• Journal of architectural history
• /
• v.14 no.1 s.41
• /
• pp.71-87
• /
• 2005

4 royal palaces are currently remained from capital city (Seoul) of 'Cho-Sun(朝鮮)' period. In these palaces, 'Main hall of Royal Palace(正殿)' is the center of the Royal Palaces. The 'Main hall of Royal Palace' of the Royal Palace was the best building of that time. Therefore there were many studies about the 'Main hall of Royal Palace'. But these studies were individual studies of these 'Main hall of Royal Palace'. Therefore, this study is to analyze and compare 4 'Main hall of Royal Palace' of the Royal palaces. It is to study the proportion regarding the Diameter of the pillar, the Height, the pillar and pillar Interval's Distance, and the arrangement of 'Kong-Po(bracket sets)'. With these studies, it is to prove that the 'Main hall of Royal Palace' is the building which high construction technique of this time is expressed. Result of this study is as followings; First, the proportion of pillar height(H) to its diameter(D) average from H=8.0 to 8.5D. Only the Myeong-Jeong-Jeon omitted the 'Go-Ju(高柱)' in the 'Toi-Kan (退間)' to place Ea-Jwa(御座). Second, Second, the proportion of diameter of the pillar of 'Eoi-Bu-Pyeong-Ju(外部平柱)' and 'Nae-Jin-Go-Ju(內陣高柱)' average D1(Diameter of 'Eoi-Bu-Pyeong-Ju') =0.91D2 (Diameter of 'Nae-Jin-Go-Ju'). In regards to the height, the single floor 'Main hall of Royal Palace' and double floor 'Main hall of Royal Palace' seems to be different. The height proportion of the double floor 'Main hall of royal palace' is H1(Height of 'Eoi-Bu-Pyeong-Ju')=0.34H2(Height of 'Nae-Jin-Go-Ju') and single floor 'Main hall of Royal Palace' has a proportion of H1=0.62H2. Third, in Geun-Jeong-Jeon, with the proportion of height and diameter of the pillar, interval's distance between pillars and diameter, the pillar interval distance and height, of 'Ea-kan(御間)' from the 'Toi-Kan' is different from 'Main hall of Royal Palace'. This is because the structure of 'Toi-Kan' of Geun-Jeong-Jeon is not stable. In order to reinforce this, 'Gui-Go-Ju(隅高柱)' of the Geun-Jeong-Jeon jut out $4{\sim}7%$ more compared to In-Jeong-Jeon. Fourth, when comparing double floor 'Main hall of royal palace' of Geun-Jeong-Jeon and In-Jeong-Jeon, based on distance of 'Eoi-Bu-Pyeong-Ju' and 'Nae-Jin-Go-Ju' of lower level, the 'Sang-Bu-Pyeong-Ju(上部平柱)' of Geun-Jeong-Jeon jut out $4{\sim}7%$ more compared to the In-Jeong-Jeon and also It becomes thicker. Fifth, the arrangement of 'Kong-Po' on the front row of 'Gan(間)' had to do with the change of side 'Gan'. Even though the Geun-Jeong-Jeon and the In-Jeong-Jeon were double floors, the arrangement of the 'Kong-Po' is different because the number of side bay is different.

• Journal of Korean Tunnelling and Underground Space Association
• /
• v.15 no.4
• /
• pp.443-453
• /
• 2013

This study aims to evaluate the mechanical behaviors of unsupported rock pillars in a room-and-pillar underground structure by a series of numerical analyses. In addition, rock pillar strengths estimated by a few empirical equations proposed for underground mines are compared with those from numerical analyses. Based on the results from the numerical analysis, the ratio of pillar strength to rock mass strength increases as the ratio of the width of a pillar to its height becomes bigger. It means that higher ratio of pillar width to its height is much more favorable for stabilizing a room-and-pillar underground structure. Especially, unsupported pillar strengths estimated from numerical analyses are higher than rock mass strength when the ratio of pillar width to height is approximately over 1.5. It is also found that the choice of an empirical equation appropriate for a given geometric condition of a pillar is important for its feasible application to the stability analysis of a pillar in the room-and-pillar method.

• Tunnel and Underground Space
• /
• v.30 no.3
• /
• pp.226-241
• /
• 2020

The stability of underground mine cavity is closely related with pillar strength. The vulnerability of pillars can be judged and reinforced if the pillar strength is known. The pillar strength is affected by characteristics of discontinuities and shape of a pillar. The change of pillar strength due to a discontinuity passing through the center of a pillar, width-to-height ratio of a pillar and small joints existing within a pillar was analyzed using PFC 3D. The result showed that the pillar strength is influenced by dip angle of a discontinuity and it increases as width-to-height ratio of a pillar increases. The pillar strength decreases as the number of contained joints increases. The relationship between total trace length observable from the pillar surface and the pillar strength was regressed with exponential function. The correlation coefficient of the regression was high enough so that pillar strength can be predicted using total trace length if a joint set exists in a pillar. Lastly, the method to estimate the strength of a pillar that includes two joint sets was proposed if the joint dip angles are 60°, 30°. The method also need total trace lengths of two joint sets.

