• Title/Summary/Keyword: High Brightness LED

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Design of a PWM-Controlled Driving Device for Backlightsof LED Systems (LED 광원의 백 라이트에 대한 PWM 제어 및 구동 장치 설계)

  • Um, Kee-Hong
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.15 no.1
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    • pp.245-251
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    • 2015
  • In this paper, we present a design of PWM-controlled driving device for backlights in LED systems. The system can control either the brightness of the entire screen of backlights of LCD driven by LED or illumination or contrast of each partial segment of the entire screen. The PWM-controlled driving device includes the shift register that shifts the series data according to the clock signal prior to the generation of parallel data. It is also is comprised of a number of registers, a number of counters, a number of comparators, and a number of synchronizing gates (producing the PWM-controlled signals). The proposed device for backlights in LED systems can generate the PWM-controlled signal with a high degree of resolution without the increase of clock frequency. It also contains the PWM-controlled circuit that disperses and restrains the quantized noise.

A Study on Selective Transfer and Reflow Process of Micro-LED using Micro Stamp (마이크로 스탬프를 이용한 Micro-LED 개별 전사 및리플로우 공정에 관한 연구)

  • Han, Seung;Yoon, Min-Ah;Kim, Chan;Kim, Jae-Hyun;Kim, Kwang-Seop
    • Tribology and Lubricants
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    • v.38 no.3
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    • pp.93-100
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    • 2022
  • Micro-light emitting diode (micro-LED) displays offer numerous advantages such as high brightness, fast response, and low power consumption. Hence, they are spotlighted as the next-generation display. However, defective LEDs may be created due to non-uniform contact loads or LED alignment errors. Therefore, a repair process involving the replacement of defective LEDs with favorable ones is necessitated. The general repair process involves the removal of defective micro-LEDs, interconnection material transfer, as well as new micro-LED transfer and bonding. However, micro-LEDs are difficult to repair since their size decreases to a few tens of micron in width and less than 10 ㎛ in thickness. The conventional nozzle-type dispenser for fluxes and the conventional vacuum chuck for LEDs are not applicable to the micro-LED repair process. In this study, transfer conditions are determined using a micro stamp for repairing micro-LEDs. Results show that the aging time should be set to within 60 min, based on measuring the aging time of the flux. Additionally, the micro-LEDs are subjected to a compression test, and the result shows that they should be transferred under 18.4 MPa. Finally, the I-V curves of micro-LEDs processed by the laser and hot plate reflows are measured to compare the electrical properties of the micro-LEDs based on the reflow methods. It was confirmed that the micro-LEDs processed by the laser reflow show similar electrical performance with that processed by the hot plate reflow. The results can provide guidance for the repair of micro-LEDs using micro stamps.

High Performance Flexible Inorganic Electronic Systems

  • Park, Gwi-Il;Lee, Geon-Jae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.115-116
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    • 2012
  • The demand for flexible electronic systems such as wearable computers, E-paper, and flexible displays has increased due to their advantages of excellent portability, conformal contact with curved surfaces, light weight, and human friendly interfaces over present rigid electronic systems. This seminar introduces three recent progresses that can extend the application of high performance flexible inorganic electronics. The first part of this seminar will introduce a RRAM with a one transistor-one memristor (1T-1M) arrays on flexible substrates. Flexible memory is an essential part of electronics for data processing, storage, and radio frequency (RF) communication and thus a key element to realize such flexible electronic systems. Although several emerging memory technologies, including resistive switching memory, have been proposed, the cell-to-cell interference issue has to be overcome for flexible and high performance nonvolatile memory applications. The cell-to-cell interference between neighbouring memory cells occurs due to leakage current paths through adjacent low resistance state cells and induces not only unnecessary power consumption but also a misreading problem, a fatal obstacle in memory operation. To fabricate a fully functional flexible memory and prevent these unwanted effects, we integrated high performance flexible single crystal silicon transistors with an amorphous titanium oxide (a-TiO2) based memristor to control the logic state of memory. The $8{\times}8$ NOR type 1T-1M RRAM demonstrated the first random access memory operation on flexible substrates by controlling each memory unit cell independently. The second part of the seminar will discuss the flexible GaN LED on LCP substrates for implantable biosensor. Inorganic III-V light emitting diodes (LEDs) have superior characteristics, such as long-term stability, high efficiency, and strong brightness compared to conventional incandescent lamps and OLED. However, due to the brittle property of bulk inorganic semiconductor materials, III-V LED limits its applications in the field of high performance flexible electronics. This seminar introduces the first flexible and implantable GaN LED on plastic substrates that is transferred from bulk GaN on Si substrates. The superb properties of the flexible GaN thin film in terms of its wide band gap and high efficiency enable the dramatic extension of not only consumer electronic applications but also the biosensing scale. The flexible white LEDs are demonstrated for the feasibility of using a white light source for future flexible BLU devices. Finally a water-resist and a biocompatible PTFE-coated flexible LED biosensor can detect PSA at a detection limit of 1 ng/mL. These results show that the nitride-based flexible LED can be used as the future flexible display technology and a type of implantable LED biosensor for a therapy tool. The final part of this seminar will introduce a highly efficient and printable BaTiO3 thin film nanogenerator on plastic substrates. Energy harvesting technologies converting external biomechanical energy sources (such as heart beat, blood flow, muscle stretching and animal movements) into electrical energy is recently a highly demanding issue in the materials science community. Herein, we describe procedure suitable for generating and printing a lead-free microstructured BaTiO3 thin film nanogenerator on plastic substrates to overcome limitations appeared in conventional flexible ferroelectric devices. Flexible BaTiO3 thin film nanogenerator was fabricated and the piezoelectric properties and mechanically stability of ferroelectric devices were characterized. From the results, we demonstrate the highly efficient and stable performance of BaTiO3 thin film nanogenerator.

