• Title/Summary/Keyword: Hole Expansion

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Structural Durability Analysis due to Hole Configuration Variation of Bike Disc Brake (자전거 디스크 브레이크 구멍 형상 변화에 따른 구조적 내구성 해석)

  • Han, Moonsik;Cho, Jaeung
    • Transactions of the Korean Society of Automotive Engineers
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    • v.22 no.5
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    • pp.44-49
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    • 2014
  • As expansion and contraction of bike disk brake are happened continuously by temperature at repeated urgent braking. In this study, 3 kinds of model are designed according to configurations of holes and thermal durabilities on bike disk brake are investigated by comparing 3 models through temperature and thermal analyses. Maximum thermal stress happened at the disk contacted with pad and the connection part fixing disk rotor. Instead of initial state, the temperature is uniformly distributed at transient state. As the area of hole at disk rotor face becomes wider, thermal stress becomes lower at the initial state. On the other hand, in case the number of holes increases, thermal stress becomes lower at the elapsed time of 100 seconds. The thermal durability of bike disk brake can be improved by applying this study result with configurations of holes.

The Use of Compliance to Investigate Fatigue Crack Retardation by Cover Plates and Stop Hole Expansion (컴프라이언스를 이용한 보강판재와 균열선단 구멍확장의 피로균열 진전 지연효과 규명)

  • 한문식
    • Transactions of the Korean Society of Automotive Engineers
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    • v.9 no.4
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    • pp.204-213
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    • 2001
  • This paper develops the compliance approach to the problem of load sharing between a cracked plate and a cover plate used to bridge the crack. The theory is validated by using calculated stress intensity factors for the covered and uncovered cases and by using stop hole method to reduce experimentally observed growth rates to a common base. Calculations are then made on the effect of cover plate width on fatigue crack retardation in order to demonstrate the predictive capability of the technique.

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Mechanical Reliability Issues of Copper Via Hole in MEMS Packaging (MEMS 패키징에서 구리 Via 홀의 기계적 신뢰성에 관한 연구)

  • Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.2
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    • pp.29-36
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    • 2008
  • In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

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Electroreflectance Study of ZnSe in ZnSe/GaAs Heterostructure (ZnSe/GaAs 이종접합 구조에서 ZnSe의 Electroreflectance 연구)

  • Jo, Hyun-Jun;Bae, In-Ho
    • Journal of the Korean Vacuum Society
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    • v.21 no.6
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    • pp.322-327
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    • 2012
  • The strain effects of ZnSe epilayer on ZnSe/GaAs heterojunction structure grown by molecular beam epitaxy have been investigated by using electroreflectance (ER) spectroscopy. The ER measurements were performed as a function of modulation voltage, dc bias voltage, and temperature. From the room temperature ER spectrum, we observed a heavy-hole (HH: 2.609 eV) and light-hole (LH: 2.628 eV) transitions due to a compressive strain. With increasing the bias voltage, the amplitude of HH transition signal decreased and the amplitude of LH transition signal was almost the same. From the temperature dependence of ER spectra, we have studied the interaction between the strain and the thermal expansion coefficient.

Stress Analysis of Steam Generator Row-1 Tubes (증기발생기 제1열 전열관의 응력 해석)

  • Kim, Woo-Gon;Ryu, Woo-Seog;Lee, Ho-Jin;Kim, Sung-Chung
    • Proceedings of the KSME Conference
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    • 2000.04a
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    • pp.25-30
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    • 2000
  • Residual stresses induced in U-bending and tube-to-tubesheet joining processes of PWR's steam generator row-1 tube were measured by X-ray method and Hole-Drilling Method(HDM). The stresses resulting from the Internal pressure and the temperature gradient in the steam generator were also estimated theoretically. In U-bent lesions, the residual stresses at extrados were induced with compressive stress(-), and its maximum value reached -319 MPa in axial direction at ${\psi}=0^{\circ}$ in position. Maximum tensile residual stress of 170MPa was found to be at the flank side at Position of${\psi}=90^{\circ}$, i.e., at apex region. In tube-to-tubesheet fouling methods, the residual stresses induced by the explosive joint method were found to be lower than that by the mechanical roll method. The gradient of residual stress along the expanded tube was highest at the. transition region, and the residual stress in circumferential direction was found to be higher than the residual stress in axial direction. Hoop stress due to an internal pressure between primary and secondary side was analyzed to be 76 MPa and thermal stress was 45 MPa.

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Effect of cold-spray deposition on deformation of aluminum alloy substrate (초음속 저온분사법에 의한 알루미늄 분말 적층에서 얇은 모재에 발생하는 변형에 대한 연구)

  • Lee Jae-Chul;Chun Doo-Man;Kim Sung-Geun;Ahn Sung-Hoon
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.99-100
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    • 2006
  • Cold gas dynamic spray or cold-spray is a deposition process, which causes deformation of a thin substrate. The deformation is usually convex to the deposited side. In this research, the main cause of the deformation was investigated using 6061-T6 aluminum alloy. The effects or anisotropic coefficient or thermal expansion (CTE) or the deposited layer by cold-spray and residual stress were studied by experiments and finite element analysis. The Hole Drilling method was applied to measure residual stress in the cold-spray layer and substrate. The data obtained by the experiments were used for the analysis of substrate deformation. From the result of the analysis, it was concluded that compressive residual stress was the main reason of substrate deformation while CTE had little effect.

