• Journal of the Korean Society for Precision Engineering
• /
• v.25 no.3
• /
• pp.101-108
• /
• 2008

Residual stress is one of the causes which make defects in engineering components and materials. Many methods have been developing to measure the residual stress. Though these methods provide the information of the residual stress, they also have disadvantage like a little damage, time consumption, etc. In this paper, we devised a new experimental technique to measure residual stress in materials with a combination of laser speckle pattern interferometry and spot heating. The speckle pattern interferometer measures in-plane deformation during the heat provides for much localized stress relief. 3-D shape is used for determining heat temperature and other parameters. The residual stresses are determined by the amount of strain that is measured subsequent to the heat and cool-down of the region being interrogated. A simple model is presented to provide a description of the method. In this paper, we could experimentally confirm that residual stress can be measured by using laser interferometry and spot heating method.

• Journal of the Korean institute of surface engineering
• /
• v.46 no.4
• /
• pp.162-167
• /
• 2013

Encapsulation is required since organic materials used in OLED devices are fragile to water vapor and oxygen. Laser sealing method is currently used where IR laser is scanned along the glass-frit coated lines. Laser method is, however, not suitable to encapsulating large-sized glass substrate due to the nature of sequential scanning. In this work we propose a new method of encapsulation using Joule heating. Conductive layer is patterned along the sealing lines on which the glass frit is screen printed and sintered. Electric field is then applied to the conductive layer resulting in bonding both the panel glass and the encapsulation glass by melting glass-frit. In order to obtain uniform bonding the temperature of a conductive layer having a shape of closed loop should be uniform. In this work we conducted simulation for heat distribution according to the structure of a conductive layer used as a Joule-heat source. Uniform temperature was obtained with an error of 5% by optimizing the structure of a conductive layer. Based on the results of thermal simulations we concluded that Joule-heating induced encapsulation would be a good candidate for encapsulation method especially for large area glass substrate.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.26 no.10
• /
• pp.1427-1435
• /
• 2002

The main aim of the present article is numerically to investigate the micro-scale heat transfer phenomena in a silicon microstructure irradiated by picosecond-to-femtosecond ultra-short laser pulses. Carrier-lattice non-equilibrium phenomena are simulated with a self-consistent numerical model based on Boltzmann transport theory to obtain the spatial and temporal evolutions of the lattice temperature, the carrier number density and its temperature. Especially, an equilibration time, after which carrier and lattice are in equilibrium, is newly introduced to quantify the time duration of non-equilibrium state. Significant increase in carrier temperature is observed for a few picosecond pulse laser, while the lattice temperature rise is relatively small with decreasing laser pulse width. It is also found that the laser fluence significantly affects the N 3 decaying rate of Auger recombination, the carrier temperature exhibits two peaks as a function of time due to Auger heating as well as direct laser heating of the carriers, and finally both laser fluence and pulse width play an important role in controlling the duration time of non-equilibrium between carrier and lattice.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.07a
• /
• pp.119-126
• /
• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.16 no.4
• /
• pp.22-26
• /
• 1979

Microlenses with an extremely small radius of curvature are efficiently use d to couple LED/laser diode light into optica1 fiber. We propose a Tapered lens for the highly efficient coupling of the optical fiber communication light souses into the fiber. Ray optical analysis shows that the maximum coupling efficiency is as high as 90 %, Tapered lens with optimum parameters are fabricated by using heating and pulling technique. Experiment shows that this new technique improves the coupling efficiency by two and four times for LED and laser diode, respectively, as compared with the simple flat - end coupling.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2008.11a
• /
• pp.51-54
• /
• 2008

Various types of beam distributions of high energy lasers are classified by the mode patterns. We study two dimensional laser initiation of confined energetic materials with multiple beam profiles.

• Proceedings of the KIEE Conference
• /
• 1994.07b
• /
• pp.1425-1427
• /
• 1994

Laser ablation of glass substrates (8K-7 and synthetic quartz) using a transversely excited atmospheric (TEA) $CO_2$ laser has been inverstigated to obtain high speed etching. The ablation occurs by local heating of a substrate with a focused TEA-$CO_2$ laser beam. The dependence of ablation rate on pulse count and repetition-rate of laser has been discussed.

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2005.06a
• /
• pp.32-39
• /
• 2005

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2008.11a
• /
• pp.709-710
• /
• 2008

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.19 no.1
• /
• pp.105-112
• /
• 2018

This paper proposes a method for fabricating heatable glass using the conduction characteristics of metal thin films deposited on the surface of Low-e(Low emissivity) glass. The heating value of Low-e glass depends on the Joule heat caused by Low-e glass sheet resistance. Hence, its prediction and design are possible by measuring the sheet resistance of the material. In this study, silver electrodes were placed at 50 mm intervals on a soft Low-e glass sample with a low emissivity layer of 11 nm. This study measured the sheet resistance using a 4-point probe, predicted the power consumption and heating value of the Low-e glass, and confirmed the heating performance through fabrication and experience. There are two conventional methods for manufacturing heatable glass. One is a method of inserting nichrome heating wire into normal glass, and the other is a method of depositing a conductive transparent thin film on normal glass. The method of inserting nichrome heating wire is excellent in terms of the heating performance, but it damages the transparency of the glass. The method for depositing a conductive transparent thin film is good in terms of transparency, but its practicality is low because of its complicated process. This paper proposes a method for manufacturing heatable glass with the desired heating performance using Low-e glass, which is used mainly to improve the insulation performance of a building. That is by emitting a laser beam to the conductive metal film coated on the entire surface of the Low-e glass. The proposed method is superior in terms of transparency to the conventional method of inserting nichrome heating wire, and the manufacturing process is simpler than the method of depositing a conductive transparent thin film. In addition, the heat characteristics were compared according to the patterning of the surface thin film of the Low-e glass by an emitting laser and the laser output conditions suitable for Low-e glass.