• Title/Summary/Keyword: High Level Signal

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Arbitration Method of Beacon Transmissions in a Positioning System for Ubiquitous Computing (유비쿼터스 컴퓨팅을 위한 측위시스템에서 비콘의 전송 중재 기법)

  • 송문규
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.41 no.10
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    • pp.35-43
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    • 2004
  • An arbitration method is proposed to resolve a collision and arbitrate beacon transmissions in an indoor Positioning system consisting of multiple beacons and listeners. Although two or more beacons may compete to transmit signals simultaneously, a single winner in the competition is determined autonomously through the arbitration process while they are transmitting. So, it can continue to send its data, but the others give up their transmissions during the arbitration process. As a consequence, update rate for location information and channel utilization can be improved by avoiding that all beacons fail due to a collision. Once a beacon succeeds in transmitting its signal, a low-level priority is assigned to it. And a high-level priority is allocated to a beacon which gave up its transmission during arbitration process. This will guarantee every beacon has fair transmission opportunity with the arbitration method. As no centralized control is required among beacons, a Positioning system can still be easily deployed and expanded with this arbitration method.

Analysis on the XPD Effect in X-Band Dual-Polarization Transmission System (X-Band 이중편파 전송 시스템에서 XPD 영향 분석)

  • Park, Durk-Jong;Ahn, Sang-Il
    • Aerospace Engineering and Technology
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    • v.6 no.2
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    • pp.211-218
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    • 2007
  • Dual-polarization means to use two orthogonal polarizations, namely two independent channels in communication. This can be used to deal with high datarate caused by large amount of observed data in future LEO satellite. However, when two orthogonal polarizations are not perfectly independent to each other in practical, interference is probably raised in each channel, meaning that noise level in passband increases. XPD (Cross-Polarization Discrimination) is the ratio of the signal level at the output of a receiving antenna that is nominally co-polarized to the transmitting antenna to the output of a receiving antenna of the same gain but nominally orthogonal polarized to the transmitting antenna. In this paper, the influence of XPD on the communication between satellite and ground station was analyzed under the assumption that X-Band dual-polarization was applied to KOMPSAT-2 (KOrea Multi-Purpose SATellite-2). Through analysis, it was shown that more than 3dB of link margin was still achievable despite of worst axial ratio, 2.5dB, at ground station antenna when axial ratio of satellite antenna was about 0.5dB under 99% of environmental availability.

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High-Level Secretory Expression of Human Procarboxypeptidase B by Fed-Batch Cultivation of Pichia pastoris and its Partial Characterization

  • Kim, Mi-Jin;Kim, Sang-Hyuk;Lee, Jae-Hyung;Seo, Jin-Ho;Lee, Jong-Hwan;Kim, Jong-Hyun;Kim, Yeon-Hee;Nam, Soo-Wan
    • Journal of Microbiology and Biotechnology
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    • v.18 no.12
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    • pp.1938-1944
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    • 2008
  • The procpb gene encoding human procarboxypeptidase B (proCPB, GeneBank access code AJ224866) was cloned and its Pichia expression plasmid, $pPIC9{\alpha}$/hproCPB (9.2 kb), was constructed, in which procpb was under the control of the AOXl promoter and connected to the downstream of the mating factor ${\alpha}$-1 ($MF{\alpha}1$) signal sequence. The plasmid was linearized by digestion with Sacl, and integrated into the genome of P. pastoris strain GS115. By culturing of Pichia transformant on methanol medium, the human proCPB was successfully expressed and secreted into the culture supernatant. Moreover, Western blot analysis of the extracellular proteins showed proCPB bands clearly at a molecular mass of 45 kDa, confirming the expression of proCPB with its right size. The CPB activity reached about 3.5 U/ml and 12.7 U/ml in the flask and fermentor batch cultures of Pichia transformant, respectively. No CPB enzyme activity was found in the intracellular fraction. When the fed-batch cultivation was performed with methanol and glycerol mixture as a feeding medium, the extracellular CPB activity was increased to 42.0 U/ml, which corresponds to a 3.3-fold higher level of CPB activity than that of batch culture. The $K_m$ and $k_{cat}$ values of recombinant human CPB enzyme for hippuryl-$_L$-Arg as a substrate were estimated to be 0.16 mM and $11.93\;sec^{-1}$, respectively.

