• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.7
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• pp.1-12
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• 2014

This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.

• Transactions of Materials Processing
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• v.7 no.2
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• pp.139-149
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• 1998

The technology of Semi-Solid Forging(SSF) has been actively developed to fabricate near net shape products using light and hardly formable materials. Generally the SSF process is composed of slug is compressed during a certain holding time in order to completely fill the die cavity and accelerate the solidification rate. The decision of compression time is important since it can affect microstructural characteristics, mechanical properties and shape of products.. In order to determine it proper overall heat transfer coefficient between the slug and dies should be investigated. This paper presents the procedure to find the overall heat transfer coefficient between the slug and dies by nonlinear optimization of temperature and solid fraction for a cylindrical slug at compression step in closed-die semi-solid forging. In finite ele-ment heat transfer analysis release of latent heat during solidification was considered. The influence of the predicted compression time on miscrostructural characteristics mechanimcal properties and shape of products is finally investigated by experiment.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.06a
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• pp.174-182
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• 1997

The technology of Semi-Solid Forging (SSF) has been actively developed to fabricate near-net-shape products using light and hardly formable materials. Generally, the SSF process is composed of slug heating, forming, compression -holding and ejecting step. After forming step in SSF, the slug is compressed during a certain holding time in order to be completely filled in the die cavity and be accelerated in solidification rate. The compression holding time that can affect microstructural characteristics and shape of products is important to make decision, where it is necessary to find overall heat transfer coefficient properly which has large effect on heat transfer between slug and die. This paper presents the procedure to predict compression holding time of obtaining the final shaped part with information of temperature and solid fraction for a cylindrical slug at compression holding step in closed-die compression process using heat transfer analysis considering latent heat by means of finite element method. The influence of the predicted compression holding time on microstructural characteristics of products is finally investigated by experiment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.199-203
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• 1995

The technology of Semi-Solid Forging (SSF) has been actively developed to fabricate near-net- shape products using light and hardly formable materials, the SSF process is composed of slug heating, forming, compression holding and ejecting step. After forming step in SSF, the slug is compressed during a certain holding time in order to be completely filled in the die cavity and be accelerated in solidification rate. The compression holding time that can affect mechanical properties and shape of products is important to make decision, where it is necessary to find overall hert transfer coefficeient properly which has large effect on heat transfer between slug and die. This paper presents the procedure to predict compression holding time of octaining the final shaped part with information of temperature and solid fraction for a cylindrical slug at compression hoiding step in closed-die compression process using heat transfer analysis considering latent heat by means of finite element method. The influence of the predicted compression hoiding time on mechanical properties of products is finally investigated by experiment.

• Transactions of the Korean Society of Automotive Engineers
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• v.4 no.1
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• pp.187-197
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• 1996

Many investigations have been made to determine the pressure drop and heat transfer characteristics for single phase flow in tape generated swirl flow. But few studies have been carried out to investigate the heat transfer in two component, two phase swirl flow with non-boiling. An experimental study has been conducted to determine the effects of tape twist ratios on two phase convective heat transfer coefficients, pressure drop, and void fraction distribution in a non-boiling, air-water, two phase flow. The flow conditions were both swirl and non swirl flows. The internal diameter of the test section is 42.5mm. The tape twist ratios of pitch to diameter ratio varied from 4.0 to 10.6. The heating conditions were isothermal and nonisothermal. The flow patterns identified with experiments were bubbly, bubbly-slug, slug, and slug-annular flow in up-flow. This study has concluded that no significant difference in void fraction distribution were observed both isothermal and nonisothermal conditions, the pressure drop for two phase flow with twisted tape swirler increase as the tape twist ratio decrease, and that values of two phase heat transfer coefficient increase when the tape twist ratio decreases.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.191-191
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• 2009

In this paper, we have confirmed the temperature of LED chip and McPCB with thermal simulation program which is CFDedign V10 for analysis the thermal flow of HP LED package. we have known that the heat from LED chip is transferred through heat slug to copper layer of McPCB. the temperature of LED chip shows 85.11 [$^{\circ}C$], which shows the temperature gap of 7.52 [$^{\circ}C$] against McPCB. the gap of temperature affect reliability of the wire bonding and die attachment. therefore, copper layer of heat slug on the McPCB should designed with the largest dimension.

