• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.7
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• pp.19-25
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• 2014

In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

• International journal of advanced smart convergence
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• v.2 no.2
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• pp.19-22
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• 2013

As the demand of the LED for lighting that emits light by p-n junction is increasing, studies on heatproof plate technology is being conducted to minimize the temperature of the LED lighting. As for the temperature of the LED devices, their light emitting efficiency decreases and the maximum lifespan drops down to 1/5. Therefore there are heat dissipation studies going on to minimize the heat. For LED heat dissipation, aluminum heat sink plates are mostly used. For this paper, we designed heat sink that fits residential 20W COB LED Down Light; packaged the heat sink and 20W COB and analyzed and evaluated the thermal properties through a Solidworks flow simulation. We are planning to design the optimal heat sink plate to solve the thermal agglomeration considering TIM(Thermal Interface material).

• Korean Journal of Materials Research
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• v.15 no.12
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• pp.829-832
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• 2005

Thermal analysis of new designed heat-sink models was carried out according to the natural ana the forced convection using computational fluid dynamics(CFD). Heat resistance of wave type, top vented wave type and plate type of heat sink was compared with each other As the direction of fin and air flow are vertical(z-axis), it is shown that radiant heat performance of all of heat sinks was superior than other experimental conditions. Especially, the heat resistance of top vented wave heat sink was $0.17^{\circ}C/W$(forced convection) and $0.48^{\circ}C/W$(natural convection). The radiant heat performance of heat sink was increased with increasing the height of fin and the width of fin pitch.

• International Journal of Air-Conditioning and Refrigeration
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• v.13 no.2
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• pp.71-82
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• 2005

The shape of $7\times7$ pin-fins heat sink is optimized numerically to obtain the minimum pressure drop and thermal resistance. In this study, the fin height (h), fin width (w), and fan-to-heat sink distance (c) are chosen as the design variables and the pressure drop $({\Delta}P)$ and thermal resistance $(\theta_j)$ are adopted as the objective functions. To obtain the optimum design values, we used the finite volume method for calculating the objective functions, the BFGS method for solving the unconstrained non-linear optimization problem, and the weighting method for predicting the multi-objective problem. The results show that the optimum design variables for the weighting coefficient of 0.5 are as follows: W=4.653 mm, h=59.215mm, and c=2.667mm. The objective functions corresponding to the optimal design are calculated as ${\Delta}P=6.82$ Pa and $(\theta_j)=0.56K/W$. The Pareto solutions are also presented for various weighting coefficients and they will offer very useful data to design the pin-fins heat sink.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.8
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• pp.701-709
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• 2001

In this days, heat pipe heat sink has been widely applied to power controllers for railway substations to remove heat from power semiconductors(diodes or thyristors). The heat pipe heat sink consists of a aluminum heating block for mounting the thyristor, 2~3 heat pipes and large number of aluminum fins. The present study was to get fundamental informations of the structure, design parameters and heat transfer performances of heat pipe heat sink. Series of operational test for a unit with 3 heat pipes were performed and its heat flow circuit was analysed from the experimentally obtained data on wall temperature distribution. Total resistance was ranged 0.02~$0.03^{\circ}C$/W for a power range from 40W to400W. The time to get the steady state was approximately longer than 20 minutes, and overshooting was not occurred during start up operation.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.10
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• pp.860-869
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• 2003

Design optimization of the heat sink with 7${\times}$7 square pin-fins is performed numerically using the Computational Fluid Dynamics (CFD) and the Computer Aided Optimization (CAO). In the pin-fins heat sink, the optimum design variables for fin height (h), fin width (w), and fan-to-heat sink distance (c) can be achieved when the thermal resistance ($\theta$$_{j}$) at the junction and the overall pressure drop ($\Delta$p) are minimized simultaneously. To complete the optimization, the finite volume method for calculating the objective functions, the BFGS method for solving the unconstrained non-linear optimization problem, and the weighting method for predicting the multi-objective problem are used. The results show that the optimum design variable for the weighting coefficient of 0.5 are as follows: w=4.653 mm, h=59.215 mm, and c=2.667 mm. In this case, the objective functions are predicted as 0.56K/W of thermal resistance and 6.91 Pa of pressure drop. The Pareto optimal solutions are also presented.re also presented.d.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.7 no.1
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• pp.20-25
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• 2014

There are several severe problems for LED device, the next generation's economy green lighting: as the temperature increases, the lamp efficiency decreases; if the temperature is over $80^{\circ}C$, the lifetime of lighting decreases; Red Shift phenomenon that wavelength of spectrum line moves toward long wavelength occurs; and optical power decreases as $T_j$ increases. Thus, Heat sink design that can minimize the heat of LED device is currently in progress. While the thermal resistance of COB Type LED was reduced by direct coupling of LED chip to the board, residential 13.5W requires Heat sink in order resolve heat issue. This study designed Heat Sink suitable for residential 13.5W COB LED down-light and selected the optimum Fin thickness through flow simulation that packaged the designed Heat Sink and 13.5W COB. And finally it analyzed and evaluated the thermal modes using contacting thermometer.

• The Transactions of the Korean Institute of Power Electronics
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• v.24 no.6
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• pp.428-437
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• 2019

Analytical thermal models based on average convection heat transfer are frequently used for the design and selection of forced air-cooled plate fin heat sinks. In this paper, a convection heat transfer model within a ±10% margin of error was presented through experimental investigation. Five types of heat sinks with inlet widths of 1.7-6.8 mm were tested at 50-160 W heat sources to derive and verify the model. Causes of error between the experiment and analytical thermal model were analyzed and listed to design the heat sink. Using proposed method and the lists to be considered in the paper, a quick and accurate heat sink design of the power-conversion system is expected.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.551-552
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.421-422
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• 2010