• Title/Summary/Keyword: Hf-oxide

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Effects of Hf addition in thin-film-transistors using Hf-Zn-O channel layers deposited by atomic layer deposition

  • Kim, So-Hui;An, Cheol-Hyeon;Jo, Hyeong-Gyun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2013.05a
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    • pp.138-139
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    • 2013
  • 본 연구는 ZnO-TFT 소자에 Hf의 첨가에 따른 소자 특성 및 게이트 바이어스 스트레스에 대한 특성에 대해 분석을 하였다. Hf-Zn-O 박막은 Hf의 조성이 증가함에 따라 작아지는 grain size로 인해 TFT 소자의 전계효과 이동도와 게이트 바이어스 스트레스에서의 문턱전압의 변화가 더 커지는 것을 확인하였다. 한편, Hf이 14at% 함유된 HZO-TFT에서는 이동도는 현저히 저하되었지만, 게이트 바이어스 스트레스에서의 문턱전압의 변화가 현저히 개선되는 것을 확인하였는데, 이는 Hf의 조성이 증가함에 따라 비정질화 되어 grain boundaries에 의한 trap의 영향이 줄어든 결과를 확인하였다. 또한, 전계효과 이동도와 소자의 안정성을 확보하기 위해, poly-ZnO와 amorphous-HZO로 구성된 다중층 채널 구조를 이용한 TFT소자에서는 전계효과 이동도과 소자의 안정성이 개선된 결과를 보였다. 이는 채널과 게이트 산화물의 interface charge trap의 감소와 back-channel effect가 감소한 결과임을 확인하였다.

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Charge trapping characteristics of high-k $HfO_2$ layer for tunnel barrier engineered nonvolatile memory application (엔지니어드 터널베리어 메모리 적용을 위한 $HfO_2$ 층의 전하 트랩핑 특성)

  • You, Hee-Wook;Kim, Min-Soo;Park, Goon-Ho;Oh, Se-Man;Jung, Jong-Wan;Lee, Young-Hie;Chung, Hong-Bay;Cho, Won-Ju
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.133-133
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    • 2009
  • It is desirable to choose a high-k material having a large band offset with the tunneling oxide and a deep trapping level for use as the charge trapping layer to achieve high PIE (Programming/erasing) speeds and good reliability, respectively. In this paper, charge trapping and tunneling characteristics of high-k hafnium oxide ($HfO_2$) layer with various thicknesses were investigated for applications of tunnel barrier engineered nonvolatile memory. A critical thickness of $HfO_2$ layer for suppressing the charge trapping and enhancing the tunneling sensitivity of tunnel barrier were developed. Also, the charge trap centroid and charge trap density were extracted by constant current stress (CCS) method. As a result, the optimization of $HfO_2$ thickness considerably improved the performances of non-volatile memory(NVM).

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Synthesis of thorium tetrafluoride (ThF4) by ammonium hydrogen difluoride (NH4HF2)

  • Bahri, Che Nor Aniza Che Zainul;Ismail, Aznan Fazli;Majid, Amran Ab.
    • Nuclear Engineering and Technology
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    • v.51 no.3
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    • pp.792-799
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    • 2019
  • The present study aims to investigate the fluorination of thorium oxide ($ThO_2$) by ammonium hydrogen difluoride ($NH_4HF_2$). Fluorination was performed at room temperature by mixing $ThO_2$ and $NH_4HF_2$ at different molar ratios, which was then left to react for 20 days. Next, the mixtures were analyzed using X-ray diffraction (XRD) at the intervals of 5, 10, 15, and 20 days, followed by the heating of the mixtures at $450-750^{\circ}C$ with argon gas flow. The characterization of $ThF_4$ was established using X-ray diffraction (XRD) and scanning electron microscopy-dispersion X-ray spectroscopy (SEM-EDX). In this study, ammonium thorium fluoride was synthesized through the fluorination of $ThO_2$ at room temperature. The optimum molar ratio in synthesizing ammonium thorium fluoride was 1.0:5.5 ($ThO_2:NH_4HF_2$) with 5 days reaction time. In addition, the heating of ammonium thorium fluoride at $450^{\circ}C$ was sufficient to produce $ThF_4$. Overall, this study proved that $NH_4HF_2$ is one of the fluorination agents that is capable of synthesizing $ThF_4$.

