• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.5
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• pp.455-459
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• 2002

I have investigated the effects of annealing on a polymeric $\alpha-C_3N_{4.2}$ at high pressure and temperature in the presence of seeds of crystalline carbon nitride films prepared by a high voltage discharge plasma. The samples were evaluated by x-ray photoelectron spectroscopy (XPS), infrared spectroscopy, Auger electron spectroscopy and x-ray diffraction(XRD). Notably, XPS studies of the film composition before and after annealing demonstrate that the nitrogen composition in $\alpha-C_3N_{4.2}$ material initially containing more than 58% nitrogen decreases during the annealing process and reaches a common, stable composition of ~43%. XPS analysis also shows that the nitrogen composition in the annealed films without polymeric $\alpha-C_3N_{4.2}$ was reduced from 35% to 17%. Furthermore the concentration of the sp$^3$bonded phase increased with the increment of the annealing temperature.

• Journal of the Korean Ceramic Society
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• v.43 no.9 s.292
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• pp.527-531
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• 2006

In order to study the influence of post-annealing treatment on the frequency characteristics of the Li doped ZnO(Li:ZnO) FBAR(Film Bulk Acoustic Resonator) device, we investigated the material and electrical properties of Li:ZnO films in the annealing temperature range from 300 to $500^{\circ}C$. In our samples, as annealing temperature was increased, Li:ZnO films showed the improvement of high c-axis orientation and resistance value with relieved stress and low surface roughness. In addition to, the return loss in the frequency property of fabricated FBAR was improved by annealing treatment from 24.9 to 29.8dB. From experimental results, the optimum post-annealing temperature for FBAR is $500^{\circ}C$ and it can obtain excellent Li:ZnO FBAR performance with stronger c-axis orientation, smoother surface, relieved stress, and lower loss factor.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10a
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• pp.779-782
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• 1990

Recently batch type cold rolling processes have been replaced by continuous annealing type processes for cold rolled sheets of mild steel and high strength steel in order to obtain higher productivity, labor saving. In the continuous annealing line, it is very important to maintain the target steel strip temperature at the exit side of each furnace. The automation system of continuous annealing line is based on a hierachical composition. This paper shows how to preset the set value of furnace temperature control for the heating section in a continuous annealing line. Saying in other words, this paper presents the development of an adaptive control approach to control the exit strip temperature in the continuous annealing line. There are three parts in this approach; one is a process modelling and another is recursive parameter estimation and the other is a design of temperature controller.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.263-263
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• 2010

High temperature annealing is required to synthesize graphene using CVD. When thin metal catalyst is used for the synthesis, the high temperature pre-annealing makes the thin catalyst highly agglomerated. We investigated the agglomeration effect on the shape of the synthesized graphene. It is found that high temperature annealing makes randomly distributed many hole or blister on metal catalyst, and the synthesized graphene features floral pattern around the hole. The floral patterns of graphene turned out to be multi-layers and higher D peaks in raman spectrum.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.818-824
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• 2006

The effects of high-temperature process required to fabricate the SiC devices on the surface morphology and the electrical characteristics were investigated for 4H-SiC Schottky diodes. The 4H-SiC diodes without a graphite cap layer as a protection layer showed catastrophic increase in an excess current at a forward bias and a leakage current at a reverse bias after high-temperature annealing process. Moreover it seemed to deviate from the conventional Schottky characteristics and to operate as an ohmic contact at the low bias regime. However, the 4H-SiC diodes with the graphite cap still exhibited their good electrical characteristics in spite of a slight increase in the leakage current. Therefore, we found that the graphite cap layer serves well as the protection layer of silicon carbide surface during high-temperature annealing. Based on a closer analysis on electric characteristics, a conductive surface transfiguration layer was suspected to form on the surface of diodes without the graphite cap layer during high-temperature annealing. After removing the surface transfiguration layer using ICP-RIE, Schottky diode without the graphite cap layer and having poor electrical characteristics showed a dramatic improvement in its characteristics including the ideality factor[${\eta}$] of 1.23, the schottky barrier height[${\Phi}$] of 1.39 eV, and the leakage current of $7.75\{times}10^{-8}\;A/cm^{2}$ at the reverse bias of -10 V.

