• The Magazine of the IEIE
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• v.35 no.7
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• pp.57-71
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• 2008

The last decade has witnessed great improvements in power semiconductor devices thanks to the advanced design and process, which have made it possible to significantly improve the electrical performances of electronic systems while simultaneously reducing their site, weight and perhaps most importantly reducing their cost. Among the power semiconductor devices, IGBT will be a key semiconductor component for power industry since it has a huge potential to cover large areas of power electronics from small home appliances to heavy industries. Currently, only a few limited power semiconductor manufacturers supply most of the industrial consumptions of power IGBT and its modules. Therefore, a large portion of technology in the power industry is dependent on other advanced countries. In this regard, to independently build power IGBT devices and the relevant power module technology, Korean government initiated a new 5-year project 'Power IT,' which also aimed at booming the business of the power semiconductor and the allied industries. With the success of this power IT project, it is expected that the power semiconductor technology will be a basis to foster the high power semiconductor industry and moreover, there will be more innovative developments in the Korea region and globally Also, forming the channel between the customers and suppliers, it is possible to effectively develop the customized power products, which could strengthen the competitiveness of Korean power industry. Furthermore, the power industry including semiconductor manufacturers will be technologically self-supporting and be able to obtain good business opportunities, and eventually increase the share in the growing power semiconductor market, which could be positioned as a major industry in Korea.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.5
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• pp.1120-1128
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• 2004

In this paper, we has designed and implemented Up-converter for K-band with high IMD3 performance using balanced power amplifier. It is consisted of PA module and, Local Oscillator module with reject Filter, mixer module and If block, and Up-converter has a local loop path to decide whether it operate or not and has the sensing port to inspect output power level. According to the power budget of designed Up-converter, K-band balanced power amplifier was fabricated by commercial MMIC. Measurement results of up-converter show about 40dB Gain, PldB of 29dBm and OIP3 was 38.25dBm, that is good performance compared to power budgets. We has adjusted gate voltage of MMIC to control more than 30 dB gain. This up-converter was used in transceiver for PTP and PTMP, and applied to digital communication system that use QAM and QPSK modulation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1011-1019
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• 2015

Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1868-1870
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• 2000

As a drive for an ETC (Electro-thermal Chemical) launcher, a large pulse power system of a 2.4MJ energy storage was designed, constructed and tested. The overall power system consists of eight capacitive 300kJ energy storage banks. In this paper we describe the design features, setup and operation test result of the 300kJ pulsed power module. Each capacitor bank of the 300kJ module consists of six 22kV 50kJ capacitors. A triggered vacuum switch (TVS-43) was adopted as the main pulse switch. Crowbar diode circuits, variable multi-tap inductors and energy dumping systems are connected to each high power capacitor bank via bus-bars and coaxial cables. A parallel crowbar diode stack is fabricated in coaxial structure with two series 13.5kV, 60kA avalanche diodes. The main design parameters of the 300kJ module are a maximum current of 180kA and a pulse width of 0.5 - 3ms. The electrical performances of each component and current output variations into resistive loads have been investigated.

• Journal of Korea Society of Industrial Information Systems
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• v.24 no.2
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• pp.15-23
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• 2019

High temperature superconducting (HTS) generators for wind power systems are attractively researched with the advantages of high efficiency and smaller size compared with conventional generator. However, the HTS generators have high Lorentz force problem, which acts on HTS field coils due to their high current density and magnetic field. This paper deals with characteristic analysis of the modularized HTS field coil for a 750 kW superconducting wind power generator according to field coil structure. The modularized HTS field coil structure was designed based on the electromagnetic and mechanical analysis results obtained using a 3D finite element method. The electromagnetic force of the module coil was also analyzed. As a result, the perpendicular and maximum magnetic fields of the HTS coils were 2.5 T and 3.9 T, respectively. The maximum stress of the supports was less than the allowable stress of the glass-fiber reinforced plastic material, and displacement was within the acceptable range. The design specifications and the results of the HTS module coil structure can be effectively utilized to develop large-scale superconducting wind power generators.

