• Journal of Institute of Control, Robotics and Systems
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• v.7 no.5
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• pp.399-406
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• 2001

This paper presents a dynamic modeling and a sliding mode controller for the high-speed/high-accuracy position control system. The selected target system is the wire bonder assembly which is used in the semiconductor assembly process. This system is a reciprocating one around the pivot point that consists of VCM(voice coil motor) as an actuator and transducer horn as a bonding tool. For the modeling elements, the sys-tem is divided into electrical circuit, magnetic circuit and mechanical system. Each system is modeled using the bond graph method and united into the full system. Two major aims are considered in the design of the controller. The first one is that the horn must track the given reference trajectory. The second one is that the controller must be realizable by using the DSP board. Computer simulation and experimental results show that the designed sliding mode controller provides better performance than the PID controller.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.10a
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• pp.83-89
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• 2000

This paper presents a dynamic modeling and a sliding mode controller for the high-speed / high-accuracy position control system. Selected target system is the wire bonder head assembly which is used in semiconductor assembly process. This system is a reciprocating one around the pivot point that consists of VCM(voice coil motor) as a actuator and transducer horn as a bonding tool. For the modeling elements, the system is divided into electrical circuit, magnetic circuit and mechanical system. Each system is modeled by using the bond graph method and united into the full system. Two major aims are considered in the design of the controller. The first one is that the horn must track the given reference trajectory. The second one is that the controller must be realizable by using the DSP board. Computer simulation and experimental results show that the designed sliding mode controller provides better performance than the PID controller.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.521-527
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• 2002

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For the modeling elements, the system is divided into electrical system, magnetic system, and mechanical system. Each system is modeled by using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to evaluate the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Computer simulations and experimental results show that the designed PID controller provides more improved signal to noise ratio and reduced sensitivity than the conventional PID controller.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.149-154
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• 2002

In a high speed spindle system, it is very important to monitor the state of rotating rotor. Particularly in active control spindle system, the position sensor must provide feedback to the control system on the exact position of the rotor. In order to monitor the state of a high speed spindle exactly, high accuracy and wide frequency bandwidth of sensors are important. This paper observes the factors which has an effect on dynamic performances of inductive position sensor.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.65-68
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• 2002

In a high speed spindle system, it is very important to monitor the state of rotating rotor. Particularly in active control spindle system, the position sensor must provide feedback to the control system on the exact position of the rotor. In order to monitor the state of a high speed spindle exactly, High accuracy and wide frequency bandwidth of sensors are important. This paper describes the factors which has an effect on performances of inductive position sensor. We also report the experimental results that characterize the performances of the inductive position sensor.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.118-122
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• 2000

Recently, High accuracy and precision are required in various industrial field especially, semiconductor manufacturing apparatus, Ultra precision positioning apparatus, Information field and so on. Positioning technology is a very important one among them. For composition of this technology, the development of system with high speed and high resolution is needed. At start point and end position vibration must be repressed on this system for composition of position control. This vibration is arisen nose, is increased setting time, is reduced accuracy. Especially, repressed for the lead with high speed. The small actuator with high speed and high resolution is need to repression against this residual vibration. This actuator is, for example, piezo actuator, piezoelectric material that converting from electronic signal to mechanical force is adequate material, beacause of control of control to position and force. In this study, piezo electric material is used to actuator, ultra precision positioning apparatus with stage of hinge structure is designed, simulation is performed, control performance is tested by producing apparatus. For easy usage and stability in industrial field, we perform to simulation and to position control test by digital PID controller.

• Proceedings of the KSME Conference
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• 2001.06b
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• pp.747-753
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• 2001

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For the modeling elements, the system is divided into electrical system, magnetic system, and mechanical system. Each system is modeled by using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to evaluate the more robust PID gain combinations. This study makes use of an L18 array with three parameters varied on three levels. Computer simulations and experimental results show that the designed PID controller provides more improved signal to noise ratio and reduced sensitivity than the conventional PID controller.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.987-992
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• 2000

In a high speed spindle system, it is very important to monitor the operation of the spindle to prevent catastrophic damage to the system. Widely used sensors for monitoring are eddy-current and capacitive types. These sensors provide high accuracy of monitoring, but their steep prices lead to expensive high speed spindle systems. The main goal of our research is to develop technology for producing high speed spindle system utilizing magnetic bearings. As active magnetic bearings require position sensors for feedback control, a noncontact position sensor is being developed as a part of this main goal. Once developed, it will contribute to affordable high speed spindle system. This paper describes the selection process of the sensor types and the design of the driving circuit. We also report the experimental results that characterize the static and dynamic performances of the inductive sensor.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.10a
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• pp.32-37
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• 2000

In a high speed spindle system, it is very important to monitor the operation of the spindle to prevent catastrophic damage to the system. Widely used sensors for monitoring are eddy-current and capacitive types. These sensors provide high accuracy of monitoring, but their steep prices lead to expensive high speed spindle system. The main god of our research is to develop technology to produce high speed spindle system utilizing magnetic bearings. As active magnetic bearings require position sensors for feedback control, a noncontact position sensor is bang developed as a part of this main goal. Once developed, it will contribute to affordable high speed spindle system. In this paper, we report the selection process of the sensor types and the experimental results with driving circuits.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.21-28
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• 2002

This paper presents a dynamic modeling and a robust PID controller design process for the wire bonder head assembly. For modeling elements, the system is divided into electrical part, magnetic part, and mechanical part. Each part is modeled using the bond graph method. The PID controller is used for high speed/high accuracy position control of the wire bonder assembly. The Taguchi method is used to obtain the more robust PID gain combinations than conventional one. This study makes use of an L18 array with three parameters varied on three levels. Results of simulations and experimental show that the designed PID controller provides a improved ratio of signal to noise and a reduced sensitivity improved to the conventional PID controller.