• Design & Manufacturing
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• v.12 no.3
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• pp.19-24
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• 2018

Fused deposition Modeling (FDM) is one of the most widely used for the prototype of parts at ease. The FDM 3D printing method is a lamination manufacturing method that the resin is melted at a high temperature and piled up one by one. Another term is also referred to as FFF (Fused Filament Fabrication). 3D printing technology is mainly used only in the area of prototype production, not in production of commercial products. Therefore, if FDM 3D printer is applied to the product process of commercial products when considered, the strength and dimensional accuracy of the manufactured product is expected to be important. In this study, the mechanical properties of parts made by 3D printing with FDM method were investigated. The aim of this work is to examine how the mechanical properties of the FDM parts, by changing of processing FDM printing direction and the height of stacking layer is affected. The effect of the lamination direction and the height of the stacking layer, which are set as variables in the lamination process, by using the tensile specimen and impact specimen after the FDM manufacturing process were investigated and analyzed. The PLA (Poly Lactic Acid) was used as the filament materials for the 3D printing.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.3 s.234
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• pp.455-461
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• 2005

This research studied robust design of composite hand for LTR (LCD glass Transfer Robot). $1^{st}$ DOE (Design of Experiment) was conducted to find out vital few Xs. 108 experiments were performed and their results were statistically analyzed. Pareto chart analysis shows that the geometric parameters (height and width of composite beam) are more important than material parameters $(E_{1},\;E_{2})$ or stacking sequence angle. Also, the stacking sequence of mid-layer is more important than that of outer-layer. The main effect plots shows that the maximum deflection of LTR hand is minimized with increasing height, width of beam and layer thickness. $2^{nd}$ DOE was conducted to obtain RSM (Response Surface Method) equation. 25 experiments were conducted. The CCD (Central Composite Design) technique with four factors was used. The coefficient of determination $(R^{2})$ for the calculated RSM equation was 0.989. Optimum design was conducted using the RSM equation. Multi-island genetic algorithm was used to optimum design. Optimum values for beam height, beam width, layer thickness and beam length were 24.9mm, 186.6mnL 0.15mm and 2402.4mm respectively. An approximate value of 0.77mm in deflection was expected to be a maximum under the optimum conditions. Six sigma robust design was conducted to find out guideline for control range of design parameter. To acquire six sigma level reliability, the standard deviation of design parameter should be con trolled within $2{\%}$ of average design value

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.4 s.247
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• pp.409-419
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• 2006

The actuating performance of plate-type unimorph piezoelectric composite actuators having various stacking sequences was evaluated by three dimensional finite element analysis on the basis of thermal analogy model. Thermal residual stress distribution at each layer in an asymmetrically laminated plate with PZT ceramic layer and thermally induced dome height were predicted using classical laminated plate theory. Thermal analogy model was applied to a bimorph cantilever beam and LIPCA-C2 actuator in order to confirm its validity. Finite element analysis considering thermal residual deformation showed that the bending behavior of piezoelectric composite actuator subjected to electric loads was significantly different according to the stacking sequence, thickness of constituent PZT ceramic and boundary conditions. In particular, the increase of thickness of PZT ceramic led to the increase of the bending stiffness of piezoelectric composite actuator but it did not always lead to the decrease of actuation distance according to the stacking sequences of piezoelectric composite actuator. Therefore, it is noted that the actuating performance of unimorph piezoelectric composite actuator is rather affected by bending stiffness than actuation distance.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.107-113
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• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.220-220
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• 2012

The supercapacitors with extraordinarily high capability for energy storage are attracting growing attention for their potential applications in portable electronic equipments, hybrid vehicles, cellular devices, and so on. The nanostructuring of the electrode surface can provide large surface area and consequently easy diffusion of ions in the capacitors. In addition, compared to two-dimensional nanostructures, the three-dimensional (3D) nano-architecture is expected to lead to significant enhancement of mechanical and electrical properties such as capacitance per unit area of the electrode. Polyaniline (PANi) is known as promising electrode material for supercapacitors due to its desirable properties such as high electro activity, high doping level and environmental stability. In this context, we fabricated well-ordered 3D PANi nanostructures on 3D polystyrene (PS) nanospheres which was arrayed by layer-by-layer stacking method. The height of the PANi nanostructures could be controlled by the number of PS layers stacked. 3D PANi hollow nanospheres were also fabricated by dissolving inner PS nanospheres, which resulted in further enhancement of the surface area and capacitance of the electrode.