• The Transactions of the Korean Institute of Power Electronics
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• v.12 no.5
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• pp.400-408
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• 2007

In this paper, development of the 8kW parallel module converter is presented. For a effective configuration of FB-PWM converter, this paper proposes 4-parallel operation of 2 kw-module. FB converter of 2-kW module is controlled by phase shut PWM and in order to achieve ZVZCS, the simple auxiliary circuit is applied in secondary side. In order to achieve ZCS, control logic for auxiliary circuit operation is designed to reset the primary current during free-wheeling period. For output current sharing of 4-modules, the charge control is employed. The charge control logic is designed with phase shift PWM logic. Voltage controller is implemented by using DSP(TMS320LF2406) with A/D conversion data of the output current and voltage of each module. The developed converter is installed in PCU(Power Conditioning Unit) for HSG(High Speed Generator) in a vehicle and health monitoring system is implemented for vehicle operation test. Finally, performance of the developed converter is proved under practical operation of HSG.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.13-18
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• 2000

Low temperature co-fired ceramics on metal (LTCC-M) is efficient for embedding passive components with good tolerance in a module due to the dimensional stability in x and y directions by the constraint of metal core during the firing. In addition, the radiation noise can be reduced by metal core. In this paper, embedded passive components were introduced and a power amplifier module (PAM) fabricated by using the passive components was explained. The embedded passive components in test patters showed the tolerance of 10~20% and the good repeatability in tolerance of embedded passives was maintained in module fabrication. The shortened traces in multi chip modules (MCMs) make the signal delay time decreased and the embedded passives simplify the packaging processes owing to the less solder points, which enhance the electrical performance and increase the reliability of the modules. The LTCC-M technology is one of the promising candidates for RF application and is expected to expand its applications to power and high performance devices.

• ETRI Journal
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• v.43 no.6
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• pp.1103-1112
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• 2021

In this study, we present a venting clip for high-power applications that is intended to reduce stray inductance. To reduce the stray inductance of packages in high-power applications, the proposed venting clip features slots are inserted onto a conventional clip. A conventional clip and the proposed venting clip were designed and fabricated to compare the respective stray inductance. The inductance of the proposed venting clip was approximately 15.8% than that of the conventional clip at a frequency of 100 kHz. Through a comparison between the conventional and venting clips, it is confirmed that the proposed venting clip is superior for high-power applications in terms of decreasing inductance. With reduced inductance, the switching-loss for such applications is also expected to decrease. Moreover, the impedance of the venting clip decreased by approximately 15.5% compared with that of the conventional clip at a frequency of 100 kHz. The venting clip, which has reduced resistive component, is also expected to decrease conduction loss in highpower applications.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.20-24
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• 2010

High speed cutting processes of rigid flexible printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also robust laser cutting system has been designed and developed in order to obtain a good cutting quality of rigid and flexible PCB with multi-layers (2-6 layers). Power controller module developed for ourselves is adapted to control the laser output power in the range less than 1%. The systems show the good performance of cutting speed, cutting width and cutting accuracy, respectively. Especially we have confirmed that the short circuit problem due to the carbonized contamination occurred in cross section of multi-layers by thermal effect of high power laser has been improved largely by using multi-pass cutting process with low power and high speed.

• The Transactions of the Korean Institute of Power Electronics
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• v.25 no.3
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• pp.188-194
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• 2020

This paper presents a high-efficiency Switch Mode Line Transformer (SMLT) composed of load-shared dual modules, which is based on the AC/AC LLC resonant converter. Given that the conventional adaptor is usually composed of two power stages, namely, the PFC and DC/DC converters, its system size can be increased according to the output power. However, given that the proposed SMLT can separate the PFC converter from the adaptor, the size reduction of the system can be achieved. Meanwhile, the SMLT with a single module has the limit of the size reduction because of a high resonant current. Thus, it can be configured with dual or multiple modules to reduce the resonant current. Then, their load sharing can be guaranteed by only the proposed transformer structure without an extra current controller. The validity of the proposed converter is proven through a 850-W prototype.