• Journal of Advanced Marine Engineering and Technology
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• v.38 no.6
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• pp.688-697
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• 2014

In this study, electrode bonding technology needed for high density of rechargeable battery is studied, which is recently researched for electric vehicle, the small leisure vessel. For the alternative overcoming the limit of stacking amount able to be stacked by conventional ultrasonic welding, the low temperature bonding method, eligible for minimum of degeneration of chemical activator on the electrode surface which is generated by thermal effect as well as the increase of conductivity and tension strength caused by electrode bonding using filler metal, not using conventional direct heating on the electrode material method, is studied. Specifically to say, recently used more generally the ultrasonic welding and spot welding method are not usable for satisfying stable electric conductivity and bonding strength when much electrode is stacking bonded. If the electrical power is unreasonably increased for the welding, due to the effect of welding temperature, deformation of electrode and activating material degeneration are caused, and after the last packaging, decline of electrical output and generating heat cause to reduce stability of battery. Therefore, in this study, induction heating system bonding method using high frequency heating and differentiated electrode method using filler metal pre-treatment of hot dipping are introduced.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1214-1218
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• 2005

As demands for precision parts are increased, existing methods to fabricate them such as MEMS, LIGA technology have the technical limitations like high precision, high functionality and ultra miniaturization. A micro-stereolithography technology based on $DMD^{TM}$(Digital Micromirror Device) can meet these demands. In this technology, STL file is the standard format as the same of conventional rapid prototyping system, and 3D part is fabricated by stacking layers that are sliced as 2D section from STL file. Whereas in conventional method, the resin surface is cured as scanning laser beam spot according to the section shape, but in this research, we use integral process which enables to cure the resin surface at one time. In this paper, we deal with the dynamic pattern generation and $DMD^{TM}$ operation to fabricate micro structures. Firstly, we address effective slicing method of STL file, conversion to bitmap, and dynamic pattern generation. Secondly, we suggest $DMD^{TM}$ operation and optimal support manufacturing for $DMD^{TM}$ mounting. Thirdly, we examine the problems on continuous stacking layers, and their improvements in software aspects.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.190-192
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• 2006

The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

• Journal of the Korean Society for Precision Engineering
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• v.11 no.3
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• pp.105-121
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• 1994

In this paper, we proposed the two-parameter model for predicting the residual strength in CFRP laminated composites subjected to high velocity impact and developed and formulated it based upon Cparino's by using the ratio of impact and the normalized residual strength. Critical indentation was obtained by the statical indentation tests. Impact tests were carried out through air-gun type impact equipment with the velocities varied 30-100m/sec. Projectiles were steel balls with 5 and 7mm in diameter. Test material was carbon/epoxy. The specimens were composed of [ .+-. 45 .deg. /0 .deg. /90 .deg. ]$\_$2/ and [ .+-. 45 .deg. ]$\_$4/stacking sequences and had 0.75$\^$T/*0.26$\^$W/*100$\^$L/(mm) dimension. Results from the proposed model were in good agreement with the test data. And failure mechanism due to high velocity impact is given here to examine the initation and deveolpment of damage by fractography and ultrasonic image system. The effects of the 0 .deg. -direction ply position and the amount to damage area on the residual strength are considered here.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.81-85
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• 2013

Wafer stacking technology becomes more important for the next generation IC technology. It requires new process development such as TSV, wafer bonding, and wafer thinning and also needs to resolve wafer warpage, power delivery, and thermo-mechanical reliability for high volume manufacturing. In this study, Cu CMP which is the key process for wafer bonding has been studied using Cu CMP and oxide CMP processes. Wafer samples were fabricated on 8" Si wafer using a damascene process. Cu dishing after Cu CMP and oxide CMP was $180{\AA}$ in average and the total height from wafer surface to bump surface was approximately $2000{\AA}$.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.1-1
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• 2000

The infinite layer compound $ACuO_2$, (A-Alkaline earth) consists of infinite stacking of $CuO_2$ planes separated only by alkaline earth ions. This compound attracted much attention because it contains only key ingredient of all cuprate high temperature superconductor; $CuO_2$ plane with controllable carrier concentration without charge reservoir block. High pressure synthesis method has been found to be preferable for this system due to its ability of doping various lanthanide ion into A site with larger superconducting volume fraction. But rigorous study on this rudimentary compound has been hindered by insufficient quality of sample. Especially superconductlng volume fraction was often too small to identify its origin. In this presentation, we report high pressure synthesis of $Sr_{0.9}Ln_{0.1}CuO_2$ (Ln=La, Sm). By controlling the heating temperature precisely during high pressure synthesis we could have superconductors with quite high superconducting volume fraction for this compound. The magnetic properties of the graln aligned samples show very different behavior compared to the cuprate high temperature superconductors. Details will be discussed.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.4
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• pp.7-13
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• 2010

Linear motors are efficient mechanism that offers high speed and positioning accuracy. By eliminating mechanical transmission mechanisms, much higher speeds and greater acceleration can be achieved without backlash or excessive friction. However, an important disadvantage of linear motor system is its high power loss and heating up of motor and neighboring machine components on operation. Therefore, it is necessary to design moving table with high stiffness, high efficiency and light weight construction. This paper presents the development of moving table using composite material. In order to develop light weight construction of moving table, finite element analysis is performed to find best moving table construction and composite stacking sequence. NASTRAN and MINITAB were used as the optimizer. A prototype for the moving table using composite material was created.

• Journal of Power System Engineering
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• v.6 no.3
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• pp.24-30
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• 2002

The deformation and fracture behaviors of both Al2O3 and Ni 4.5wt.%Al plasma thermal spray coating were investigated by an acoustic emission method. Plasma thermal spray coating is formed by a process in which melted particles flying with high speed towards substrate, then crash and spread on the substrate surface cooled and solidified in a very short time, stacking of the particles makes coating. A tensile test is conducted on notch specimens in a stress range below the elastic limit of substrate. A bendind test is done on smooth specimens. The waveforms of AE generated from the both test coating specimens can be classified by FFT analysis into two types which low frequency(type I) and high frequency(type II). The type I waveform is considered to corresponds exfoliation of coating layers and type II waveform corresponds the plastic deformation of notch tip. The fracture of the coating layers can estimate by AE event and amplitude, because AE features increase when the deformation generates.

• Journal of Information Display
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• v.4 no.3
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• pp.1-5
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• 2003

Laser-Induced Thermal Imaging (LITI) is a laser addressed patterning process and has unique advantages such as high-resolution patterning with over all position accuracy of the imaged stripes of within 2.5 micrometer and scalability to large-size mother glass. This accuracy is accomplished by real-time error correction and a high-resolution stage control system that includes laser interferometers. Here the new concept of hybrid system that complement the merits of small molecule and polymer to be used as an OLED; our system can realize easy processing of light emitting polymers and high luminance efficiency of small molecules. LITI process enables the stripes to be patlerned with excellent thickness uniformity and multi-stacking of various functional layers without having to use any type of fine metal shadow mask. In this study, we report a full-color hybrid OLED using the multi-layered structure consisting of small molecules and polymers.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.