• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.5
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• pp.657-665
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• 2003

Several interesting results were obtained from the flow visualization experiment in the accompanying paper, Part I. in the present study, Part II, a numerical study has been carried out to explain the detailed flow phenomena in micro-channel filling process. Hele-Shaw flow approximation was applied to the micro-channel geometry based on the small characteristic length. And surface tension effect has been introduced on the flow front as the boundary condition with the help of a dynamic contact angle concept between the melt front and the wall. A dimensional analysis for numerical results was carried out and a strong relationship between dimensionless pressure and Capillary number is obtained. The numerical analysis results are compared with the flow visualization experimental observations. And the numerical system developed in the present study seems to be able to predict the interesting micro-channel filling flow characteristics observed from experiments.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.12
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• pp.91-99
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• 1995

An effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele- Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The temperature of the leadframe has been calculated based on energy balance in the leadframe. The flow behavior in the leadframe has been verified experimentally. In the experiment, a transparent mold and clear fluid have been used for flow visualization. Comparisons were made between the calculation and experimental results which showed a good agreement.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.67-72
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• 2001

An Effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele-Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The optimization program based on the complex method integrated with flow analysis program has been successfully used to obtain the optimal filling conditions to avoid short shot.

• Transactions of Materials Processing
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• v.11 no.5
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• pp.414-422
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• 2002

Most of numerical analyses for injection molding have been based on the Hele Shaw's approximation: two-dimensional flow analysis. In some cases, that approximation causes significant errors due to loss of geometrical information as well as simplification of the flow characteristics along the thickness direction. The present work covers numerical analyses of injection molding using three-dimensional solid elements. The accuracy of the analysis results has been verified through some numerical examples in comparison with the classical shell-based approach. The Proposed approach is then applied to predict product defects and to improve flow characteristics for a precision electronics part. In addition, design of experiment has been utilized in order to find the optimal process conditions for better product quality.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.68-75
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• 2002

Most of numerical analyses for injection molding have been based on the Hele Shaw's approximation: two-dimensional flow analysis. In some cases, that approximation causes significant errors due to loss of geometrical information as well as simplification of the flow characteristics along the thickness direction. The present work covers numerical analyses of injection molding using three-dimensional solid elements. The accuracy of the analysis results has been verified through some numerical examples in comparison with the classical shell-based approach. The proposed approach are then applied to predict product defects and to improve flow characteristics for a precision electronics part. In addition, design of experiment has been utilized in order to find the optimal process conditions for better product quality.

• Design & Manufacturing
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• v.2 no.2
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• pp.6-9
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• 2008

Injection molding is representative process of plastic production. Most of numerical analyses for injection molding have been based on the Hele Shaw's approximation: two-dimensional flow analysis. The present work covers numerical analyses of injection molding using three-dimensional solid elements. The accuracy of the analysis results has been verified through some numerical examples in comparison with the various conditions. In this study, moldflow software was used to analyze the cooling analysis. The results of cooling analysis and testing catapult were compared for plastic products.

• Fibers and Polymers
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• v.2 no.4
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• pp.203-211
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• 2001

Residual stresses were predicted by a flow analysis in the mold cavity and residual stress distribution in the injection molded product was measured. Flow field was analyzed by the hybrid FEM/FDM method, using the Hele Shaw approximation. The Modified Cross model was used to determine the dependence of the viscosity on the temperature and the shear rate. The specific volume of the polymer melt which varies with the pressure and temperature fields was calculated by the Tait\`s state equation. Flow analysis results such as pressure, temperature, and the location of the liquid-solid interface were used as the input of the stress analysis. In order to calculate more accurate gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise direction was predicted in two cases, the free quenching, under the assumption that the shrinkage of the injection molded product occurs within the mold cavity and that the solid polymer is elastic. Effects of the initial flow rate, packing pressure, and mold temperature on the residual stress distribution was discussed. Experimental results were also obtained by the layer removal method for molded polypropylene.

• Korean Chemical Engineering Research
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• v.59 no.4
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• pp.626-631
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• 2021

One of the nonlinear electrokinetic phenomena around ion exchange membrane is electroconvective instability which can be found in various electrokinetic applications such as electrodialysis, electrochemical battery, microfluidic analysis platform, etc. Such instability acts as a positive transport mechanism for the electrodialysis via amplifying mass transport rate. On the other hands, in the electrochemical battery and the microfluidic applications, the instability provokes unwanted mass transport. In this research, to control the electroconvective instability, the onset of the instability was analyzed as a function of confinement effect as well as applied voltage. As a result, we figured out that the dynamic behavior of electroconvective instability transited as a sequence of stable regime - static regime - chaotic regime depending on the applied voltage and confinement effect. Furthermore, stability curves about the dynamic transition were numerically determined as well. Conclusively, the confinement effect on electroconvective instability can be applied for effective means to control the electrokinetic chaos.