• Transactions of Materials Processing
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• v.21 no.2
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• pp.131-137
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• 2012

With the advantages of power savings, increased life expectancy and fast response time over traditional incandescent bulb, LEDs are increasingly used for many applications including automotive, aviation, display, and special lighting applications. Since the high heat generation of LED chips can reduce service life, degrade luminous efficiency, and cause variation of color temperature, many studies have been carried out on the optimization of LED packaging and heat sinks. In this study, a fin expansion type cooling device using heat pipe, instead of a solid aluminum heat sink, was designed for LED security lightings based on thermal resistance analysis. Numerical analysis and experimental validation were carried out to evaluate its cooling performance.

• Journal of the Korean Society of Visualization
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• v.22 no.1
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• pp.79-84
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• 2024

As microchips' degree of integration is getting higher, its cooling problem becomes important more than ever. One of the promising methods is using fractal microchannel heat sink by mimicking nature's Murray networks. However, most of the related works have been progressed only by numerical analysis. Perhaps such lack of direct experimental studies is due to the technical difficulty of the temperature and heat flux measurement in complex geometric channels. Here, we demonstrate the direct visualization of in situ temperature profile in a fractal microchannel heat sink. By using the temperature-sensitive fluorescent dye and a transparent Polydimethylsiloxane window, we can map temperature profiles in silicon-based fractal heat sinks with various fractal scale factors (a=1.5-3.5). Then, heat transfer rates and pressure drops under a fixed flow rate were estimated to optimize hydrodynamic and thermal characteristics. Through this experiment, we found out that the optimal factor is a=1.75, given that the differences in heat transfer among the devices are marginal when compared to the variances in pumping power. This work is expected to contribute to the development of high-performance, high-efficiency thermal management systems required in various industrial fields.

• ETRI Journal
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• v.38 no.4
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• pp.645-653
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• 2016

This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.1
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• pp.81-85
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• 2011

Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.9
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• pp.789-794
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• 2014

The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.33 no.12
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• pp.947-951
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• 2009

LED has the merits of high reliability, semi-permanent life, rapid-response and its small size for use as light source of head lamp. But the dependence of its performance and life on temperature affect on its practical use. Which dependence makes problem when the LED is heated up to a higher temperature level by self-generation of heat, due to "highly integration" to get enough quantity of light. To solve this problem, effective cooling system is needed that consider conduction, convection and radiation. This study points out the limits of natural convection cooling system and propose of forced convection with heat sink. Also, it describes a correlation between heat sink area and fluid velocity using numerical analysis to optimize the cooling system.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.9
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• pp.855-862
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• 2005

An experimental investigation has been carried out for aluminum foam heat sink inserted into the annulus to examine the feasibility as a heat sink for high performance forced water cooling in the annulus. The local wall temperature distribution, inlet and outlet pressures and temperatures, and heat transfer coefficients were measured for heat flux of 13.6, 18.9, 25.1, 31.4 $kw/m^2$ and Reynolds number ranged from 120 to 2000. Experimental results show that the friction factor is higher than clear annulus without aluminum foam, while the significant augmentation in Nu is obtained. This technique can be used for the compactness of the heat exchanger.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.3
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• pp.237-245
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• 2020

In this paper, I introduce Phase-Change Cooling for thermal management of high power devices that can be applied to High Power Laser and Electric Propulsion Systems which are composed of multiple distributed superheat sources. Phase-Change Cooling can be good used to efficient cooling of their heat sources. Phase-Change Cooling has extremely high efficiency of two-phase heat transport by utilizing heat of vaporization, relatively low flow rates and reduced pumps power. And I suggest TPI(Thermal Performance Index) which is a quantitative performance index of Phase-Change Cooling for thermal management. I quantify the performance of Phase-Change Cooling by introducing TPI. I present the test results of TPI's changing refrigerant, heat sink and flow rate of the Phase-Change Cooling system through the experiments and analyze these results.

• Journal of the Korean institute of surface engineering
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• v.51 no.6
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• pp.415-420
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• 2018

The possibility of an improvement in heat dissipation performance of aluminum alloy heat sink for shipboard LED luminaries through plasma electrolytic oxidation (PEO) was investigated. Four different PEO coatings were produced on aluminum alloy 5052 in silicate based alkaline solution by varying current density ($50{\sim}200mA/cm^2$). On voltage-time response curves, three stages were clearly distinguished at all current densities, namely an initial linear increase, slowdown of increase rate, and steady state(constant voltage). It was found that the increase in current density caused the breakdown voltage to increase. Two different surface morphologies - coralline porous structure and pancake structure - were confirmed by SEM examination. The coralline porous structure was predominant in the coatings produced at lower current densities (50 and $100mA/cm^2$) while under high current densities(150 and $200mA/cm^2$) the pancake structure became dominant. The coating thickness was measured and found to be in a range between about $13{\mu}m$ and $44{\mu}m$, showing increasing thickness with increasing current density. As a result, $100mA/cm^2$ was proposed as an effective process parameter to improve the heat dissipation performance of aluminum alloy heat sink, which could lower the LED operating temperature by about 30%.