• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.418-418
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• 2008

The electrochemical etching of silicon in HF-based solutions is known to form various types of porous structures. Porous structures are generally classified into three categories according to pore sizes: micropore (below 2 nm in size), mesopore (2 ~ 50 nm), and macropore (above 50 nm). Recently, the formation of macropores has attracted increasing interest because of their promising characteristics for an wide scope of applications such as microelectromechanical systems (MEMS), chemical sensors, biotechnology, photonic crystals, and photovoltaic application. One of the promising applications of macropores is in the field of MEMS. Anisotropic etching is essential step for fabrication of MEMS. Conventional wet etching has advantages such as low processing cost and high throughput, but it is unsuitable to fabricate high-aspect-ratio structures with vertical sidewalls due to its inherent etching characteristics along certain crystal orientations. Reactive ion dry etching is another technique of anisotropic etching. This has excellent ability to fabricate high-aspect-ratio structures with vertical sidewalls and high accuracy. However, its high processing cost is one of the bottlenecks for widely successful commercialization of MEMS. In contrast, by using electrochemical etching method together with pre-patterning by lithographic step, regular macropore arrays with very high-aspect-ratio up to 250 can be obtained. The formed macropores have very smooth surface and side, unlike deep reactive ion etching where surfaces are damaged and wavy. Especially, to make vertical microwire or nanowire arrays (aspect ratio = over 1:100) on silicon wafer with top-down photolithography, it is very difficult to fabricate them with conventional dry etching. The electrochemical etching is the most proper candidate to do it. The pillar structures are demonstrated for n-type silicon and the formation mechanism is well explained, while such a experimental results are few for p-type silicon. In this report, In order to understand the roles played by the kinds of etching solution and mask patterns in the formation of microwire arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, dimethyl sulfoxide (DMSO), iso-propanol, and mixtures of HF with water on the structure formation on monocrystalline p-type silicon with a resistivity with 10 ~ 20 $\Omega{\cdot}cm$. The different morphological results are presented according to mask patterns and etching solutions.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.978-982
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• 2004

We present high aspect ratio 100nm-scale nickel stamper using e-beam lithography process and Cr/Qz mask for the injection molding process of nano grating patterns. Conventional photolithography blank mask (CrON/Cr/Qz) consists of quartz substrate, Cr layer of UV protection and CrON of anti-reflection layer. We have used Cr/Qz blank mask without anti-reflection layer of CrON which is non-conductive material and ebeam lithography process in order to simplify the nickel electroplating process. In nickel electroplating process, we have used Cr layer of UV protection as seed layer of nickel electroplating. Fabrication conditions of photolithography mask using e-beam lithography are optimized with respect to CrON/Cr/Qz blank mask. In this paper, we have optimized e-beam lithography process using Cr/Qz blank mask and fabricated nickel stamper using Cr seed layer. CrON/Cr/Qz blank mask and Cr/Qz blank mask require optimal e-beam dosage of $10.0{\mu}C/cm^2$ and $8.5{\mu}C/cm^2$, respectively. Finally, we have fabricated $116nm{\pm}6nm-width$ and $240nm{\pm}20nm-height$ nickel grating stamper for the injection molding pattern.

• Transactions of the Korean Society of Mechanical Engineers
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• v.5 no.4
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• pp.329-337
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• 1981

Natural convection within inclined high aspect-ratio rectangular cavity was analysed by using finite element method. For a cavity of sapect-ratio 20, the flow patterns of secondary vortices and the heat transfer characteristics on the wall were obtained with the variation of tilt angle as well as Ra and Pr. The observation on the governing equations shows that the increase of Ra/Pr and the existence of nonzero tilt angle make the flow pattern more complicated and so it becomes difficult to obtain converging solution. The max. value of Ra/Pr attained in this study was 3x10$\^$4/at 0$\^$0/ tilt angle and 1.1x10$\^$4/ at 45.deg. tilt angle for aspect ratio 20and Pr=0.7. Finally an empirical formula for Nusselt number which can accout for the effect of tilt angle is obtained for laminar flow regime.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.2
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• pp.1-6
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• 2012

Recent ultra-precision machining systems have nano-scale resolution, and can machine various shapes of complex structures using five-axis driven modules. These systems are also multi-functional, which can perform various processes such as planing, milling, turning et al. in one system. Micro machining technology using these systems is being developed for machining fine patterns, hybrid patterns and high aspect-ratio patterns on large-area molds with high productivity. These technology is and will be applied continuously to the fields of optics, display, energy, bio, communications and et al. Domestic and foreign trends of micro machining technologies for flat molds were investigated in this study. Especially, we focused on the types and the characteristics of ultra-precision machining systems and application fields of micro patterns machined by the machining system.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.3
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• pp.209-216
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• 2008

