• The Transactions of the Korean Institute of Electrical Engineers P
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• v.58 no.1
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• pp.67-71
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• 2009

This research is a new structure of the semiconductor substrate heating apparatus in which the assembly and expansion are possible. The fast thermo-responsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. There is no problem with the deformation interpreted in the state where it assembles the block of a several of the simulation result structure, the safety, and the stress. In addition, it is confirmed that building a large-size heating block is possible since the temperature deflection of the manufactured plate is lower than the standard value.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.57 no.4
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• pp.408-411
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• 2008

As to this research is new structure of the semiconductor substrate heating apparatus. The fast thermoresponsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. For this, it adheres closely to the substrate, in which the photosensitive film is coated and the heating plate layer, adhering closely to the floor side of a substrate the mica layer which adheres closely to the floor side of the upper heating plate layer in order to minimize an insulation and heat loss, and the lower part of the mica layer and it is comprised of the floor plate layer. The heating plate layer forms the continued groove portion over the floor side whole. The sheath heater for heating a substrate is inserted with the groove portion and the heating plate layer is comprised. It is confirmed that by using the new substrate heating structure, the temperature change of the heating plate against the time is observed. Then, there is the electric power saving effect of about 40% in comparison with the existing method.

• Journal of Ocean Engineering and Technology
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• v.17 no.1
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• pp.72-79
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• 2003

This paper deals with the development of an interface program for automatic plate forming, which can exchange information between the heating line information generation program and the automatic heating apparatus. In this paper, the performance of the developed interface program has been verified from the view point of numerical position control. By applying the interface program to the operation of the automatic heating apparatus, an experiment of line heating has been conducted for several steel plate models. Based on the experimental results, a simplified relation to estimate angular distortion has keen derived as a natural characteristic of the present automatic heating apparatus. As a result of the present study, the prototype of the automatic plate forming system has been constructed, and its application to the real surface models found in the ship will be presented in the near future.

• Progress in Superconductivity and Cryogenics
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• v.25 no.2
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• pp.14-18
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• 2023

Superconducting layers deposited on the metal substrate using the pulsed laser deposition process (PLD) play a crucial role in exploring new applications of superconducting wires and enhancing the performance of superconducting devices. In order to improve the superconducting property and increase the throughput of superconducting wire fabricated by pulsed laser deposition, high temperature heating device is needed that provides high temperature stability and strong durability in high oxygen partial pressure environments while minimizing performance degradation caused by surface contamination. In this study, new heating device have been developed for PLD process that deposit and growth the superconducting material continuously on substrate using reel-to-reel transportation apparatus. New heating device is designed and fabricated using iron-chromium-aluminum wire and alumina tube as a heating element and sheath materials, respectively. Heating temperature of the heater was reached over 850 ℃ under 700 mTorr of oxygen partial pressure and is kept for 5 hours. The experimental results confirm the effectiveness of the developed heating device system in maintaining a stable and consistent temperature in PLD. These research findings make significant contributions to the exploration of new applications for superconducting materials and the enhancement of superconducting device performance.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.199-204
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• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.363-367
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• 2009

For the liquid rocket propulsion system using liquid oxygen as oxidizer, helium for pressurizing LOX is usually stored in the LOX tank with cryogenic temperature. For that kind of pressurizing system, cryogenic helium is discharged from the immerged pressurant cylinder and passes through the heat exchanger downstream of gas generator. During the process, helium pressurant is heated from cryogenic temperature to high one and supplied to the ullage of propellant tank. To develop the pressurizing system, a cryogenic heating apparatus is needed to simulate the heat exchanger. In this paper, the cryogenic heating apparatus for development of the pressurization system is presented along with its heating test results with cryogenic helium.

• Journal of the Korean Society of Propulsion Engineers
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• v.15 no.1
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• pp.63-68
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• 2011

For the liquid rocket propulsion system using liquid oxygen as oxidizer, helium for pressurizing LOX is usually stored in the LOX tank with cryogenic temperature. For that kind of pressurizing system, cryogenic helium is discharged from the immerged pressurant cylinder and passes through the heat exchanger downstream of gas generator. During the process, helium pressurant is heated from cryogenic temperature to high one and supplied to the ullage of propellant tank. To develop the pressurizing system, a cryogenic heating apparatus is needed to simulate the heat exchanger. In this paper, the cryogenic heating apparatus for development of the pressurization system is presented along with its heating test results with cryogenic helium.

• Transactions of Materials Processing
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• v.16 no.4 s.94
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• pp.282-287
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• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C\;to\;150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

• Proceedings of the KIEE Conference
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• 2002.11d
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• pp.257-259
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• 2002

With development of Circuit technology, accuracy of dielectric or induction heating apparatus was developed. This study aims at realization of food insecticidal apparatus using dielectric heating. Equipment to measure grain's permittivity or vermin's permittivity and expectation for heating temperature by computer simulation is necessary for construction of the system. And the effect of extermination of vermin for food was confirmed by experiment using the system.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1123-1129
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• 2010

In order to apply the Sievert's type automatic apparatus to thermal analysis of hydrogen absorbing materials, the dehydrogenation of the Mg-H system was investigated. As the initial wt% of hydrogen was increased to 4.4, the peak temperature of evolution rate shifted to higher temperature. However, with the initial wt% of hydrogen higher than 4.4, peak temperature of evolution rate did not change. The peak temperatures of evolution rate obtained by automatic apparatus were almost the same as those measured by a manual apparatus. As the heating rate was increased, the peak temperatures increased; the peak temperatures for heating rates 1, 2 and 3 K/min were 664, 687 and 702 K, respectively. The activation energy for the decomposition of Mg hydride was 101 kJ/mol. The Sievert's type automatic apparatus can be successively applied to the thermal analysis of metal hydride.