게이트 유전체용 $HfO_2$ 박막의 증착 및 열처리 조건에 따른 Nano-Mechanical 특성 연구

  • Kim, Ju-Yeong;Kim, Su-In;Lee, Gyu-Yeong;Gwon, Gu-Eun;Kim, Min-Seok;Eom, Seung-Hyeon;Jeong, Hyeon-Jin;Jo, Yong-Seok;Park, Seung-Ho;Lee, Chang-U
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.291-292
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    • 2012
  • MOSFET 구조에서 metal oxide에 기반을 둔 게이트 유전체의 연구는 실리콘(Si)을 기반으로 한 반도체 발명이래로 가장 인상적인 발전을 이뤄 왔다. 이는 metal oxide의 높은 유전상수 특성이 $SiO_2$보다 우수하고, 유전체 박막의 두께 감소로 인한 전기적 특성 저하를 보완하기 때문이다. 특히 지난 10년 동안, Hafnium에 기반을 둔 $HfO_2$는 차세대 반도체용 유전 물질로 전기적 구조적 특성에 대한 연구가 활발히 진행되어왔다. 그러나 현재까지 $HfO_2$에 대한 nano-mechanical 특성 연구는 미미하여 이에 대한 연구가 필요하다. 이에 본 연구에서는 Hf 및 $HfO_2$ 박막의 증착 및 열처리 조건을 다르게 하여 실험을 진행하였다. 시료는 rf magnetron sputter를 이용하여 Si 기판위에 Hafnium target으로 산소유량(4, 6 sccm)을 달리하여 증착하였고, 이후 furnace에서 400에서 $800^{\circ}C$까지 질소분위기에서 20분간 열처리를 실시하였다. 실험결과 산소 유량을 6 sccm으로 증착한 시료의 current density 성능이 모든 열처리 과정에서 증가하였다. Nano-indenter로 측정하고 Weibull distribution으로 정량적 계산을 한 경도 (Hardness)는 as-deposited 시료를 기준으로 $400^{\circ}C$에서는 감소했으나 온도가 높아질수록 증가하였다. 특히, $400^{\circ}C$ 열처리한 시료에서 산소농도에(4 sccm : 5.35 GPa, 6 sccm : 6.15 GPa)따른 두 시료간의 변화가 가장 두드러졌다. 반면에, 탄성계수 (Elastic modulus)는 산소농도 6 sccm을 넣고 증착된 시료들이 4 sccm을 넣고 증착한 시료보다 모두 높은 값을 나타냈다. 또한, $800^{\circ}C$ 열처리한 시료에서 산소농도에(4 sccm : 128.88 GPa, 6 sccm : 149.39 GPa)따라 표면의 탄성에 큰 차이가 있음을 확인하였다. 이는 증착된 $HfO_2$ 시료들이 비정질 상태에서 $HfO_2$로 결정화되는 과정에서 산소가 증가할수록 박막의 defect이 감소되기 때문으로 사료된다.

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Interfacial Raction of Co/Hf Bilayer Deposited on $\textrm{SiO}_2$ ($\textrm{SiO}_2$기판 위에 증착된 Co/Hf 이중층의 계면반응)