• Progress in Superconductivity
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• v.1 no.1
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• pp.9-13
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• 1999

The influence of quenching temperature and annealing time on superconducting characteristics has been investigated for a $(Pb_{0.6}V_{0.4})Sr_2(Ca_{0.65}Er_{0.35})Cu_2O_z$ compound. From the resistivity measurements for samples annealed at $400^{\circ}C$ to $860^{\circ}C$ in oxygen and subsequently quenched, it is observed that $T_c$(zero) of the sample decreases with the increase of annealing temperature up to $600^{\circ}C$ and increases again beyond $700^{\circ}C$. Annealings of the sample at $860^{\circ}C$ show that $T_c$(zero) goes through a maximum of 62K with the increase of the annealing time. It is also found that $T_c$(zero) of the sample quenched from high temperature decreases when the sample is subjected to low temperature annealing below. $600^{\circ}C$ in oxygen. The experimental results indicate that the as-prepared samples contain excessive oxygen and removal of this excessive oxygen in as-prepared samples is a key factor in controlling the superconducting properties of the samples and are discussed in connection with thermal gravimetric measurements.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.159-163
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• 2006

The effects of annealing temperature and time on mechanical properties and microstructures were studied in cold drawn pearlitic steel wires containing 0.84wt% Si. Annealing was performed from $200^{\circ}C$ to $450^{\circ}C$ with different time of 30sec, 1min, 15min and 1hr. The increase of tensile strength at low temperature was related with strain ageing. The decrease of tensile strength at high annealing temperature was related with spherodization of cementite and the occurrence of recovery of the lamellar ferrite in the pearlite. The improvement of ductility was connected with spherodization of cementite plate in pearlite and recovery process by reduction of high dislocation density at short time annealing temperature of $400^{\circ}C$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.8
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• pp.34-41
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• 1993

Effect of high temperature annealing conditions on Ta$_{2}O_{5}$ thin films was investigated. Ta$_{2}O_{5}$ thin films were deposited on P-type silicon substrates by plasma-enhanced chemical vapor deposition (PECVD) using tantalum ethylate. Ta(C$_{2}H_{5}O)_{5}$, and nitrous oxide. N$_{2}$O. The microstructure changed from amorphous to polycrystalline above 700.deg. C annealing temperature. The refractive index, dielectric onstant and leakage current of the film increased as annealing temperature increased. However, annealing in oxygen ambient reduced leakage currents and dielectric constant due to the formation of interfacial SiO$_{2}$ layer. By optimizing annealing temperature and ambient, leakage current lower than 10$^{-8}$ A/cm$^{2}$ and maximum capacitance of 9 fF/${\mu}m^{2}$ could be obtained.

• Journal of Korean Vacuum Science & Technology
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• v.6 no.2
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• pp.79-83
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• 2002

As Ag does not form my silicide on Si surfaces, Ag wire is a candidate for self-assembled nanowire on the reconstructed and single-domain Si(5 5 12)-2 $\times$ 1. In the present study, various Ag coverages and post-annealing temperatures had been tested to fabricate a Ag nanowire with high aspect ratio. When Ag coverage was less than 0.03 ML and the post-annealing temperature was 500(C, Ag atoms preferentially adsorbed on the tetramer sites resulting in Ag wires with an inter-row spacing of ~5 nm. However, its aspect ratio is relatively small and its height is also not even. On the other hand, the Ag-posited surface completely loses its reconstruction even with the same annealing at 500 $\^{C}$ if the initial coverage exceeds 0.05 ML. But the additional subsequent annealing at 700$\^{C}$ and slow-cooling process recovers the well-ordered Ag chain with relatively high aspect ratio on the same tetramer sites. It can be understood that, in the double step annealing process, the lower temperature annealing is required for cohesion of adsorbed Ag atoms and the higher temperature annealing is for providing Ag atoms to the tetramer sites.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.212-212
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• 2009

Thermoelectric devices were used to wide range of application. At present, increasing the efficiency of these devices, in particular, through the preparation of materials showing a high thermoelectric figure of merit, Z, $Bi_2Te_3$ and $Sb_2Te_3$ thin films on Si substrates are deposited by flash evaporation method for thermopile sensor applications. In order to enhance the thermoelectric properties of the thin film, annealing in high vacuum is carried out in the temperature range from 200 to $350^{\circ}C$. The microstructure of the film is investigated by XRD and SEM. The resistivity and Seebeck coefficient of the films are measured by Van der Pauw method and hot probe method respectively. At elevating annealing temperature, the crystallinity and thermoelectrical properties of films are improved by increasing the size of grains. At excessive high annealing temperatures, it is shown that Seebeck coefficient of films is decreased because of Te evaporation. By optimizing the annealing conditions, it is possible to obtain a high performance thin film with a thermoelectric properties.