• Design & Manufacturing
• /
• 제18권2호
• /
• pp.9-16
• /
• 2024

Recently, there has been extensive research conducted on the miniaturization of semiconductors and the improvement of their integration to achieve high-quality and high-performance electronic devices. To integrate and miniaturize multiple semiconductors, thin and precise wafers are essential. The backgrinding process, which involves high-precision processing, is necessary to achieve this. The backgrinding system is used to grind and polish the back side of the wafer to reduce its thickness to ㎛ units. This enables the high integration and miniaturization of semiconductors and a flattening process to allow for detailed circuit design, ultimately leading to the production of IC chips. As the backgrinding system performs precision processing at the ㎛ unit, it is crucial to determine the stability of the equipment's rigidity. Additionally, the flatness and surface roughness of the processed wafer must be checked to confirm the processability of the backgrinding system. IIn this paper, the goal is to verify the processability of the back grinding system by analyzing the natural frequency and resonance frequency of the equipment through computer simulation and measuring and analyzing the flatness and surface roughness of wafers processed with backgrinding system. It was confirmed whether processing damage occurred due to vibration during the backgrinding process.

• 반도체디스플레이기술학회지
• /
• 제8권4호
• /
• pp.53-58
• /
• 2009

A SMT mounter is a kind of equipment that mounts SMD parts quickly on the printed circuit board. By using linear motors, it is controlled with high speed and precision, which is similar to semi-conductor and display process equipment. It is necessarily used in an assembly process of an electronic device. Mobile devices such as a mobile phone and PDA are required to reduce mount areas due to the demands for high performance and small size. Hence, super small sized and complex mobile devices have been developed. To improve the productivity of the corresponding equipment, designs with large sized, high speed, and multidisciplinary functions have been consistently performed. Meanwhile, a design trend of large size and light-weight on SMT mounter causes a low natural frequency of systems and vibration problems at the high speed operation. In this paper, the dynamic characteristics of the SMD mounter system were investigated through a modal test and transmissibility test, and verified by finite element method. Also, various design improvement was performed to avoid the resonance phenomena.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2004년도 춘계학술대회논문집
• /
• pp.237-242
• /
• 2004

In design stage of high precision manufacture/inspection FAB building, it is necessary to investigate the vibration allowable limits of high precision equipment and to study a structure dynamic characteristics of C/R and Sub-structure in order to provide a structure vibration environment to satisfy thess allowable limits. The aim of this study is to investigate the dynamic characteristics of PC-Type mock-up structures designed for next TFT LCD FAB through vibration measurement and analysis procedure, therefore, to provide a proper dynamic structure design for high precision manufacture/inspection work process, which satisfy thess allowable limits.

• Design & Manufacturing
• /
• 제17권4호
• /
• pp.14-23
• /
• 2023

The electric vehicle market is developing rapidly around the world. Also, parts of electric vehicles require precision.In order to produce high-precision motor cores,Press equipment must also have good precision. Drive motor cores are an important technology for electric vehicles. It uses a large high-speed press to mass-produce drive motor cores. Because it's a large high-speed press, there are many reasons why the precision is not good. One of the causes is vibration and noise. Recently, as environmental demands have become stricter, regulations on noise and vibration have been strengthened. It is important for press machines to reduce vibration first for sound insulation and dust proofing. This is because the "breakthrough" phenomenon occurs in the press. Dynamic precision is the precision under the load of the press, Design considering strain and stiffness shall be made. Vibration and noise may occur due to SPM of high-speed press,And vibration and noise can cause structural deformation of the press. Structural deformation of the press can affect the precision of the product.Noise and vibration also cause problems for workers and work environments. Problems with vibration and noise occur during press processing, and vibration and noise lead to damage to the mold or defects in the product. Reliability in high-quality technology must be secured with low noise and low vibration during press processing. Modular shape and deformation energy effects were analyzed through finite element analysis. In this study, a study on vibration and noise countermeasures was conducted through finite element analysis of a large high-speed press.

• 한국정밀공학회지
• /
• 제28권10호
• /
• pp.1153-1158
• /
• 2011

Roll-to-roll process is an emerging mass production method for printed and flexible electronics such as touch screen panel, RFID tag, thin film solar cell, and flexible display due to its high throughput. High precision in printing and coating is required to apply functional materials onto substrate. For such reason, every part of the roll-to-roll equipment needs to be precisely fabricated and to retain its precision under regular operation. In this article, the precision of cantilever type idler roller and a novel method to mitigate its deflection under web tension loading are discussed and the method is verified using both the numerical and the experimental works. The proposed method improves the structural rigidity of cantilever type roller whose advantages, such as low capital cost and high web path configurability, are maintained.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2000년도 춘계학술대회 논문집
• /
• pp.959-962
• /
• 2000

In this study, the micro shaft was fabricated by high speed etching process. The integration of the kinetic energy of circumference and the effect of etching takes less time to fabricate the micro shaft than any other conventional methods. First, the end part of the rod(SKD11) was dipped in chemical solution(FeCl$_3$) and the rod rotated at high speed(3500-10000rpm). Experimental setup was simply composed of high speed motor. chemical solution and $\Phi$ 1 mm rod. The main factors of diameter control are chemical concentration, reaction time and rpm. has a result. the diameter of the dipped rod was decreased by 200${\mu}{\textrm}{m}$ by high speed rotation and its shape and surface was good. From this experiment, we found the possibility to manufacture micro shaft without very expensive equipment.

