• Title/Summary/Keyword: Heat Transfer Response

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A Study on the Boiling Heat Transfer Characteristics Using Loop Type Thermosyphon

  • HAN, Kyu-il;CHO, Dong-Hyun
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.52 no.3
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    • pp.257-262
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    • 2016
  • Flexible two-phase thermosyphons are devices that can transfer large amounts of heat flux with boiling and condensation of working fluid resulting from small temperature differences. A flexible two-phase thermosyphon consists of a evaporator, an insulation unit, and a condenser. The working fluid inside the evaporator is evaporated by heating the evaporator in the lower part of the flexible two-phase thermosyphon and the evaporated steam rises to the condenser in the upper part to transfer heat in response to the cooling fluid outside the tube. The resultant condensed working fluid flows downward along the inside surface of the tube due to gravity. These processes form a cycle. Using R134a refrigerant as the working fluid of a loop type flexible two-phase thermosyphon heat exchanger, an experiment was conducted to analyse changes in boiling heat transfer performances according to differences in the temperature of the oil for heating of the evaporator, the temperature variations of the refrigerant, and the mass flows. According to the results of the present study, the circulation rate of the refrigerant increased and the pressure in the evaporator also increased proportionally as the temperature of the oil in the evaporator increased. In addition, the heat transfer rate of the boiler increased as the temperature of the oil in the evaporator increased.

Shape Optimization of A Twist Mixing Vane in Nuclear Fuel Assembly (핵연료 봉다발내 비틀린 혼합날개의 형상최적설계)

  • Jung, Sang-Ho;Kim, Kwang-Yong
    • The KSFM Journal of Fluid Machinery
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    • v.12 no.4
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    • pp.7-13
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    • 2009
  • The purposes of present work are to analyze the convective heat transfer with three-dimensional Reynolds-averaged Navier-Stokes analysis, and to optimize shape of the mixing vane using the analysis results. Response surface method is employed as an optimization technique. The objective function is defined as a combination of inverse of heat transfer rate and friction loss. Two bend angles of mixing vane are selected as design variables. Thermal-hydraulic performances have been discussed and optimum shape has been obtained as a function of weighting factor in the objective function. The results show that the optimized geometry improves the heat transfer performance far downstream of the mixing vane.

SHAPE OPTIMIZATION OF A Y-MIXING VANE IN NUCLEAR FUEL ASSEMBLY (핵연료 봉다발내 Y 혼합날개의 형상최적설계)

  • Jung, S.H.;Kim, K.Y.;Kim, K.H.;Park, S.K.
    • Journal of computational fluids engineering
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    • v.14 no.2
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    • pp.1-8
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    • 2009
  • The purposes of present work are to analyze the convective heat transfer with three-dimensional Reynolds-averaged Navier-Stokes analysis, and to optimize shape of the mixing vane taken tolerance into consideration by using the analysis results. Response surface method is employed as an optimization technique. The objective function is defined as a combination of heat transfer rate and inverse of pressure drop. Two bend angles of mixing vane are selected as design variables. Thermal-hydraulic performances have been discussed and optimum shape has been obtained as a function of weighting factor in the objective function. The results show that the optimized geometry improves the heat transfer performance far downstream of the mixing vane.

Numerical Solution of Steady Flow and Heat Transfer around a Rotating Circular Cylinder (가열된 회전원주를 지나는 정상유동 및 열전달해석)

  • 부정숙;이종춘
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.17 no.12
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    • pp.3135-3147
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    • 1993
  • A numerical method is presented which can solve the steady flow and heat transfer from a rotating and heated circular cylinder in a uniform flow for a range of Reynolds number form 5 to 100. The steady response of the flow and heat transfer is simulated for various spin parameter. The effects on the flow field and heat transfer characteristics known as lift, drag and heat transfer coefficient are analyzed and the streamlines, velocity vectors, vorticity, temperature distributions around it were scrutinized numerically. As spin parameter increases the region of separation vortex becomes smaller than upper one and the lower region will vanish. The lift force, a large part is due to the pressure force, increases as the Reynolds number and it increases linearly as spin parameter increases. The pressure coefficient changes rapidly with spin parameter on the lower surface of the cylinder and the vorticity is sensitive to the spin parameter near separation region. As spin parameter increases the maximum heat coefficient and the thin thermal layer on front region are moved to direction of rotation. However, with balance between the local increase and decrease, the overal heat transfer coefficient is almost unaffected by rotation.

