• 대한기계학회논문집A
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• 제27권5호
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• pp.657-665
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• 2003

Several interesting results were obtained from the flow visualization experiment in the accompanying paper, Part I. in the present study, Part II, a numerical study has been carried out to explain the detailed flow phenomena in micro-channel filling process. Hele-Shaw flow approximation was applied to the micro-channel geometry based on the small characteristic length. And surface tension effect has been introduced on the flow front as the boundary condition with the help of a dynamic contact angle concept between the melt front and the wall. A dimensional analysis for numerical results was carried out and a strong relationship between dimensionless pressure and Capillary number is obtained. The numerical analysis results are compared with the flow visualization experimental observations. And the numerical system developed in the present study seems to be able to predict the interesting micro-channel filling flow characteristics observed from experiments.

• 한국정밀공학회지
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• 제12권12호
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• pp.91-99
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• 1995

An effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele- Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The temperature of the leadframe has been calculated based on energy balance in the leadframe. The flow behavior in the leadframe has been verified experimentally. In the experiment, a transparent mold and clear fluid have been used for flow visualization. Comparisons were made between the calculation and experimental results which showed a good agreement.

• 마이크로전자및패키징학회지
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• 제8권4호
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• pp.67-72
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• 2001

반도체 칩 캡슐화성형시 칩 캐비티에서의 유동을 보다 엄밀하게 모델링하고 해석하기 위한 연구가 이루어졌다. 리드프레임에서의 구멍부위를 통과하는 유동의 모델링을 시도하였고 리드프레임에서의 열 경계조건을 정확하게 취급하였다. 유동의 이론적 해석을 위해 헬레쇼오 모델을 채택하였고 리드프레임에 의해 아래 위로 분리된 각각의 캐비티로 가정하여 해석하였다. 리드프레임에서 구멍부위를 통과하는 유동은 헬레쇼오 모델링시에 질량 소스(source) 항으로 삽입되었다. 유동해석 프로그램과 콤플렉스 방법에 기반을 둔 최적화 프로그램을 연계하여 미성형 방지를 위한 최적 공정조건을 성공적으로 정확하게 얻어낼 수 있었다.

• 소성∙가공
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• 제11권5호
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• pp.414-422
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• 2002

Most of numerical analyses for injection molding have been based on the Hele Shaw's approximation: two-dimensional flow analysis. In some cases, that approximation causes significant errors due to loss of geometrical information as well as simplification of the flow characteristics along the thickness direction. The present work covers numerical analyses of injection molding using three-dimensional solid elements. The accuracy of the analysis results has been verified through some numerical examples in comparison with the classical shell-based approach. The Proposed approach is then applied to predict product defects and to improve flow characteristics for a precision electronics part. In addition, design of experiment has been utilized in order to find the optimal process conditions for better product quality.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 금형가공 심포지엄
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• pp.68-75
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• 2002

Most of numerical analyses for injection molding have been based on the Hele Shaw's approximation: two-dimensional flow analysis. In some cases, that approximation causes significant errors due to loss of geometrical information as well as simplification of the flow characteristics along the thickness direction. The present work covers numerical analyses of injection molding using three-dimensional solid elements. The accuracy of the analysis results has been verified through some numerical examples in comparison with the classical shell-based approach. The proposed approach are then applied to predict product defects and to improve flow characteristics for a precision electronics part. In addition, design of experiment has been utilized in order to find the optimal process conditions for better product quality.

• Design & Manufacturing
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• 제2권2호
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• pp.6-9
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• 2008

Injection molding is representative process of plastic production. Most of numerical analyses for injection molding have been based on the Hele Shaw's approximation: two-dimensional flow analysis. The present work covers numerical analyses of injection molding using three-dimensional solid elements. The accuracy of the analysis results has been verified through some numerical examples in comparison with the various conditions. In this study, moldflow software was used to analyze the cooling analysis. The results of cooling analysis and testing catapult were compared for plastic products.

• Fibers and Polymers
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• 제2권4호
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• pp.203-211
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• 2001

Residual stresses were predicted by a flow analysis in the mold cavity and residual stress distribution in the injection molded product was measured. Flow field was analyzed by the hybrid FEM/FDM method, using the Hele Shaw approximation. The Modified Cross model was used to determine the dependence of the viscosity on the temperature and the shear rate. The specific volume of the polymer melt which varies with the pressure and temperature fields was calculated by the Tait\`s state equation. Flow analysis results such as pressure, temperature, and the location of the liquid-solid interface were used as the input of the stress analysis. In order to calculate more accurate gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise temperature field, a coordinate transformation technique was used. The residual stress distribution in the gap-wise direction was predicted in two cases, the free quenching, under the assumption that the shrinkage of the injection molded product occurs within the mold cavity and that the solid polymer is elastic. Effects of the initial flow rate, packing pressure, and mold temperature on the residual stress distribution was discussed. Experimental results were also obtained by the layer removal method for molded polypropylene.

• Korean Chemical Engineering Research
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• 제59권4호
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• pp.626-631
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• 2021

전기투석장치, 전기화학 전지, 미세유체역학 분석 장치 등에서 사용하는 이온 교환 막 근처의 대표적인 비선형 전기동역학 현상은 전기와류 불안정성이다. 전기투석 장치에서 전기와류 불안정성은 물질 전달 속도 증폭을 통해 물질 전달에 대한 이점을 제공한다. 그러나 전기화학 전지나 미세유체역학 장치에서 발생하는 불안정성은 원치 않는 물질 전달 기작을 유발시킨다. 본 연구에서는 전기와류 불안정성의 제어하기 위해, 인가 전압과 공간 제약 효과의 전기와류 불안정성에 대한 영향을 연구하였다. 그 결과, 인가 전압과 공간 제약의 정도에 따라 불안정성의 동역학이 안정 영역 - 고정 영역 - 혼돈 영역 순으로 전이됨을 밝혀내었다. 더불어, 동역학 전이에 대한 안정성 곡선을 수치적으로 결정하였다. 결론적으로, 공간 제약 효과는 전기동역학적 혼돈을 제어할 수 있는 효과적인 기작으로 활용 가능할 것이다.