A Study on the Improvement of Spot Welding Quality of Wire Cu Alloy by Taguchi Method for Dynamic Characteristics (동특성 다구찌 기법을 통한 Cu합금 와이어의 스폿용접 품질향상 연구)

  • Suk, Ho-sam;Kim, Yeun-sung;Yoo, Choon-burn
    • Journal of Korean Society for Quality Management
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    • v.45 no.4
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    • pp.1003-1020
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    • 2017
  • Purpose: The purpose of this study is to find the optimum working conditions for spot welding of wire Cu alloys to achieve high-level quality. The parts subject to spot welding are brush card assemblies, which are the main module of the electric movement method of the car seat. Methods: In this study, the signal-to-noise ratio(SN ratio) and the loss function [L(y)] are used as Taguchi method for dynamic characteristics. Results: The results of the study are as follows. First, the analysis of variance using SN ratio showed 6 significant factors(p = 0.1% or less) among 7 factors except press force. Second, the optimal design of the dynamic characteristics is the tip exchange cycle: 50,000 ea., the welding time is 110 ms, the pressing force is 11 kgf/cm2, the rise time is 40 ms, and the tip dressing is 3,000 ea., Tip angle is 12o and electric current is 1,800 A. Conclusion: The validity of the spot welding process of the manufacturer's brush card assembly was verified and proved to be consistent with the study results. The results of this study are expected to standardize the welding conditions and guarantee the quality level required by the customers.

Analysis on Waveform of Leakage Current of Contaminated EPDM Insulators by Salt Fog (Salt fog에 의한 오손된 EPDM애자의 누설전류 파형 분석)

  • Park, Jae-Jun;Song, Young-Chul;Kim, Jeong-Boo;Lee, You-Min;Lee, Hyun-Dong;Jung, Young-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.36-41
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    • 2003
  • This paper presents the results of power spectra using the fundamental and low frequency harmonic components of leakage current waveform to study aging on contaminated EPDM insulator(was serviced during 1997-2001, region Pohang, korea) under salt fog conditions. Experiments have been conducted in the chamber salt fog and at the 16KVrms. The salt contents adjusted as 0g,25g,50g and 75g per liter of deionized water. The onset of dry-band arcing on polymer insulators could be determined by signal processing the low frequency harmonics components. A correlation has been found between the fundamental and low harmonic components of power spectra on leakage current. Where aging could be associated with an increase in the level of both the fundamental and low frequency harmonics components of leakage current. Surface aging for contaminated EPDM insulators occurred when the fundamental component of leakage current was greater then some level On the other hand, when the polymer insulator approached failure, the fundamental component of leakage current reached relatively high values and low frequency harmonics components of the leakage current trended to decrease. The results suggest that both the fundamental and low frequency harmonics of leakage current can be used as a tool to determine both the beginning of aging and before flashover, end of life EPBM insulator in salt fog.

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Partial Discharge Detection of High Voltage Switchgear Using a Ultra High Frequency Sensor

  • Shin, Jong-Yeol;Lee, Young-Sang;Hong, Jin-Woong
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.4
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    • pp.211-215
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    • 2013
  • Partial discharge diagnosis techniques using ultra high frequencies do not affect load movement, because there is no interruption of power. Consequently, these techniques are popular among the prevention diagnosis methods. For the first time, this measurement technique has been applied to the GIS, and has been tested by applying an extra high voltage switchboard. This particular technique makes it easy to measure in the live state, and is not affected by the noise generated by analyzing the causes of faults ? thereby making risk analysis possible. It is reported that the analysis data and the evaluation of the risk level are improved, especially for poor location, and that the measurement of Ultra high frequency (UHF) partial discharge of the real live wire in industrial switchgear is spectacular. Partial discharge diagnosis techniques by using the Ultra High Frequency sensor have been recently highlighted, and it is verified by applying them to the GIS. This has become one of the new and various power equipment techniques. Diagnosis using a UHF sensor is easy to measure, and waveform analysis is already standardized, due to numerous past case experiments. This technique is currently active in research and development, and commercialization is becoming a reality. Another aspect of this technique is that it can determine the occurrences and types of partial discharge, by the application diagnosis for live wire of ultra high voltage switchgear. Measured data by using the UHF partial discharge techniques for ultra high voltage switchgear was obtained from 200 places in Gumi, Yeosu, Taiwan and China's semiconductor plants, and also the partial discharge signals at 15 other places were found. It was confirmed that the partial discharge signal was destroyed by improving the work of junction bolt tightening check, and the cable head reinforcement insulation at 8 places with a possibility for preventing the interruption of service. Also, it was confirmed that the UHF partial discharge measurement techniques are also a prevention diagnosis method in actual industrial sites. The measured field data and the usage of the research for risk assessment techniques of the live wire status of power equipment make a valuable database for future improvements.