• Journal of Mechanical Science and Technology
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• v.17 no.10
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• pp.1507-1519
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• 2003

The two-phase flow patterns for both non-loop and loop type oscillating capillary tube heat pipes (OCHPs) were presented in this study. The detailed flow patterns were recorded by a high-speed digital camera for each experimental condition to understand exactly the operation mechanism of the OCHP. The design and operation conditions of the OCHP such as turn number, working fluid, and heat flux were varied. The experimental results showed that the representative flow pattern in the evaporating section of the OCHP was the oscillation of liquid slugs and vapor plugs based on the generation and growth of bubbles by nucleate boiling. As the oscillation of liquid slugs and vapor plugs was very speedy, the flow pattern changed from the capillary slug flow to a pseudo slug flow near the annular flow. The flow of short vapor-liquid slug-train units was the flow pattern in the adiabatic section. In the condensing section, it was the oscillation of liquid slugs and vapor plugs and the circulation of working fluid. The oscillation flow in the loop type OCHP was more active than that in the non-loop type OCHP due to the circulation of working fluid in the OCHP. When the turn number of the OCHP was increased, the oscillation and circulation of working fluid was more active as well as forming the oscillation wave of long liquid slugs and vapor plugs in the OCHP. The oscillation flow of R-142b as the working fluid was more active than that of ethanol and the high efficiency of the heat transfer performance of R -142b was achieved.

• Journal of the Korean Society of Visualization
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• v.17 no.3
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• pp.52-58
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• 2019

Thermal performance and flow patterns inside the closed loop pulsating heat pipe (CLPHP) were experimentally investigated. For investigating the effect of working fluids, CLPHP was filled with various working fluids including methanol, acetone and ethanol. The thermal resistance was calculated by temperatures in evaporator and condenser and flow patterns were visualized by a digital camera. The thermal resistances for all fluids were decreased as the heat increases. Flow patterns change from static slug to elongated slug flows, bulk circulation and annular flows as the heat increases. Dry-out occurs after annular flows. For reasonable comparison of thermal performances, normalized CHF, Kutateladze number (K_u), was compared. Even though ethanol has smallest CHF, K_u of ethanol is similar with that of methanol. In addition, acetone has the highest K_u that means CLPHP with acetone provides the higher thermal performance compared with CLPHP with other fluids.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.597-601
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• 1997

The technology of Semi-Solid Forging(SSF) has been actively developed to fabricate near-net shape products using light and hardly formable materials. Generally, the SSF process is composed of slug heating,forming,compression holding and ejecting step. After forming step in SSF, the slug is comperssed during a certain holding time in order to be completely filled in the die cavity and be accelerated in solidification rate. This paper presents the analysis of temperature,solid fraction and shrinkage at compression holding step for a cylindrical slug,then predicts the solidification time to obtain the final shaped part. Enthalpy-based finite element analysis is performed to solve the heat transfer problem considering phase change in solidification.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.10
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• pp.102-108
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• 1997

The technology of Semi-Solid Forging (SSF) has been actively developed to fabricate near-net- shape products using light and hardly formable materials. Generally, the SSF process is composed of slug heating, forming, compression holding and ejecting step. After forming step in SSF, the slug is compressed during a certain holding time in order to be completely filled in the die cavity and be accelerated in solidification rate. This paper presents the analysis of temperature, solid fraction and shrinkage at compression holding step for a cylindrical slug, then predicts the solidification time to obtain the final shaped part. Enthalpy-based finite element analysis is performed to solve the heat transfer problem considering phase change in solidification.