  • Gwon, Yeong-Jae;Lee, Jong-Mu;Bae, Dae-Rok;Gang, Ho-Gyu
    • Korean Journal of Materials Research
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    • v.8 no.9
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    • pp.791-796
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    • 1998
  • self-aligned silicide(salicide)제조시 CoSi2의 에피텍셜 성장을 돕기 위하여 Co와 Si 사이에 내열금속층을 넣은 Co/내열금속/Si의 실리사이드화가 관심을 끌고 있다. Hf 역시 Ti와 마찬가지로 이러한 용도로 사용될 수 있다. 한편, Co/Hf 이중층 salicide 트랜지스터가 성공적으로 만들어지기 위해서는 spacer oxide 위에 증착된 Co/Hf 이중층이 열적으로 안정해야 한다. 이러한 배경에서 본 연구에서는 SiO2기판 위에 증착한 Co 단일층과 Co/Hf 이중층을 급속열처리할 때 Co와 SiO2간의 계면과 Co/Hf와 SiO2간의 계면에서의 상호반응에 대하여 조사하였다. Co 단일층과 Co/Hf 이중층은 각각 $500^{\circ}C$$550^{\circ}C$에서 열처리한 후 면저항이 급격하게 증가하기 시작하였는데, 이것은 Co층이 SiO2와의 계면에너지를 줄이기 위하여 응집되기 때문이다. 이 때 Co/Hf의 경우 열처리후 Hf에 의하여 SiO2 기판이 일부 분해됨으로써 Hf 산화물이 형성되었으나, 전도성이 있는 HfSix 등의 화합물은 발견되지 않았다.

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Atomic Layer Deposition of HfO2 Films on Ge

  • Cho, Young Joon;Chang, Hyo Sik
    • Applied Science and Convergence Technology
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    • v.23 no.1
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    • pp.40-43
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    • 2014
  • We investigated the growth characteristics and interfacial properties of $HfO_2$ films deposited on Ge substrate through atomic layer deposited (ALD) by using an in-situ medium energy ion scattering analysis. The growth kinetics of $HfO_2$ grown on a $GeO_2/Ge$ substrate through ALD is similar to that grown on an $SiO_2/Si$ substrate. However, the incubation period of $HfO_2$ deposition on Ge is shorter than that on Si. The $HfO_2$ grown on the GeO/Ge substrate shows a significant diffusion of Hf atoms into the substrate interface and GeO volatilization after annealing at $700^{\circ}C$. The presence of low-quality Ge oxide or suboxide may degrade the electrical performance of device.

Analysis of Fin-Type SOHOS Flash Memory using Hafnium Oxide as Trapping Layer (Hafnium Oxide를 Trapping Layer로 적용한 Fin-Type SOHOS 플래시 메모리 특성연구)

  • Park, Jeong-Gyu;Oh, Jae-Sub;Yang, Seung-Dong;Jeong, Kwang-Seok;Kim, Yu-Mi;Yun, Ho-Jin;Han, In-Shik;Lee, Hi-Deok;Lee, Ga-Won
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.6
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    • pp.449-453
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    • 2010
  • In this paper, the electrical characteristics of Fin-type SONOS(silicon-oxide-nitride-oxide-silicon) flash memory device with different trapping layers are analyzed in depth. Two kinds of trapping layers i.e., silicon nitride($Si_3N_4$) and hafnium oxide($HfO_2$) are applied. Compared to the conventional Fin-type SONOS device using the $Si_3N_4$ trapping layer, the Fin-type SOHOS(silicon-oxide-high-k-oxide-silicon) device using the $HfO_2$ trapping layer shows superior program/erase speed. However, the data retention properties in SOHOS device are worse than the SONOS flash memory device. Degraded data retention in the SOHOS device may be attributed to the tunneling leakage current induced by interface trap states, which are supported by the subthreshold slope and low frequency noise characteristics.

Effect of Ultrathin Film HfO2 by Atomic Layer Deposition on the Propreties of ZnS:Cu,Cl Phosphors (ZnS:Cu,Cl 형광체의 특성에 미치는 원자층 증착 초박막 HfO2의 영향)