Analysis of the Acoustic Performance of Classrooms in Korea (국내 학교 교실의 실내음향성능 실태조사)

  • Park, Chan-Jae;Ryu, Da-Jung;Kyoung, Ju-Young;Haan, Chan-Hoon
    • The Journal of the Acoustical Society of Korea
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    • v.33 no.5
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    • pp.316-325
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    • 2014
  • The basic unit of school is a classroom and the aural environment of the classrooms is essential factor for education purposes. Therefore, many efforts have been undertaken for enhancing the acoustical performance of the classrooms in many countries. As a result, acoustic criteria including reverberation time and background noise level have been established in US and UK for school classrooms depending on the usage and size of the rooms. However, in Korea, there has been little researches concerning the room acoustical investigations of the classrooms. The present study investigates the current situation of the aural environment of the 15 classrooms in Korea including elementary, middle and high schools. The acoustic criteria measured include RT, $D_{50}$, STI, SNR and background noise level. As the results, it was found that the background noise levels of the schools adjacent to roads exceed the US and UK standard of 35 dB(A). Also, most schools have so low SNR that they may be interfered by noise, which may affect speech transmission. It was also revealed that some schools have longer RT than the US standard of 0.6 s, but they all have high speech intelligibility.

Copper Interconnection and Flip Chip Packaging Laboratory Activity for Microelectronics Manufacturing Engineers

  • Moon, Dae-Ho;Ha, Tae-Min;Kim, Boom-Soo;Han, Seung-Soo;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.431-432
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    • 2012
  • In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

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Signal Treatement for Topex/Poseidon Satellite Altimetric Data and Its Application near the Korean Seas (Topex/Poseidon위성 고도계 자료에 대한 신호처리 및 한반도 주변해역에 대한 그 적용)

  • Yoon, Hong-Joo
    • Journal of the Korean Association of Geographic Information Studies
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    • v.2 no.1
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    • pp.12-31
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    • 1999
  • Topex/Poseidon satellite altimetric data are used to estimate characteristics on the oceanic and atmospheric correction factors, and the mean sea level and its variations in the Yellow Sea, the East China Sea and the East Sea from September 1992 through August 1994(70cycles). For the atmospheric correction factors, the variations of dry troposphere, humid troposphere, ionosphere and inverted barometer were very small as a few centimeters, but the variations of electromagnetic bias were higher than other factors. For the oceanic correction factors, the variations of ocean tide(35cm in track 127 and 60cm in track 214) showed high ranges compared to elastic tide(5cm in track 127 and 1cm in track 214) and loading tide(1.8cm in track 127 and 1cm in track 214). It should be understood that the variations of ocean free surface is mainly under the influence of, firstly, ocean tide and, secondly, electromagnetic bias. Mean sea level in the Yellow Sea are higher than in the rest of Seas. Then its range generally comprised between -60cm and 210cm with mean value of about 100cm. Also its variations showed high values in the Yellow Sea and East China Sea, especially 5.689cm in Youngampo. This result is mainly due to the effects of local topography and tidal current.

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Sound System Design and Characteristic Analysis based on Power Line Communication (전력선통신 기반 음향 시스템 설계 및 특성 분석)

  • Kim, Kwan-Kyu;Yeom, Keong-Tae;Kim, Kwan-Woong;Kim, Yong-Kab
    • The Journal of the Korea Contents Association
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    • v.8 no.6
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    • pp.1-7
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    • 2008
  • The paper is to solve the problem of existing sound system, which has difficulties of system organization and the increase of additional install cost and unfriendly interior. To solve the existing system, we drew the new sound system based on PLC and studied it. A transmitter and a receiver were designed using the PLC chip INT5500CS. Sound system was configured with a CD player that sound signals are sent from the transmitter and a speaker connected to the receiver. For analysis of characteristics of this system, a USBPre external sound card and Smaart Live 5 which is a PC-based sound measuring program were added. As a result of our experiment, the measured signal level is $2{\sim}3$[dB] lower than reference signal, latency is 16.69[ms] and the specific character of coherency is bad in high frequency band. Otherwise, this system transmits and receives signals over 90[%] in good condition as a result of measuring pink noise, frequency(1kHz), and phase, magnitude. In view of the result so far achieved, the system designed our team has excellent performance, it resolves defect of existing audio signal transmition system.