• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1258-1263
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• 2004

The present study proposes a new structure for a heat spreader which could embody a thin thickness, any shapes and high heat flux per unit area. It is on the structure for the formation of vapor passages and the support of the case of the heat spreader. A screen mesh is used as the one. To verify the validity of the one, the heat spreader of 1.4mm and 1.6mm thickness was made with 14 mesh and 100 mesh number. In this paper, The performance test of heat spreader conducted in order to compare with the heat transfer performance of conventional heat pipe. As the results, The heat spreader has excellent cooling and heat transfer performance.

• Journal of the Korean Solar Energy Society
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• v.31 no.4
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• pp.95-102
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• 2011

In this paper, the thermal performance of a heat spreader module for CPV(Concentrating Photovoltaic) cooling is experimentally investigated. In order to evaluate the thermal performance of the heat spreader module which consists of a Metal PCB and an aluminum alloy heat spreader, experiments are conducted with varying the type of the metal PCB, the thickness of the heat spreader, the inclination angle, and the applied heat flux. To validate the experimental data, three dimensional numerical simulations are performed using the commercial simulation tool in the present work. The experimental results are compared with the corresponding numerical results and are in close agreement with the numerical results. From the experimental results, the temperature difference between the maximum temperature and the ambient temperature increases with decreasing the thickness of the heat spreader and with increasing the applied heat flux. Also, it is found that the inclination angle significantly affects the thermal performance of the heat spreader. the maximum temperature difference of the heat spreader with the horizontal orientation is much larger than that with the vertical orientation.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.273-276
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• 2007

A natural graphite heat spreader increased the upper operating temperature limit of a CCFL backlit LCD television. A 0-80W heat source was used to simulate additional electronics. Without the heat spreader, internal circuitry shut-down at ${\sim}30;$ no shut-down occurred above 80W with a heat spreader. Additionally, brightness, temperature uniformity, and operating ranges were improved, verified by environmental chamber performance testing at various ambient conditions.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.77-82
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• 2000

Parametric study fur the cooling characteristic investigation of a notebook PC mounted with heat spreader has been numerically performed. Two oases of air-blowing and air-exhaust at inlet were tested. The cooling effect on Parameters such an, velocities of air-blowing and air-exhaust, materials of heat spreader, and CPU powers were simulated for two cases. Cooling performance in the case of air-blowing was better than the case of air-exhaust.

• Journal of Mechanical Science and Technology
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• v.17 no.7
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• pp.1063-1072
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• 2003

Direct immersion cooling has been considered as one of the promising methods to cool high power density chips. A fluorocarbon liquid such as FC-72, which is chemically and electrically compatible with microelectronic components, is known to be a proper coolant for direct immersion cooling. However, boiling in this dielectric fluid is characterized by its small value of the critical heat flux. In this experimental study, we tried to enhance the critical heat flux by increasing the nucleate boiling area in the heat spreader (Conductive Immersion Cooling Module). Heat nux of 2 MW/㎡ was successfully removed at the heat source temperature below 78$^{\circ}C$ in FC-72. Some modified boiling curves at high heat flux were obtained from these modules. Also, the concept of conduction path length is very important in enhancing the critical heat flux by increasing the heat spreader surface area where nucleate boiling occurs.

• Journal of the Korean Solar Energy Society
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• v.35 no.1
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• pp.1-8
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• 2015

In the present study, the effects of the heat spreader thickness and the heat sink size on the thermal performance of a cooling device for a concentrating photovoltaic (CPV) module were numerically investigated. Numerical simulation was conducted by using the simulation tool ICEPAK, commercial software based on the finite volume method. Numerical results were validated by comparing the existing experimental data. The thermal performance of a cooling device, which consisted of a heat spreader and a natural convective heat sink, was evaluated with varying the heat spreader thickness and the heat sink size. The geometric configuration of the natural convective heat sink, such as the fin height, the fin spacing, and the fin thickness, was optimized by using the existing correlation. The numerical results showed that the thermal performance of the cooling device increased as the heat spreader thickness or the heat sink size increased. Also, it was found that the spreading thermal resistance plays an important role in the thermal performance of the cooling device which has the localized heat source.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.402-407
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• 2001

This paper reports a result of numerical heat transfer analysis for heat spreader with various ribs. Four different ribs are compared in this study. In general, the heat transfer on a vertical plate is enhanced when a rib is attached as the surface area increases, and the growth of the boundary layer is interrupted. However, for a low flow less than 0.1m/s, it is observed that the heat transfer is sensitive to the height of a rib: it decreases as the height increases. Among the four ribs, the H-shaped rib showed better performance than other ribs.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.40.2-40.2
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• 2005

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.6
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• pp.766-775
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• 2001

Parametric study to investigate the cooling performance of a notebook PC mounted with heat spreader has been numerically performed. Two cases of air-blowing and air-exhaust at inlet were tested. The cooling effect on parameters such as, inlet velocities in the cases of air-blowing and air-exhaust, materials of heat spreader, and CPU powers were simulated for two cases. Cooling performance in the case of air-blowing was better than the case of air-exhaust.