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Effects of some factors on the thermal-dissipation characteristics of high-power LED packages

  • Ji, Peng Fei;Moon, Cheol-Hee
    • Journal of Information Display
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    • v.13 no.1
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    • pp.1-6
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    • 2012
  • Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

A Study on the Development of LED Spot Luminaire for Image Lighting (영상조명용 144[W] LED 스폿 등기구 개발에 관한연구)

  • Lee, Jang-Weon;Im, Jee-Weon
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.10 no.5
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    • pp.271-276
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    • 2010
  • This study manufactured spot lighting fixtures for the broadcasting stage and LED lighting fixtures, measured the illumination, dimming, and color temperature, and installed LED lighting and spot Fresnel lighting to the camera by turns with the same subject to confirm and look into the possibility of replacement of LED lighting fixtures by shooting the figures and comparing them. The analysis of the photographed subject found that the lighting apparatus of LED 144[W] was superior to the tungsten halogen illuminator of 1 [kW] in terms of brightness and color of an image. The measuring of the energy used in 144 [W] LED lighting equipment and tungsten halogen 1[kW] lighting equipment suggested that LED saved more than 80 [%] of energy in the same intensity of illumination. The comparison of the light distribution and light intensity distribution of halogen tungsten illuminator of 1[kW] and LED 144[W] lighting apparatus found that when a subject received concentrated lighting, effective lighting is possible because the illumination intensity on the surface of the lighted subject was high. In performance halls or studios of about 6 [m] height, there is no problem of illumination intensity in LED 144 [W] illuminator. Therefore, it is possible to replace the existing tungsten halogen 1 [KW] illuminator one to one.

Properties of High Power Flip Chip LED Package with Bonding Materials (접합 소재에 따른 고출력 플립칩 LED 패키지 특성 연구)

  • Lee, Tae-Young;Kim, Mi-Song;Ko, Eun-Soo;Choi, Jong-Hyun;Jang, Myoung-Gi;Kim, Mok-Soon;Yoo, Sehoon
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.1
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    • pp.1-6
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    • 2014
  • Flip chip bonded LED packages possess lower thermal resistance than wire bonded LED packages because of short thermal path. In this study, thermal and bonding properties of flip chip bonded high brightness LED were evaluated for Au-Sn thermo-compression bonded LEDs and Sn-Ag-Cu reflow bonded LEDs. For the Au-Sn thermo-compression bonding, bonding pressure and bonding temperature were 50 N and 300oC, respectively. For the SAC solder reflow bonding, peak temperature was $255^{\circ}C$ for 30 sec. The shear strength of the Au-Sn thermo-compression joint was $3508.5gf/mm^2$ and that of the SAC reflow joint was 5798.5 gf/mm. After the shear test, the fracture occurred at the isolation layer in the LED chip for both Au-Sn and SAC joints. Thermal resistance of Au-Sn sample was lower than that of SAC bonded sample due to the void formation in the SAC solder.

Catching efficiency of LED fishing lamp and behavioral reaction of common squid Todarodes pacificus to the shadow section of color LED light (LED 색광의 음영구역에 대한 살오징어의 행동반응 및 LED 집어등의 어획성능)

