• 한국재료학회지
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• 제16권2호
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• pp.137-143
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• 2006

The effects of Cu and Fe additions on the thermal stability, microstructure and mechanical properties of $Al_{85}-Ni_{8.5}-Mm_{6.5},\;Al_{84}-Ni_{8.5}-Mm_{6.5}Cu_1,\;Al_{84}-Ni_{8.5}-M_{m6.5}Fe_1$ alloys, manufactured by gas atomization, degassing and hot-extrusion were investigated. Gas atomization, with a wide super-cooled liquid region, allowed the alloy powders to exhibit varying microstructure depending primarily on the powder size and composition. Al hotextruded alloys consisted of homogeneously-distributed fine-grained fcc-Al matrix and intermetallic compounds. A substitution of 1 at.% Al by Cu increased the thermal stability of the amorphous phase and produced alloy microstructure with smaller fcc-Al grains. On the other hand, the same substitution of 1 at.% Al by Fe decreased the stability of the amorphous phase and produced larger fcc-Al grains. The formation of intermetallic compounds such as $Al_3Ni,\;Al_{11}Ce_3\;and\;Al_{11}La_3$ was suppressed by the addition of Cu or Fe. Among the three alloys examined, the highest Vickers hardness and compressive strength were obtained for $Al_{84}-Ni_{8.5}-M_{m6.5}Cu_1$ alloy, and related to the finest fcc-Al grain size attained from increased thermal stability with Cu addition.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.288-291
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• 2002

Application of metal silicides such as TiSi$_2$ and CoSi$_2$ as contacts and gate electrodes are being studied. However, TiSi$_2$ due to the linewidth-dependance, and CoSi$_2$ due to the excessive Si consumption during silicidation cannot be applied to the deep-submicron MOSFET device. NiSi shows no such problems and can be formed at the low temperature. But, NiSi shows thermal instability. In this investigation, NiSi was formed with a Ti-capping layer to improve the thermal stability. Ni and Ti films were deposited by the thermal evaporator. The samples were then annealed in the N$_2$ ambient at 300-800$^{\circ}C$ in a RTA (rapid thermal annealing) system. Four point probe, FESEM, and AES were used to study the thermal properties of Ti-capped NiSi layers. The Ti-capped NiSi was stable up to 700$^{\circ}C$ for 100 sec. RTA, while the uncapped NiSi layers showed high sheet resistance after 600$^{\circ}C$. The AES results revealed that the Ni diffusion further into the Si substrate was retarded by the capping layer, resulting in the suppression of agglomeration of NiSi films.

• Composites Research
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• 제34권3호
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• pp.180-185
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• 2021

기존 아민계 경화제를 사용해 액정 에폭시를 경화할 경우, 랜덤 한 3차원 네트워크 구조의 생성으로 인해 phonon의 산란이 많이 발생하기 때문에 열전도도가 낮게 나타났다. 이러한 문제를 mesogen그룹을 적층된 구조로 형성하는 양이온 개시제를 이용하여 해결하기 위해 본 연구에서는 아민계 경화제와 양이온 개시제를 사용한 에폭시의 TGA분석(Thermogravimetric Analysis)을 통해 등온 열분해 활성화에너지를 조사하여 열적안정성을 비교하였다. 양이온 개시제를 이용한 에폭시의 경우 활성화가 에너지가 높았으며 기존 실험과 비교했을 때, 열적안정성은 열전도도와 비슷한 양상을 보인다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.301-301
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• 2008

Ion beam (IB)-induced alignment of inorganic materials has been investigated intensively as it provides controllability in a nonstop process for producing high-resolution displays[1][2]. LC orientation via ion-beam (IB) irradiation on the nitrogen doped diamond like carbon (NDLC) thin film deposited by physical deposition method-sputtering was embodied. The NDLC thin film that was deposited by sputter showed uniform LC alignment at the 1200eV of the ion beam intensity. The pretilt angle of LC on NDLC thin films was measured with various IB exposure time and angle. The maximum pretilt angle were showed with IB irradiation angle of $45^{\circ}$ and exposure time of 62.5 sec, respectively. To show NDLC thin film stability in high temperature, thermal stability test was proceeded. The uppermost of the thermal stability of NDLC thin film was $200^{\circ}C$. In this investigation, the electro-optical (EO) characteristics of LC on NDLC thin film were measured.

• 폴리머
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• 제26권1호
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• pp.80-87
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• 2002

전자선 및 열경화 방법을 사용한 에폭시 수지의 경화거동과 열안정성 효과를 알아보기 위하여 비교 연구를 수행하였다. 본 연구에서는, benzylquinoxalinium hexafluoroantimonate(BQH)가 에폭시 수지의 잠재성 양이온 촉매로서 사용되었다. 열중량분석(TGA)에 의하면, Coats-Redfern 방법에 기초한 분해활성화 에너지는 열경화 방법의 경우가 더 높게 나타났다. 이것은 열로 경화되어진 에폭시 수지의 높은 가교 밀도로 인해 열확산 속도가 느려졌기 때문으로 사료된다. 그러나, 전자선 방법으로 경화되어진 에폭시 수지에서는 안정한 짧은 고리구조, 적분열분해온도, 그리고 높은 충격강도를 위한 최종적인 연성 특성을 향상시키는 수산화기의 증가가 근적외선 분광기(NIRS) 측정으로 관찰되었다.

