• Title/Summary/Keyword: High-Speed Heat-up

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Numerical and Experimental Investigation of Thermal Behavior of a Radiation Heater for Flip-Chip Bonders (플립칩 본더용 복사형 히터의 열특성 해석 및 시험)

  • Lee, Sang-Hyun;Kwak, Ho-Sang;Han, Chang-Soo;Ryu, Do-Hyun
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1645-1650
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    • 2003
  • A numerical and experimental study is made of thermal behavior of a hot chuck which is specially designed for flip-chip bonders. The hot chuck consists of radiant heat sources and a heated plate of very high conductivity, which is for achievement of high-speed heat-up. A simplified numerical model is developed to simulate unsteady thermal behavior of the heated plate. Parallel experimental work is also conducted for a prototype of the hot chuck. Based on the experimental data, the numerical model is tuned to improve the reliability and accuracy. Design analysis using the numerical model is conducted. The results of numerical computations illustrate that the radiant heater system adopted in this study satisfies the key design requirements for a high-performance hot chuck.

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A study on the transient characteristics during speed up of inverter heat pump (회전수 상승폭 변화에 따른 인버터열펌프의 비정상 운전특성)

  • 황윤제;김호영
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.10 no.4
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    • pp.495-507
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    • 1998
  • The transient characteristics of a 4.0㎾ inverter driven heat pump was investigated by theoretical and experimental studies. The heat pump used in this study consists of a high side scroll compressor and $\Phi$7 compact heat exchangers with two capillary tubes. A series of tests was peformed to examine the transient characteristics of heat pump in heating and cooling mode when the operating speed was varied from 30Hz to 102Hz. One of the major issues that has not been addressed so far is transient characteristics during speed modulation. A cycle simulation model has been developed to predict the cycle performance under frequency rise-up conditions, and the results of theoretical study were compared with the results of experimental study. The theoretical model was driven from mass conservation and energy conservation equations to predict the operation points of refrigerant cycle and the performances at various operating speeds. For transient conditions, the simulated results are in good agreement with the experimental results within 10%. The transient cycle migration of the liquid state refrigerant causes a significant dynamic change in system. Thus, the migration of refrigerant is the most important factor whenever An experimental analysis is performed or A simulation model is developed.

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Thermal Design and Experimental Test of a High-Performance Hot Chuck for a Ultra Precision Flip-Chip Bonder (초정밀 플립칩 접합기용 고성능 가열기의 열적 설계 및 시험)

  • Lee Sang-Hyun;Park Sang-Hee;Ryu Do-Hyun;Han Chang-Soo;Kwak Ho-Sang
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.10 s.253
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    • pp.957-965
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    • 2006
  • A high-performance hot chuck is designed as a heating device for an ultra-precision flip-chip bonder with infrared alignment system. Analysis of design requirements for thermal performance leads to a radiative heating mechanism employing two halogen lamps as heating source. The heating tool is made of silicon carbide characterized by high thermal diffusivity and small thermal expansion coefficient. Experimental tests are performed to assess heat-up performance and temperature uniformity of the heating tool. It is revealed that the initial design of hot chuck results in a good heat-up speed but there exist a couple of troubles associated with control and integrity of the device. As a means to resolve the raised issues, a revised version of heating tool is proposed, which consists of a working plate made of silicon carbide and a supporting structure made of stainless steel. The advantages of this two-body heating tool are discussed and the improved features are verified experimentally.

Thermophysical Properties of Epoxy Molding Compound for Microelectronic Packaging (반도체 패키지 EMC의 열물성 연구)

  • 이상현;도중광;송현훈
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.4
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    • pp.33-37
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    • 2004
  • As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

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A Study on the Spray Cooling Characteristics on the Angle of Hot Heat Transfer Surface (고온 열전달면의 각도에 따른 분무냉각특성에 관한 연구)

  • Yoon, D.H.;Kim, K.K.;Kim, M.H.;Oh, C.;Yoon, S.H.
    • Proceedings of the Korean Society of Marine Engineers Conference
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    • 2001.11a
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    • pp.8-14
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    • 2001
  • The purpose of this study is to elucidate heat characteristics according to inclination angle of the hot flat plate at the spray cooling. As results of this experiment, the heat flux, the heat transfer coefficient and the cooling speed are increased as the liquid volume flux and subcooled temperature go up. And as the inclination angle of the heat transfer surface is increased, the cooling speed on the inclined flat plate becomes faster. It means that the cooling ability is increased because droplets were excluded by gravity.