• Applied Microscopy
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• v.25 no.3
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• pp.75-81
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• 1995

The microstructural characterization of ternary $ZnS_{x}Se_{1-x}$(x=0.085) on GaAs(001) substrate grown up to $2{\mu}m\;at\;300^{\circ}C$ by molecular beam epitaxy(MBE) which has a single growth chamber was investigated by high resolution transmission electron microscope (HRTEM) working at 300 kV with point resolution of 0.18nm. The interface in the ZnSSe/GaAs specimen maintains a pseudomorphism with the substrate, but the epilayer has high density of stacking faults and moire fringes. The pits which had formed along <111> direction were found at the interface of ZnSSe/GaAs. The pits were responsible for producing defects in both epilayer and substrate. The wavy interface which has the difference of 15nm in height was found to maintain the pseudomorphism with the substrate and no stacking faults were found around the interface. However there exists faint and fine moire fringes in the epilayer near interface.

• International Journal of Advanced Culture Technology
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• v.9 no.4
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• pp.424-430
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• 2021

The purpose of this study is to analyse the characteristics and spreading laws of parameters such as fire smoke, concentration of CO, visibility, and temperature at fire scene in high-rise residential buildings under the different conditions of fire doors and automatic fire extinguishing systems. Using Pyrosim to simulate diverse fire scenes in a high-rise apartment with corridors, to analyze the changes in those parameters. The results show that when a fire occurs, closing the fire-fighting corridor will increase the smoke temperature and concentration of CO in the stairwell, and reduce the height and visibility of the smoke layer; the automatic fire extinguishing system effectively suppresses the increase in the temperature of the fire smoke and the sedimentation of the smoke layer. Reasonable setting and operation of the automatic fire extinguishing system could effectively inhibit the spread of fire. Although closing fire corridor can slow down the direct upward spread of smoke through the corridor, it will force the fire smoke into the stairwell, which will seriously affect evacuation through the stairs. Therefore, in order to reduce risks, it is forbidden to close the fire doors of the firefighting corridor and stacking combustible materials in the corridor, Also, intensifying inspections and ensuring the normal operation of the automatic fire extinguishing system are indispensable. Based on the research results, the significance of installing fire-fighting facilities in the construction of high-rise apartments was discussed and proved.

• Geomechanics and Engineering
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• v.24 no.6
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• pp.545-557
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• 2021

Since the functionally graded materials (FGMs) are used extensively as thermal barriers in many of applications. Therefore, the current article focuses on studying and presenting dynamic responses of multilayer functionally graded (FG) deep beams placed in a thermal environment that is not addressed elsewhere. The material properties of each layer are proposed to be temperature-dependent and vary continuously through the height direction based on the Power-Law function. The deep layered beam is exposed to harmonic sinusoidal load and temperature rising. In the modelling of the multilayered FG deep beam, the two-dimensional (2D) plane stress continuum model is used. Equations of motion of deep composite beam with the associated boundary conditions are presented. In the frame of finite element method (FEM), the 2D twelve-node plane element is exploited to discretize the space domain through the length-thickness plane of the beam. In the solution of the dynamic problem, Newmark average acceleration method is used to solve the time domain incrementally. The developed procedure is verified and compared, and an excellent agreement is observed. In numerical examples, effects of graduation parameter, geometrical dimension and stacking sequence of layers on the time response of deep multilayer FG beams are investigated with temperature effects.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.129-134
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• 2005

Electroplating copper is the important role in formation of 3D stacking interconnection in SiP (System in Package). The I-V characteristics curves are investigated at different electrolyte conditions. Inhibitor and accelerator are used simultaneously to investigate the effects of additives. Three different sizes of via are tested. All via were prepared with RIE (reactive ion etching) method. Via's diameter are 50, 75, $100{\mu}m$ and the height is $100{\mu}m$. Inside via, Ta was deposited for diffusion barrier and Cu was deposited fer seed layer using magnetron sputtering method. DC, pulse and pulse revere current are used in this study. With DC, via cannot be filled without defects. Pulse plating can improve the filling patterns however it cannot completely filled copper without defects. Via was filled completely without defects using pulse-reverse electroplating method.