• Structural Engineering and Mechanics
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• 제91권4호
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• pp.383-391
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• 2024

Conical shell is a common engineering structure, which is widely used in machinery, civil and construction fields. Most of them are usually exposed to external environments, temperature is an important factor affecting its performance. If the external temperature is too high, the deformation of the conical shell will occur, leading to a decrease in stability. Therefore, studying the thermal-post buckling behavior of conical shells is of great significance. This article takes graphene platelets reinforced metal foams (GPLRMF) conical shells as the research object, and uses high-order shear deformation theory (HSDT) to study the thermal post-buckling behaviors. Based on general variational principle, the governing equation of a GPLRMF conical shell is deduced, and discretized and solved by Galerkin method to obtain the critical buckling temperature and thermal post-buckling response of conical shells under various influencing factors. Finally, the effects of cone angles, GPLs distribution types, GPLs mass fraction, porosity distribution types and porosity coefficient on the thermal post-buckling behaviors of conical shells are analyzed in detail. The results show that the cone angle has a significant impact on the nonlinear thermal stability of the conical shells.

• Elastomers and Composites
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• 제55권1호
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• pp.59-66
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• 2020

Herein, we investigated the thermal conductivity and thermal stability of natural rubber composite systems containing hybrid fillers of boron nitride (BN) and aluminum nitride (AlN). In the hybrid system, the bimodal distribution of polygonal AlN and planar BN particles provided excellent filler-packing efficiency and desired energy path for phonon transfer, resulting in high thermal conductivity of 1.29 W/mK, which could not be achieved by single filler composites. Further, polyethylene glycol (PEG) was compounded with a commonly used naphthenic oil, which substantially increased thermal conductivity to 3.51 W/mK with an excellent thermal stability due to facilitated energy transfer across the filler-filler interface. The resulting PEG-incorporated hybrid composite showed a high thermal degradation temperature (T₂) of 290℃, a low coefficient of thermal expansion of 26.4 ppm/℃, and a low thermal distortion parameter of 7.53 m/K, which is well over the naphthenic oil compound. Finally, using the Fourier's law of conduction, we suggested a modeling methodology to evaluate the cooling performance in thermal management system.

• 한국세라믹학회지
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• 제34권5호
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• pp.467-472
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• 1997

Porous silicon was prepared by an anodic etching. The pore size was about 10 nm at an etching time of 20 sec and a current density of 20 mA/$\textrm{cm}^2$. The porous layer was composed of an micro-porous layer (0.6 ${\mu}{\textrm}{m}$) and a macro-porous layer (10 ${\mu}{\textrm}{m}$). Room temperature PL with maximum peak 6700$\AA$ appeared. The peak disappeared by an oxidation reaction when the porous silicon was heated to 100~20$0^{\circ}C$ in atmosphere. In order to avoid the oxidation a heat treatment was done in H2 atmosphere. The micro-pore and Si column, which formed quantum well, were collapsed by the high temperature. The PL maximum peak of heated sample was gradually red-shifted and showed about 300$\AA$ red-shift at 50$0^{\circ}C$. The intensity of PL was maintained to high temperatures in lower pressures. The porous Si was carbonized in C2H2+H2 gas in order to increase thermal stability. The carbonization of the porous Si prevented red-shift of the maximum PL peak caused by sintering effect at high temperatures, and the carbonized porous Si showed Pl signal at higher temperatures by above 20$0^{\circ}C$ than the sample in H2 atmosphere.

• 한국분말재료학회지
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• 제31권4호
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• pp.329-335
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• 2024

As the demand for electric vehicles increases, the stability of batteries has become one of the most significant issues. The battery housing, which protects the battery from external stimuli such as vibration, shock, and heat, is the crucial element in resolving safety problems. Conventional metal battery housings are being converted into polymer composites due to their lightweight and improved corrosion resistance to moisture. The transition to polymer composites requires high mechanical strength, electrical insulation, and thermal stability. In this paper, we proposes a high-strength nanocomposite made by infiltrating epoxy into a 3D aligned h-BN structure. The developed 3D aligned h-BN/epoxy composite not only exhibits a high compressive strength (108 MPa) but also demonstrates excellent electrical insulation and thermal stability, with a stable electrical resistivity at 200 ℃ and a low thermal expansion coefficient (11.46×ppm/℃), respectively.

• Macromolecular Research
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• 제8권6호
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• pp.261-267
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• 2000

It is well known that poly(cyclohexylene dimethylene terephthalate) (PCT) is used as the engineering plastics with high melting temperature and fast crystallization rate compared with poly(butylene terephthalate)(PBT). However, poor thermal stability of PCT has limited its practical application due to the drastic decrease of molecular weight during the processing temperature. In order to improve the thermal stability of PCT homopolymer, the copolymer of PCT and PBT was synthesized and the thermal properties of the copolymer have been studied. P(CT/BT) copolymer was obtained by condensation polymerization of DMT, CHDM, and 1,4-butanediol. The chemical structure and composition of the copolymer was investigated by FTIR and NMR analysis. The thermal behavior of copolymer was studied using DSC and it was found that the crystallization-melting behavior of the copolymer was observed for the whole composition range. TGA analysis exhibited that P(CT/BT) copolymer is more stable at the initial stage of thermal decomposition compared with PCT and PBT homopolymers.