Analysis on the Effect of Operating Conditions on the Thermal Response of Electronic Assemblies during Infrared Reflow Soldering (적외선 리플로 솔더링시 작동조건이 전자조립품의 열적반응에 미치는 영향 분석)

  • Kim, Sung-Kwon;Son, Young-Seok;Shin, Jee-Young
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.1063-1068
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    • 2004
  • A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.

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Analysis on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering (강제대류-적외선 리플로 솔더링시 전자조립품의 열적반응 분석)

  • 손영석;신지영
    • Journal of Welding and Joining
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    • v.21 no.6
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    • pp.46-54
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    • 2003
  • The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

Flame Dynamic Response to Inlet Flow Perturbation in a Turbulent Premixed Combustor (난류 예혼합 연소기에서의 흡입 유동 섭동에 대한 화염의 동적 거동)

  • Kim, Dae-Sik
    • Journal of the Korean Society of Combustion
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    • v.14 no.4
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    • pp.48-53
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    • 2009
  • This paper describes the forced flame response in a turbulent premixed gas turbine combustor. The fuel was premixed with the air upstream of a choked inlet to avoid equivalence ratio fluctuations. To impose the inlet flow velocity, a siren type modulation device was developed using an AC motor, rotating and static plates. Measurements were made of the velocity fluctuation in the nozzle using hot wire anemometry and of the heat release fluctuation in the combustor using chemiluminescence emission. The test results showed that flame length as well as geometry was strongly dependent upon modulation frequency in addition to operating conditions such as inlet velocity. Convection delay time between the velocity perturbation and heat release fluctuations was calculated using phase information of the transfer function, which agreed well with the results of flame length measurements. Also, basic characteristics of the flame nonlinear response shown in the current test conditions were introduced.

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Sensitivity Analysis on the Thermal Response of Electronic Components during Infrared Reflow Soldering (적외선 리플로 솔더링시 전자부품의 열적반응 민감도 분석)

  • 손영석;신지영
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.14 no.1
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    • pp.1-9
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    • 2002
  • The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.

Optimal Design of a Parallel-Flow Heat Exchanger by Using a Response Surface Method (반응표면법을 이용한 평행류 열교환기의 설계인자 최적화)

  • Oh, Seok-Jin;Lee, Kwan-Soo
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.1028-1033
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    • 2004
  • The heat and flow characteristics in a single-phase parallel-flow heat exchanger was examined numerically to obtain its optimal shape. A response surface method was introduced to predict its performance approximately with respect to design parameters over design domain. Design parameters are inflow and outflow angle of the working fluid and horizontal and vertical location of inlet and outlet. The evaluation of the relative priority of the design parameters was performed to choose three important parameters in order to use a response surface method. A JF factor was used as an evaluation characteristic value to consider the heat transfer and the pressure drop simultaneously. The JF factor of the optimum model, compared to that of the base model, was increased by about 5.3%.

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Heat transfer analysis of closed-loop vertical ground heat exchangers using 3-D fluid flow and heat transfer numerical model (3차원 열유체 수치해석을 통한 현장 시공된 수직 밀폐형 지중열교환기의 열전달 거동 평가)

  • Park, Moon-Seo;Lee, Chul-Ho;Min, Sun-Hong;Kang, Shin-Hyung;Choi, Hang-Seok
    • Proceedings of the Korean Geotechical Society Conference
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    • 2010.09a
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    • pp.800-807
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    • 2010
  • In this study, a series of numerical analyses has been performed in order to evaluate the performance of a full-scale closed-loop vertical ground heat exchanger constructed in Wonju. The circulation pipe HDPE, borehole and surrounding ground were modeled using FLUENT, a finite-volume method (FVM) program, for analyzing the heat transfer process of the system. Two user-defined functions (UDFs) accounting for the difference in the temperatures of the circulating inflow and outflow water and the change of the surrounding ground temperature with depth were adopted in the FLUENT model. The thermal properties of materials estimated in laboratory were used in the numerical analyses to compare the thermal efficiency of the cement grout with that of the bentonite grout used in the construction. The results of the simulation provide a verification of the in situ thermal response test data. The numerical model with the ground thermal conductivity of 4W/mK yielded the simulation result closer to the in-situ thermal response test than with the ground thermal conductivity of 3W/mK. From the results of the numerical analyses, the effective thermal conductivities of the cement and bentonite grouts were obtained to be 3.32W/mK and 2.99 W/mK, respectively.

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