• Explosives and Blasting
• /
• v.35 no.3
• /
• pp.1-8
• /
• 2017

In this paper, parametric studies are conducted to evaluate the contribute effect of multi layered room and pillar mine structures by underground accidental explosions. Influence of PPV(Peak Particle Velocity) obtained from large explosion at a multi layered room and pillar mine was numerically simulated by using AUTODYN. Parameters for contribution rate Analysis was analyzed by the robust design method. Orthogonal array is $L_9(3^4)$, which was adopted in this study, the parameters were pillar height, pillar width, mine span and sill pillar of 3 levels. Results of analysis showed that bottom mine of vertical direction from explosion point are most affected by pillar height, followed by sill pillar thickness, mine span and pillar width. Parameters affecting adjacent mine of horizontal direction from explosion are in the order of pillar width, mine span, pillar height and sill pillar thickness.

• Journal of the Semiconductor & Display Technology
• /
• v.16 no.1
• /
• pp.65-69
• /
• 2017

This paper presents a Technology-CAD (TCAD) simulation of the characteristics of crystalline Si pillar array solar cells. The junction depth and the surface concentration of the solar cells were optimized to obtain the targeted sheet resistance of the emitter region. The diffusion model was determined by calibrating the emitter doping profile of the microscale silicon pillars. The dimension parameters determining the pillar shape, such as width, height, and spacing were varied within a simulation window from ${\sim}2{\mu}m$ to $5{\mu}m$. The simulation showed that increasing pillar width (or diameter) and spacing resulted in the decrease of current density due to surface area loss, light trapping loss, and high reflectance. Although increasing pillar height might improve the chances of light trapping, the recombination loss due to the increase in the carrier's transfer length canceled out the positive effect to the photo-generation component of the current. The silicon pillars were experimentally formed by photoresist patterning and electroless etching. The laboratory results of a fabricated Si pillar solar cell showed the efficiency and the fill factor to be close to the simulation results.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.4
• /
• pp.9-15
• /
• 2009

Compared to the flip-chip process using solder bumps, Cu pillar bump technology can accomplish much finer pitch without compromising stand-off height. Flip-chip process with Cu pillar bumps can also be utilized in radio-frequency packages where large gap between a chip and a substrate as well as fine pitch interconnection is required. In this study, Cu pillars with and without Sn caps were electrodeposited and flip-chip-bonded together to form the Cu-Sn-Cu sandwiched joints. Contact resistances and die shear forces of the Cu-Sn-Cu sandwiched joints were evaluated with variation of the height of the Sn cap electrodeposited on the Cu pillar bump. The Cu-Sn-Cu sandwiched joints, formed with Cu pillar bumps of $25-{\mu}m$ diameter and $20-{\mu}m$ height, exhibited the gap distance of $44{\mu}m$ between the chip and the substrate and the average contact resistance of $14\;m{\Omega}$/bump without depending on the Sn cap height between 10 to $25\;{\mu}m$.

• Geomechanics and Engineering
• /
• v.28 no.5
• /
• pp.463-475
• /
• 2022

In the mine exploitation stage; one of the critical issues is the stability assessment of post-pillars. The instability of post-pillars leads to serious safety hazards in mining operations. The focus of this study is to assess the stability of post-pillars in the 130# stope in the central ore body at Trepça hard rock mine by employing both conventional (i.e., critical span curve) and numerical methods (i.e., FLAC3D). Moreover, a new numerical based index (i.e., Pillar Yield Ratio-PYR) was proposed. The aim of PYR index is to determine a border line between stable, potentially unstable, and failure state of post-pillars at a specific mine site. The critical value of pillar width to height ratio is 2.5 for deep production stopes (e.g., > 800 m). Results showed that pillar size, mining height and mining depth significantly have affected the post-pillar stability. The reliability of numerical based index (i.e., PYR) is verified based on empirical underground pillar stability graph developed by Lunder, 1994. The proposed pillar yield ratio index and pillar stability graph can be used as a design tool in new mining areas at Trepça hard rock mine and for other situations with similar geotechnical conditions.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.67-73
• /
• 2009

Compared to the chip-bonding process utilizing solder bumps, flip chip process using Cu pillar bumps can accomplish fine-pitch interconnection without compromising stand-off height. Cu pillar bump technology is one of the most promising chip-mounting process for RF packages where large gap between a chip and a substrate is required in order to suppress the parasitic capacitance. In this study, Cu pillar bumps and Sn bumps were electroplated on a chip and a substrate, respectively, and were flip-chip bonded together. Contact resistance and chip shear force of the Cu pillar bump joints were measured with variation of the electroplated Sn-bump height. With increasing the Sn-bump height from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance was improved from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$ and the chip shear force increased from 3.8 N to 6.8 N. On the contrary, the aspect ratio of the Cu pillar bump joint decreased from 1.3 to 0.9. Based on the variation behaviors of the contact resistance, the chip shear force, and the aspect ratio, the optimum height of the electroplated Sn bump could be thought as 20 ${\mu}m$.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.27-32
• /
• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Journal of Industrial Technology
• /
• v.24 no.A
• /
• pp.139-155
• /
• 2004

A room and pillar mining method has been adopting at the Jeungsun limestone mine. To check stability of pillar with multiple and irregular openings, the size, shape and spacing of rib pillar were first designed using some empirical suggestions. The Finite Difference Method(FDM)was used to analyze the pillar stability. Twelve different cases with the variation of K(horizontal/vertical stress)values, different height and different spacing of pillar were used in this study. Finally Mohr-Coulomb criterion was adopted to calculate the safety factors. Horizontal and vertical displacement, maximum and minimum principal stresses, range of plastic zone and safety factors were calculated at each case. As a result of analysis, the size of one block is 160m long, 70m wide, 40m high with 20m wide rib pillar and 20m square column pillar. The overall recovery at this case can be estimated about 40%.