  • An, Young-Il;Jeong, Hak-Geun
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.47 no.3
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    • pp.183-193
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    • 2011
  • This study made a comparative analysis of behavioral reaction of squid to red (624nm), green (524nm), blue (460nm) & white LED light, its arrival time for the shadow section by making the shadow section in the central section of a water tank just like the bottom part of a squid jigging vessel, and on-site catching efficiency of LED fishing lamp with control fishing vessel. The color LED light showing the highest squidgathering rate as against the shadow section was found to be blue LED light with 39.3% rate under the dark (0.05lx) condition. Under the brighter condition than 0.05lx, white LED light was found to have the highest gathering rate of 41.5%. In addition, it was found that squid gathering rate was high at the shadow section which showed 6.3-fold brightness difference between the shadow section and bright section. As for the arrival time for the shadow section, blue LED light was found to be the fastest in attracting squids in 192.7 seconds under the dark condition while the red LED light was the fastest in luring squids in 164.6 seconds under the bright condition. The ratio of the squid-jigging operation and sailing in fuel consumption of the fishing vessel loaded with LED fishing lamp is about 7 to 1, showing most of the fuel is consumed more in sailing than in squid-jigging operation. As for a catch of squid, the control vessel loaded with MH (Metal Halide) fishing lamp had more catch of 600-7,080 squids than the vessel loaded with LED fishing lamp having a catch of 260-1,700 squids. In addition, even in the comparison of a catch per automatic jigging machine, the catch of the vessel loaded with MH fishing lamp excelled that of the vessel loaded with LED fishing lamp in 6 operations of squid jigging out of 9 operations. The ratio of hand-jigging and automatic jigging machine (one line) in the LED fishing lamp vessel was 1:1.1 excepting the case of having a catch only using an automatic jigging machine, showing almost the same with each other in catches, while in case of a MH fishing lamp vessel, its ratio against hand-jigging was 1 to 5.8, showing hand-jigging excelled in catches.

Wide bandgap III-nitride semiconductors: opportunities for future optoelectronics

  • Park, Yoon-Soo
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.12 no.1
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    • pp.11-20
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    • 2002
  • The world at the end of the $20^{th}$ Century has become "blue" Indeed, this past decade has witnessed a "blue rush" towards the development of violet-blue-green light emitting diodes (LEDs) and laser diodes (LDs) based on wide bandgap III-Nitride semiconductors. And the hard work has culminated with, first, the demonstration of commercial high brightness blue and green LEDs and of commercial violet LDs, at the very end of this decade. Thanks to their extraordinary properties, these semiconductor materials have generated a plethora of activity in semiconductor science and technology. Novel approaches are explored daily to improve the current optoelectronics state-of-the-art. Such improvements will extend the usage and the efficiency of new light sources (e.g. white LEDs), support the rising information technology age (e.g. high density optical data storage), and enhance the environmental awareness capabilities of humans (ultraviolet and visible photon detectors and sensors). Such opportunities and many others will be reviewed in this presentation.

Study on light extraction efficiency of a side-etched LED (측면 식각된 LED의 광추출 효율에 관한 연구)

  • Noh, Y.K.;Kwon, K.Y.
    • Korean Journal of Optics and Photonics
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    • v.14 no.2
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    • pp.122-129
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    • 2003
  • In the case of a AIGalnP/GaP system rectangular parallelepiped high brightness LED which has side walls etched to be slanted off the vertical direction, we have studied the effects of lossy electrodes and material absorption and etching depth and angle of side walls on its light extraction efficiency. If LEDs have no electrodes, in order to obtain an 80% light extraction efficiency of a TIP (truncated inverted pyramid) LED, the side-etched LEDs should have an etching angle of 22$^{\circ}$~45$^{\circ}$ and an etching depth of 8~17% of a dice height and an absorption coefficient less than 1 $cm^{-1}$ / In case of etching depth of 16~39% of a dice height, we can obtain a 90% light extraction efficiency of a TIP LED. But when LEDs have two electrodes and no absorption loss, in order to obtain an 80% light extraction efficiency of a TIP LEBs, the side-etched LEDs should have an etching angle of 25$^{\circ}$-45$^{\circ}$ and an etching depth of 30~36% of a dice height. In case of etching depth of 57~71% of a dice height, we can obtain a 90% light extraction efficiency of a TIP LED.

Development of Dispenser System with Electrohydrodynamic and Voice Coil Motor for White Light Emitting Diode (백색 LED 제조를 위한 정전기력과 보이스코일모터를 이용한 디스펜서 시스템 개발)

  • Kang, Dong-Seong;Kim, Ki-Beom;Ha, Seok-Jae;Cho, Myeong-Woo;Lee, Woo-Jung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.10
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    • pp.6925-6931
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    • 2015
  • LED(Light Emitting Diode) is used in various filed like a display because of low power consuming, long life span, high brightness, rapid response time and environmental-friendly characteristic. General fabrication method is combination blue light LED chip with yellow fluorescent substance. Because this way is suitable for industry field in terms of convenience, economic, efficiency. In white light LED packaging process, encapsulation process that is dispensing fluorescent substance with silicon to blue light LED chip is most important. So, in this paper we develop EHD pump system using voice coil motor and electrostatic pump for dispensing fluorescent substance. For these things we conduct basic test about liquid surface profiles by voltage and process time. Through this data we decide optimal process condition and verify the optimal condition using design of experiment method. And to confirm uniformity of the condition, we conduct repeat dispensing test.