  • Kim, Min-Wan;Han, Sand-Do;Kim, Hyung-Su;Kim, Hyug-Jong;Kim, Hyu-Suk;Kim, Suk-Whan;Lee, Sang-Woo;Choi, Byung-Ho
    • Korean Journal of Materials Research
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    • v.16 no.4
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    • pp.248-252
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    • 2006
  • An investigation is reported on the coating of ZnS:Cu,Cl phosphors by $HfO_2$ using atomic layer deposition method. Hafnium oxide films were prepared at the chamber temperature of $280^{\circ}C$ using $Hf[N(CH_3)_2]_4\;and\;O_2$ as precursors and reactant gas, respectively. XPS and ICP-MS analysis showed the surface composition of coated phosphor powder was hafnium oxide. In FE-SEM analysis, the surface morphology of uncoated phosphors became smoother and clearer as the number of ALD cycle increased from 900 to 1800. The photoluminescence intensity for coated phosphors showed $7.3{\sim}13.4%$ higher than that of uncoated. The effect means that the reactive surface is uniformly coated with stable hafnium oxide to reduce the dead surface layer without change of bulk properties and also its absorptance is almost negligible due to ultrathin(nano-scaled) films. The growth rate is about $1.1{\AA}/cycle$.

Morphology of RF-sputtered Mn-Coatings for Ti-29Nb-xHf Alloys after Micro-Pore Form by PEO

  • Park, Min-Gyu;Park, Seon-Yeong;Choe, Han-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.197-197
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    • 2016
  • Commercially pure titanium (CP Ti) and Ti-6Al-4V alloys have been widely used for biomedical applications. However, the use of the Ti-6Al-4V alloy in biomaterial is then a subject of controversy because aluminum ions and vanadium oxide have potential detrimental influence on the human body due to vanadium and aluminum. Hence, recent works showed that the synthesis of new Ti-based alloys for implant application involves more biocompatible metallic alloying element, such as, Nb, Hf, Zr and Mo. In particular, Nb and Hf are one of the most effective Ti ${\beta}-stabilizer$ and reducing the elastic modulus. Plasma electrolyte oxidation (PEO) is known as excellent method in the biocompatibility of biomaterial due to quickly coating time and controlled coating condition. The anodized oxide layer and diameter modulation of Ti alloys can be obtained function of improvement of cell adhesion. Manganese(Mn) plays very important roles in essential for normal growth and metabolism of skeletal tissue in vertebrates and can be detected as minor constituents in teeth and bone. Radio frequency(RF) magnetron sputtering in the various PVD methods has high deposition rates, high-purity films, extremely high adhesion of films, and excellent uniform layers for depositing a wide range of materials, including metals, alloys and ceramics like a hydroxyapatite. The aim of this study is to research the Mn coatings on the micro-pore formed Ti-29Nb-xHf alloys by RF-magnetron sputtering for dental applications. Ti-29Nb-xHf (x= 0, 3, 7 and 15wt%, mass fraction) alloys were prepared Ti-29Nb-xHf alloys of containing Hf up from 0 wt% to 15 wt% were melted by using a vacuum furnace. Ti-29Nb-xHf alloys were homogenized for 2 hr at $1050^{\circ}C$. Each alloy was anodized in solution containing typically 0.15 M calcium acetate monohydrate + 0.02 M calcium glycerophosphate at room temperature. A direct current power source was used for the process of anodization. Anodized alloys was prepared using 270V~300V anodization voltage at room. Mn coatings was produced by RF-magnetron sputtering system. RF power of 100W was applied to the target for 1h at room temperature. The microstructure, phase and composition of Mn coated oxide surface of Ti-29Nb-xHf alloys were examined by FE-SEM, EDS, and XRD.

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Low Temperature Preparation of Hafnium Oxide Thin Film for OTFT by Atomic Layer Deposition

  • Choi, Woon-Seop
    • Transactions on Electrical and Electronic Materials
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    • v.9 no.6
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    • pp.247-250
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    • 2008
  • Hafnium dioxide ($HfO_2$) thin film as a gate dielectric for organic thin film transistors is prepared by plasma enhanced atomic layer deposition (PEALD). Mostly crystalline of $HfO_2$ film can be obtained with oxygen plasma and with water at relatively low temperature of $200^{\circ}C$. $HfO_2$ was deposited as a uniform rate of $1.2\;A^{\circ}$/cycle. The pentacene TFT was prepared by thermal evaporation method with hafnium dioxide as a gate dielectric. The electrical properties of the OTFT were characterized.