• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.1-9
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• 2010

We reported the methodology for the shear test which is one of the evaluation procedure for mechanical reliability of flip-chip package. The shear speed and the tip height are found to be two significant experimental parameters in the shear test. We investigated how these two parameters have an influence on the results, the shear strength and failure mode. In order to prove these experimental inconsistency, simulation using finite element analysis was also conducted to calculate the shear strength and to figure out the distribution of plastic energy inside of the solder ball. The shear strength decreased while the tip height increased or the shear speed decreased. A variation in shear strength due to inconsistent shear conditions made confusion on analyzing experimental results. As a result, it was strongly needed to standardize the shear test method.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.2 s.179
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• pp.81-87
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• 2006

This study has been focused on the analysis of high speed shear forming process for lead-acid battery grids. The grid plays an important role of electrical charge. It is necessary to ensure the best battery's performance that the grid should have a best quality. The clearance between punch and die, the velocity of punch and the critical damage value are very important parameters for making a good grid form. The finite element analysis of the shear forming process is carried out by measuring and optimizing these three important parameters. The result of this study concludes that these parameters has a great influence on grid quality.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.35-39
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• 2011

Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.51-56
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• 2014

The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.95-101
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• 2002

After high power lasers are avaliable in the commercial market, the number of applications of the laser welding has been increased in manufacturing industries. Although the tailored blank laser welding of butt jointed steel sheets is well known recently in the automotive industries, the lap joint laser welding is a new technology to the automotive manufacturing people as well as the design people. But the deep penetration laser welding seems to be preferred to the partial penetration welding for the lap joint welding in the automotive manufacturers because the partial penetration is a serious deflect for the butt joint. In this study, the feasibility of partial penetration welding fur the lap joint $CO_2$ laser welding was studied fur the 1mm thick 390MPa high strength steel sheets for automotive bodies. The process window of the lap joint partial penetration welding was obtained from experiments with the gap size and the welding speed as process parameters. The partial penetration welding was found excellent on the basis of the tensile shear strength and sectional geometry. The bead width, input energy Per volume, tensile-shear strength, deformation energy and the sectional geometries after tensile-shear tests of partial penetration welded specimens are compared with those of full penetration welded specimens with a series of gaps and welding speeds.

• The Journal of Advanced Prosthodontics
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• v.6 no.6
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• pp.434-443
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• 2014

PURPOSE. The purpose of this study was to evaluate and compare the effects of different surface pretreatment techniques on the surface roughness and shear bond strength of a new self-adhering flowable composite resin for use with lithium disilicate-reinforced CAD/CAM ceramic material. MATERIALS AND METHODS. A total of one hundred thirty lithium disilicate CAD/CAM ceramic plates with dimensions of $6mm{\times}4mm$ and 3 mm thick were prepared. Specimens were then assigned into five groups (n=26) as follows: untreated control, coating with $30{\mu}m$ silica oxide particles ($Cojet^{TM}$ Sand), 9.6% hydrofluoric acid etching, Er:YAG laser irradiation, and grinding with a high-speed fine diamond bur. A self-adhering flowable composite resin (Vertise Flow) was applied onto the pre-treated ceramic plates using the Ultradent shear bond Teflon mold system. Surface roughness was measured by atomic force microscopy. Shear bond strength test were performed using a universal testing machine at a crosshead speed of 1 mm/min. Surface roughness data were analyzed by one-way ANOVA and the Tukey HSD tests. Shear bond strength test values were analyzed by Kruskal-Wallis and Mann-Whitney U tests at ${\alpha}=.05$. RESULTS. Hydrofluoric acid etching and grinding with high-speed fine diamond bur produced significantly higher surface roughness than the other pretreatment groups (P<.05). Hydrofluoric acid etching and silica coating yielded the highest shear bond strength values (P<.001). CONCLUSION. Self-adhering flowable composite resin used as repair composite resin exhibited very low bond strength irrespective of the surface pretreatments used.

• Korean Journal of Materials Research
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• v.24 no.3
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• pp.166-173
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• 2014

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.

• Steel and Composite Structures
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• v.31 no.6
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• pp.591-600
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• 2019

Based on the energy-variational principle, a coupling vibration analysis model of high-speed railway simply supported beam bridge-track structure system (HSRBTS) was established by considering the effect of shear deformation. The vibration differential equation and natural boundary conditions of HSRBTS were derived by considering the interlayer slip effect. Then, an analytic calculation method for the natural vibration frequency of this system was obtained. By taking two simply supported beam bridges of high-speed railway of 24 m and 32 m in span as examples, ANSYS and MIDAS finite-element numerical calculation methods were compared with the analytic method established in this paper. The calculation results show that two of them agree well with each other, validating the analytic method reported in this paper. The analytic method established in this study was used to evaluate the natural vibration characteristics of HSRBTS under different interlayer stiffness and length of rails at different subgrade sections. The results show that the vertical interlayer compressive stiffness had a great influence on the high-order natural vibration frequency of HSRBTS, and the effect of longitudinal interlayer slip stiffness on the natural vibration frequency of HSRBTS could be ignored. Under different vertical interlayer stiffness conditions, the subgrade section of HSRBTS has a critical rail length, and the critical length of rail at subgrade section decreases with the increase in vertical interlayer compressive stiffness.

• Proceedings of the Korean Geotechical Society Conference
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• 2006.03a
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• pp.1320-1325
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• 2006

When the train running on the high-speed track, there is a speed band which track distortion is unusually increased according to the condition of track and roadbed. This speed is called critical velocity and physical parameter values are increased greatly. These phenomenon happened as high-speed train were developed, studied regularly through TGV 100 running test in France. As research result until now, the main reason is soft roadbed's bearing capacity. Wave propagation and track support capacity is varied by the ground characteristics. This paper achieved theoretical examination about resonance band(speed and frequency) that occurred in roadbed on the base rock in point of geotechnical engineering. The examination of resonance divides with ground response analysis, critical band analysis by the shear wave velocity of roadbed and train critical speed through the ground stratum.