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The Cooling System for Head up Display (Head up Display용 냉각시스템)

  • Ji, Youg-Seok;Kim, Young-Seop;An, Byeong-Man;Lim, Sang-Min
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.1
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    • pp.67-71
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    • 2010
  • Head up display’s cooling system is auto-diagnosed resulting from the external environment. The quantity of heat depending on this Head up display’s cooling system layout determines the speed of FAN for system cooling. In other words, a system’s heat quantity is planned through the air density depending on altitude, the amount of wind in air depending on FAN control condition, and the algorithm that is proportional to delta temperature. To detect the altitude, we use the criteria of delta T, which is determined by the subtracted value of LED junction temperature, and atmospheric temperature that is recorded on the Head up display system. Depending on the classification of delta T value, the altitude section is determined. While we can use GPS as the tool to detect the altitude, we should predict the change of the air density as the altitude alters, and should not just measure the altitude. And the value of delta T is used as the criterion of detecting the altitude for increasing the cooling efficiency of the car’s inner Head up display system with reflecting the speed of the FAN dependent upon the air density. In our theory, altitude is depending on the value of delta T and stabilizing or maintaining the system’s temperature by changing FAN’s rpm depending on determined value of altitude.

Heat Radiation of LED Light using eu Plating Engineering Plastic Heat Sink (동도금 EP방열판에 의한 소형LED조명등 방열)

  • Cho, Young-Tae
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.1
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    • pp.81-85
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    • 2011
  • Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.

Operating Characteristics of High Speed PM Synchronous Generator for Microturbine (마이크로터빈용 고속 영구자석 동기발전기 운전 특성)

  • Ahn J. B.;Jeong Y. H.;Kang D. H.
    • Proceedings of the KIPE Conference
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    • 2004.07a
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    • pp.141-143
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    • 2004
  • Distributed generation(DG) using microturbine will be adopted widely because of its various usages and merits such as high heat efficiency, environmental-friendliness. Commercialized DG using microtubine that rotates up to $60,000\~100,000[rpm]$ converters mechanical power to electricity by permanent magnet synchronous machine. This paper presents comparative test and simulation results of PMSM as generator. Test was done by diode rectifier and inverter. Parameters used in the simulation are driven from FEM analysis. Under various speed and load conditions, V-I characteristics matches well and it suggests the possibility of high speed PMSM as generator. DG operating at stand alone and grid connection mode will be developed.

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Influence of Operating Condition on Grinding Temperature in High Effect Grinding (고능률 가공에서 연삭 온도에 미치는 연삭 조건의 영향)

  • 김남경;강대민;송지복
    • Journal of the Korean Society of Safety
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    • v.5 no.1
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    • pp.31-39
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    • 1990
  • In this paper, the influence of the table speed, metal removal rate and grinding fluid on long wheel workpiece contact zone at high effect grinding was investigated by theoretical analyses and measuring the temperature, and discussed by the temperature distribution in grinding surface layer. Main results obtained are as follows, 1) Rega.dless of the table speed, the temperature gap of the workpiece(heat influx) is about 6-8 times as high in dry condition as in wet condition. 2) Good grinding condition can be obtained owing to the effect of grinding fluid without any burning defect under the condition of the metal removal rate(1.0mm$^3$/mm.s) in case of wet grinding. 3) When the depth from the surface layer is about 1.25-1.5mm under the condition of the slow table speed, surface temperature goes up higher as the table speed slows down, because long contact time is laked at the surface layer. 4) In case of the same metal removal rate, the lower the table speed becomes, the higher the surface temperature is, because grinding depth has a far more influence on wheel workpiece contact zone than the table speed.

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A Study on Grinding Temperature in High Effect Grinding (고능률 단공정 연소시 연소온도에 관한 연구)

  • 김남경;안국찬
    • Journal of the Korean Society of Safety
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    • v.7 no.4
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    • pp.13-21
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    • 1992
  • The purpose of this reserch is to suggest grinding temperature for high effect grinding and to clarify the sufficient grinding heat by experiment and theory(developed finite element program). Main results to be obtained are as follows : 1) The grinding temperature distribution by F. E. M is comparatively in good apreement with the experimental results. 2) The up cut grinding method of grinding methods is decreased burning effect. 3) Regardless of the table speed on the temperature distribution in grinding surface layer, cooling effect is about 6-8times when developed nozzle is used.

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