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Effects of Bainitic Transformation Temperature and Stress State on the Formability of C-Mn-Si TRIP Steels (C-Mn-Si계 변태유기소성강의 성형성에 미치는 베이나이트 변태온도 및 응력상태의 영향)

  • Jun H. S.;Oh J. H.;Park C. G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2001.05a
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    • pp.156-160
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    • 2001
  • The effects of TRansformation Induced Plasticity(TRIP) phenomena on the plastic deformation of 0.2C-1.5Si-1.5Mn multiphase steels have been investigated at various heat treatment and stress conditions. In order to estimate the formability, the hole expansion(HE) tests and the tensile tests were carried out. The formability evaluated from the uni-axial tensile tests was quite different from the formability measured from multi-axial HE-tests. Consequently, the formability in the multi-axial stress state decreased due to the extinction of the retained austenite relatively at earlier deformation stage and the production of irregular α' martensite. However, the defects of TRIP-steels were initiated exactly at the boundary between transformed martensite and ferrite matrix regardless of stress state. In addition, new experimental formula is proposed in order to predict the multi-axial formability of the TRIP steels from the results of uniaxial tensile test.

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Structural Analysis of Thermal Expansion of Aluminum Alloy Gearbox Case of High Speed Train (고속전철용 알루미늄합금 감속기 케이스의 열변형에 대한 구조해석)

  • 최진욱;민일홍;김완두;박순원;임영식
    • Proceedings of the KSR Conference
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    • 1999.11a
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    • pp.181-188
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    • 1999
  • For weight reduction of the gearbox of power bogie of high speed train, aluminum alloy is recommended for the material of the gerabox case. In this paper, three models(Steel G/B Case-Steel BRG. Case[model-S], Aluminum G/B Case-Aluminum BRG. Case[model-A], Aluminum G/B Case-Steel BRG. Case[model-AS]) were compared to each other in the view of thermal expansion. The evaluation of the internal load, thermal expansion deformation and lug analysis were executed. It results that the 'model-A' is excessively deformed and fail in the bolt hole of bearing case. Material change of the bearing case to steel(model-AS) is effective to restrain the deformation of the inner radios of the bearing case and to prevent the failure of that.

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Detection of the Defect on the Metal Surface Using the Modulated Microwave (변조 고주파에 의한 금속표면 결함 검출)

  • Joo, G.T.;Jung, S.H.;Song, K.Y.;Kim, J.O.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.19 no.3
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    • pp.173-179
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    • 1999
  • The defects on the metal surface. such as the ended circular pressed hole. the penetrated circular drilled hole, and the linear hollow lanes have been investigated by means of the microwave. In this experiment, frequency was set at 9.2GHz with 3kHz modulation, and the methods of reflection, transmission, fixed carrier frequency, and mod-demodulated technique have been used for investigating defects. The magnitudes of the microwave signals have been changed at the ended circular pressed hole and the penetrated circular drilled hole. The defect sizes that were estimated from the reflected microwave signals had the dimensions enlarged by twice the original size of the penetrated circular drilled hole and 2.5 times the original size of the ended circular pressed hole. The magnitudes of the reflected microwave signals from the linear hollow lane have increased with expansion of the width of the notch. In the linear hollow lane with the depth of 2.4mm, the reflected microwave signals versus the defect widths had a maximum value at the defect width of 50mm, and in the linear hollow lanes with the depths of 1.2mm and 0.45mm, the reflected microwave signals versus the defects widths had the maximum values each at the defect depths of 55mm.

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Effect of Filled Hole on Strength Behavior of CFRP Composites at Cold Temperature Dry and Elevated Temperature Wet (저온건조($-55^{\circ}C$) 및 고온다습 조건($108.3^{\circ}C$)의 기계적 체결 홀이 탄소섬유강화 복합재의 강도 특성에 미치는 영향 연구)

  • Kim, Hyo-Jin
    • Composites Research
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    • v.22 no.3
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    • pp.82-88
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    • 2009
  • The effect of open and filled holes on the strength behavior of carbon fiber reinforced polymeric (CFRP) composites was investigated. The strength was measured at room temperature dry, cold temperature dry, $-55^{\circ}C$, and elevated temperature wet, $108.3^{\circ}C$ on several different laminate configurations. Based on the experimental data presented, it is shown that the filled hole tensile strength is larger than that of open hole by reducing damage around the hole due to the constraint imposed by the fastener. The tensile strength at cold temperature dry, $-55^{\circ}C$ is increased with the brittleness by the thermal expansion coefficient of fiber and matrix. The compressive strength at elevated temperature wet, $108.3^{\circ}C$ is decreased by the cause of interfacial deterioration between fiber and matrix with moisture absorption.