The application of focused ion beam (FIB) depends on the optimal interaction of the operation parameters between operating parameters which control beam and samples on the stage during the FIB deposition process. This deposition process was investigated systematically in C precursor gas. Under the fine beam conditions (30kV, 40nm beam size, etc), the effect of considered process parameters - dwell time, beam overlap, incident beam angle to tilted surface, minimum frame time and pattern size were investigated from deposition results by the design of experiment. For the process analysis, influence of the parameters on FIB-CVD process was examined with respect to dimensions and constructed shapes of single and multi- patterns. Throughout the single patterning process, optimal conditions were selected. Multi-patterning deposition were presented to show the effect of on-stage parameters. The analysis have provided the sequent beam scan method and the aspect-ratio had the most significant influence for the multi-patterning deposition in the FIB processing. The bitmapped scan method was more efficient than the one-by-one scan type method for obtaining high aspect-ratio (Width/Height > 1) patterns.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.1
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• pp.104-109
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• 2013

In order to apply nano imprint technology in large area process, roller pressing is promising because of its low cost and high productivity. When pressing mold by roller, liquid resin is locally squeezed between mold and substrate. In this study, the main focus is to understand which process parameter affects residual layer. To do this, a simple analytical model was introduced. Especially, we consider the aspect ratio of patterns as essential cause of variation of the thickness in the equation. As a result, when the aspect ratio of pattern in the mold increases, the thickness of residual layer also increases. In conclusion, we show that the uniformity of residual layer could be accomplished by the control of velocity and pressing force in roller pressing imprint process.

• Journal of the Korean institute of surface engineering
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• v.53 no.3
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• pp.124-129
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• 2020

This study is for the development of high temperature ALD SiO₂ film process, optimized for gap-fill process in manufacturing memory products, using a space-divided PE-ALD system equipped with an independent control dual plasma system and orbital moving unit. Space divided PE-ALD System has high productivity, and various applications can be applied according to Top Lid Design. But space divided ALD system has a limitation to realize concentric deposition map due to process influence due to disk rotation. In order to solve this problem, we developed an orbit rotation moving unit in which disk and wafer. Also we used Independent dual plasma system to enhance thin film properties. Improve productivity and film density for gap-fill process by having deposition and surface treatment in one cycle. Optimize deposition process for gap-fill patterns with different depths by utilizing our independently controlled dual plasma system to insert N₂and/or He plasma during surface treatment, Provide void-free gap-fill process for high aspect ratio gap-fill patterns (up to 50:1) with convex curvature by adjusting deposition and surface treatment recipe in a cycle.

• Design & Manufacturing
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• v.11 no.3
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• pp.29-34
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• 2017

Increased demand for parts with micro-pattern structure made of metals, ceramics, and composites in various fields such as medical ultrasonic sensors, CT collimators, and ultra-small actuator parts. Micro powder injection molding (PIM) is a technology for manufacturing micro size, high volume, complex, precision, net-shape components from either metal or ceramic powder. In the present study, a standard mold with a variable insert core capable of producing various micro patterns was investigated. An injection molding test was performed on a standard mold using a line type micro-pattern core having an aspect ratio of 2, a slenderness ratio of 70, a pattern size of $200{\mu}m$, and a pattern spacing of $150{\mu}m$. During the filling process, the deformation of the mold with large aspect ratio and slenderness ratio was analyzed by the experiment and the numerical simulation according to the position of the gate. We proposed a mold structure that minimizes mold deformation by gate modification and enables uniform pattern filling behavior.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.733-734
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• 2008

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.509-509
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• 2011

Superhydrophobic surfaces on alloyed steels were fabricated with a non-conventional method of plasma etching and subsequent water immersion procedure. High aspect ratio nanopatterns of nanoflake or nano-needle were created on the steels with various Cr content in its composition. With CF4 plasma treatment in radio-frequence chemical vapor deposition (r.-f. CVD) method, steel surfaces were etched and fluorinated by CF4 plasma, which induced the nanopattern evolution through the water immersion process. It was found that fluorine ion played a role as a catalyst to form nanopatterns in water elucidated with XPS and TEM analysis. The hierarchical patterns in micro- and nano scale leads to superhydrophobic properties on the surfaces by deposition of a hydrophobic coating with a-C:H:Si:O film deposited with a gas precursor of hexamethlydisiloxane (HMDSO) with its lower surface energy of 24.2 mN/m, similar to that of curticular wax covering lotus surfaces. Since this method is based on plasma dry etching & coating, precise patterning of surface texturing would be potential on steel or metal surfaces. Patterned hydrophobic steel surfaces were demonstrated by mimicking the Robinia pseudoacacia or acacia leaf, on which water was collected from the humid air using a patterned hydrophobicity on the steels. It is expected that this facile, non-toxic and fast technique would accelerate the large-scale production of superhydrophobic engineering materials with industrial applications.