• 한국정밀공학회지
• /
• 제32권10호
• /
• pp.917-923
• /
• 2015

3D Printing has a great advantage for its capabilities in manufacturing complicated structures in a reasonable manufacturing time, and thus is widely used in various fields. Due to the high cost of the equipment and material, a fairly acceptable equipment, the Projection Stereolithography Apparatus (PSLA), has been developed, using the projection pattern approach for the purpose of quick manufacturing. We evaluated its surface quality, as compared with that of other systems. The result is the development of a high-performance, low-cost 3D Printer and its operating software, using LCD and UV LED. Working materials for an optimal manufacturing are suggested in the research, along with some suggestions of basic approaches for enhancing the accuracy and quality of the manufactured structures.

• 한국산업융합학회 논문집
• /
• 제25권3호
• /
• pp.333-340
• /
• 2022

Recently, the use of large-capacity secondary batteries for electric vehicles is rapidly increasing, and accordingly, the demand for technologies and equipment for battery reliability evaluation is increasing significantly. The existing short circuit test equipment for evaluating the stability of the existing secondary battery consists of relays, MCs, and switches, so when a large current is energized during a short circuit, contact fusion failures occur frequently, resulting in high equipment maintenance and repair costs. There was a disadvantage that repeated testing was impossible. In this paper, we developed an electronic short circuit test device that realizes stable switching operation when a large-capacity power semiconductor switch is energized with a large current, and applied smart ICT technology to this electronic short circuit stability test system to achieve high speed and high precision through communication with the master. It is expected that the inspection history management system based on data measurement, database format and user interface will be utilized as essential inspection process equipment.

• 전기전자학회논문지
• /
• 제20권1호
• /
• pp.61-67
• /
• 2016

본 논문에서는 중성자 방사선 측정을 위한 고속 고정밀 중성자 측정을 위한 하드웨어 설계방법을 제안한다. 제안된 고속 고정밀 중성자 측정 장치의 하드웨어 설계는 고성능 A/D 변환기를 사용하여 고정밀 고속의 아날로그 신호를 디지털 데이터로 변환할 수 있도록 구성된다. 중성자 센서를 사용하여 입사된 중성자 방사선 입자를 검출하고, 극저전류 정밀 측정 모듈을 통해 검출된 중성자 방사선을 보다 정밀하고 빠르게 측정하는 모듈을 설계한다. 고속 고정밀 중성자 측정을 위한 하드웨어 시스템은 중성자 센서부, 가변 고전압 발생부, 극저전류 정밀 측정부, 임베디드 시스템부, 디스플레이부 등으로 구성 된다. 중성자 센서부는 고밀도 폴리에틸렌을 통해 중성자 방사선을 검출하는 기능을 수행한다. 가변 고전압 발생부는 중성자 센서가 정상적으로 운영되기 위하여 발열 및 잡음 특성에 강인한 0 ~ 2KV 가변 고전압 발생장치의 기능을 수행한다. 극저전류 정밀 측정부는 중성자 센서에서 출력되는 고정밀 고속의 극저전류 신호를 고성능 A/D 변환기를 사용하여 정밀하고 빠르게 측정하고 아날로그 신호를 디지털 신호로 변환하는 기능을 수행한다. 임베디드 시스템부는 고속 고정밀 중성자 측정을 위한 중성자 방사선 측정 기능, 가변 고전압 발생장치 제어 기능, 유무선 통신 제어 기능, 저장 기능 등을 수행한다. 제안된 고속 고정밀 중성자 측정을 위한 하드웨어를 실험한 결과, 불확도, 중성자 측정 속도, 정확도, 중성자 측정 범위 등에서 기존의 장치보다 우수한 성능이 나타남을 확인할 수가 있다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2004년도 추계학술대회 논문집
• /
• pp.1361-1364
• /
• 2004

There is a need for fundamental understanding of biotribological characteristics of various biomaterials sliding against biological materials in order to develop a moving mechanism of medical microsystems having high energy efficiency. A special experimental equipment was designed and built to study the frictional behavior of various biomaterials sliding against a small intestine specimen of a pig. Friction experiments for six biomaterials were performed. Particularly, the effects of load and speed on frictional behavior were investigated. The results of this work will aid in the development of the actuator for a self-propelling micro-endoscope.