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A Study on Improvement of FBAR Duplexer for Wireless Systems

무선 시스템용 FBAR 듀플렉서 특성 개선 연구

  • 이은규 (동아대학교 산학협력단 컨테이너 안전수송기술 개발 클러스터사업단) ;
  • 최형림 (동아대학교 산학협력단 컨테이너 안전수송기술 개발 클러스터사업단)
  • Published : 2010.05.01

Abstract

In this study, we propose characteristics improvement methods according to via hole plating method for FBAR Duplexer with bandwidth($T_x4: 1850 MHz ~ 1910 MHz, $R_x$:1930 MHz ~ 1990 MHz) which is used for wireless systems. Also, we designed and fabricated $3.8{\times}3.8{\times}1.8mm$ size microminiature FBAR Duplexer based on this proposal. First of all, in this study, we fabricated pentagon shape resonators by different size to make filter combination, and their quality factor(Q) are 687 with 6.6% of ${k_{eff}}^2$. Using this resonators, we designed $3{\times}2$ Type $T_x$ filter and $3{\times}4$ Type $R_x$ filter. The transmission line, which works as phase shifter, is designed with 210 ${\mu}m$ in width and 18 mm in length Stripline type. Inductor, which is used for matching component, is designed with width of 75 ${\mu}m$, a technically achievable minimum width. And adopted plating method of filling via hole with conductive epoxy for improved grounding and thermal conductivity. Using these configuration with all of the matching component values, we found Duplexer characteristics of -1.57 dB ~ -1.73 dB in insertion loss, -56 dB in attenuation at 1850 MHz ~ 1910 MHz of $T_x$ band. Also, found -2.71 dB ~ -3.23 dB in insertion loss, -58 dB in attenuation at 1930 MHz ~ 1990 MHz of $R_x$ band.

Keywords

References

  1. J.-H. Kim, S.-H. Lee, J.-H. Ahn, and J.-K. Lee, J. Ceram. Process. Res. 3, 25 (2002).
  2. R. Ruby, P. Bradley, J. Larson, Y. Oshmyansky, andD. Figueredo, IEEE International Solid-State Circuits Conference (IEEE, Piscataway, NJ, 2001) p. 120.
  3. H.-S. Park, J. Lee, J. Shin, J. Kwon, S. Sul, D.-H. Kim, K.-J. Shin, M.-K. Gu, and I. Song, 36th European Microwave Conference (IEEE, Manchester,2006) p. 1281.
  4. O. Menendez, P. de Paco, R. Villarino, and J. Parron,IEEE Microw. Wirel. Co. Lett. 16, 657 (2006). https://doi.org/10.1109/LMWC.2006.885610
  5. Y. H. Chee, A. M. Niknejad, and J. M. Rabaey, IEEE J. Solid-State Circuits 41, 1740 (2006). https://doi.org/10.1109/JSSC.2006.877254
  6. T. Yokoyama, T. Nishihara, S. Taniguchi, M. Iwaki, and Y. Satoh, IEEE Ultra. Sym. (IEEE, Puerto Rico, 2004) p. 429.
  7. B. Ha, I. Song, Y.-K. Park, D.-H. Kim, W. Kim, K. Nam, and J. Pak, Sens. Actuators, A 130–131, 247 (2006). https://doi.org/10.1016/j.sna.2006.02.011
  8. C. H. Tai, T. K. Shing, Y. D. Lee, and C. C. Tien,Tamkang J. Sci. Eng. 7, 67 (2004).