 3차원 head-tracked 디스플레이를 이용하여 스테레오 영상을 리타겟팅 하는 방법을 제안한다. 제안한 방법은 카메라 간격을 조절함으로써 사용자 시점에 맞는 스테레오 영상을 제공한다. 특히 중간 시점 영상 생성 시 발생하는 비폐색 영역에 대해 스테레오 일관성을 고려한 홀 필링(hole filling)을 적용하여 보다 편안하고, 개인별로 최적화 된 입체감 및 깊이감을 제공하도록 한다. 제안한 방법을 검증하기 위해 3차원 그래픽 모델을 이용해 결과 영상을 비교하였으며, 사용성 테스트를 통해 리타겟팅 된 스테레오 영상이 사용자가 입체영상을 인지하는데 미치는 효과를 확인하였다.