• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.940-941
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• 2015

LCD (liquid crystal display) industry is needed to goods of high reliability and is interested in products without harmful material. In this experiment, we made the LED backlight unit for Automotive-navigation. And for making this backlight unit we used to eight side emitting type white LEDs with 1W high power of the lumileds company. We could know that this backlight unit releases to 6500 nit in 14W power consumption and start up voltage time is under the15ms in the ambient temperature $-20^{\circ}C$.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1326-1329
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• 2009

In large-area LCD displays, we have developed two new control technologies for high-power LED backlight. The Novel control technology called scanning control and local gray control. In addition, a conceptual display system power management was developed. We have implemented high power-LED module driving system which can achieve power saving and cost down. Finally, we designed LED light-bar module of the side type as a backlight source. It not only achieved light & thin but also reduced the quantity of LEDs.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.1
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• pp.124-133
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• 2017

In the current lighting market, LEDs that have a high luminous efficiency, a long life and consume less power have emerged as next generation lighting. Owing to various designs and sizes of LEDs, the production process of existing LEDs involves many tasks that require manual labor; hence, the assembly of LEDs necessitates manpower. Because of the use of manpower, the production costs of LEDs increases and production efficiency decreases. Recently, the assembly parts of LEDs have been standardized for minimizing manual labor, and an LED is developed as an LED panel. The automatic assembly system produces LED convergent lighting by assembling two LED panels and one diffusion cover. To increase the production efficiency of the LED convergent lighting module, it is important that the development of a feeder can continuously supply the LED panels is required, and whose design has sufficient stability. The automatic assembly system of the LED convergent lighting module consists of two feeders, which convey LED panels and diffusion covers to a main conveyor, which assembles the lifted panels and covers. In this study, structural analysis and fatigue life for forced loads on the conveyer line of the feeder in the process of lifting LED panels and diffusion covers of each feeder, is analyzed. In addition, the drive of the belt constituting the conveyor line of each feeder is simulated, and the dynamic characteristics of the belt is analyzed using the virtual engineering method.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.145-145
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• 2011

Light-emitting diodes (LEDs) based on III-nitrides compound semiconductors have achieved a high performance device available for display and illumination sector. However, the conventional c-plane oriented LED structures are still showing several problems given by the quantum confined Stark effect (QCSE) due to the effects of strong piezoelectric and spontaneous polarizations. The QCSE results in spatial separation of electron and hole wavefunctions in quantum wells, thereby decreasing the internal quantum efficiency and red-shifting the emission wavelength. Due to demands for improvement of device performance, nonpolar structure has been attracting attentions, since the quantum wells grown on nonpolar templates are free from the QCSE. However, current device performance for nonpolar LEDs is still lower than those for conventional LEDs. In this study, we discuss the potential possibilities of nonpolar LEDs for commercialization. In this study, we characterized current-light output power relation of the a-plane InGaN/GaN LEDs structures with the variation of quantum well structures. On-wafer electroluminescence measurements were performed with short pulse (10 us) and low duty factor (1 %) conditions applied for eliminating thermal effects. The well and barrier widths, and indium compositions in quantum well structures were changed to analyze the efficiency droop phenomenon.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1669-1670
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• 2006

LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. But, with the development of blue LEDs and the improvement of LED brightness, color variation are becoming more and more popular as lighting and application devices in this page, 1 used the Light Tools which was a simulation program in order to recognize optical a few characteristic of LEDs arrangement along reflector matrial and designed LED Arranged 5 phi LED in 5mm interval In the square that was $10{\times}10$ And designs a reflection board on pcb, structural design of PCB changed as five type. - Aluminum, Gold. Chromium, Nickel, Copper.

• Journal of the Semiconductor & Display Technology
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• v.17 no.2
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• pp.36-40
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• 2018

Point LED applied in Korea is applied to communication RCLED, but it is designed to be suitable for communication, so it does not meet requirements in fiber coupling rate and optical output. - Currently, domestic optical pipe manufacturers use general LEDs for light emitting devices, but Japanese products use high power point LEDs to develop superior point LED (RED 620 ~ 660nm).

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.967_968
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• 2009

For lighting application, high-power LED nowadays is driven at 350mA and a sensing resistor is used to provide feedback for LED-current regulation. This method adds an IR drop at the output branch, and limits power efficiency as LED current is large and keeps increasing. In this paper, a power efficient LED-current sensing circuit is proposed. The circuit does not use any sensing resistor but extracts LED-current information from the output capacitor of the driver. Controlling the brightness of LEDs requires a driver that provides a constant, regulated current. In one case, the converter may need to step down the input voltage, and, in another, it may need to boost up the output voltage. These situations often arise in applications with wide-ranging ""dirty"" input power sources, such as automotive systems. And, the driver topology must be able to generate a large enough output voltage to forward bias the LEDs. So, to provide this requirements, 13W prototype Buck-Boost Converter is used.

• Journal of Korea Society of Digital Industry and Information Management
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• v.17 no.1
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• pp.1-6
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• 2021

In this paper, to expand the use of standalone street lights, an algorithm for controlling LED energy consumption was proposed. The proposed method uses an LED module of a standalone street light divided into n zones. This is a method of reducing total power consumption by preventing the increase in power consumption due to high heat generation by weakly operating the entire LED according to the illuminance. When the amount of sunlight decreases, the whole LED operates weakly and then brightens, and unlike streetlight that act as streetlight, a method of dividing LEDs by area and limiting the number of LEDs operating according to illumination intensity was proposed. This is a way to use a lot of time with limited battery capacity by reducing the generation of heat that consumes the most power in streetlight. It is also a method of continuously changing the initial usage area to improve the total usage time of the LED substrate. As a result of the experiment, it was found that the proposed method extends the service time because it generates less heat than the conventional stand-alone streetlight.

• Proceedings of the Optical Society of Korea Conference
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• 2009.10a
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• pp.294-295
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• 2009

• Journal of Sensor Science and Technology
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• v.31 no.1
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.