• 한국전기전자재료학회논문지
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• 제28권3호
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• EDISON SW 활용 경진대회 논문집
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• 제4회(2015년)
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• pp.500-509
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• 2015

This paper presents the single objective design optimization of plate-fin heat sink equipped with fan cooling system using Genetic Algorithm. The proper heat sink and fan model are selected based on the previous studies. And the thermal resistance of heat sinks and fan efficiency during operation are calculated according to specific design parameters. The objective function is combination of thermal resistance and fan efficiency which have been taken to measure the performance of the heat sink. And Decision making procedure is suggested considering life time of semiconductor and Fan Operating cost. And also Analytical Model used for optimization is validated by Fluent, Ansys 13.0 and this model give a quite reasonable and reliable design.

• Journal of Mechanical Science and Technology
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• 제18권9호
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• pp.1590-1603
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• 2004

In this study the optimization of plate-fin type heat sink with vortex generator for the thermal stability is performed numerically. The optimum solutions in the heat sink are obtained when the temperature rise and the pressure drop are minimized simultaneously. Thermal performance of heat sink is influenced by the heat sink shape such as the base-part fin width, lower-part fin width, and basement thickness. To acquire the optimal design variables automatically, CFD and mathematical optimization are integrated. The flow and thermal fields are predicted using the finite volume method. The optimization is carried out by means of the sequential quadratic programming (SQP) method which is widely used for the constrained nonlinear optimization problem. The results show that the optimal design variables are as follows; B$_1$=2.584 mm, B$_2$=1.741 mm, and t=7.914 mm when the temperature rise is less than 40 K. Comparing with the initial design, the temperature rise is reduced by 4.2 K, while the pressure drop is increased by 9.43 Pa. The relationship between the pressure drop and the temperature rise is also presented to select the heat sink shape for the designers.

• Design & Manufacturing
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• 제12권1호
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• pp.31-35
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• 2018

The peltier thermoelectric module are used to cool the heat generated by electronic equipment. In order to increase the efficiency of the peltier thermoelectric module, the heat must be released to the outside. A heat sink is used to discharge such heat to the outside. in this paper, two types of heat sinks with internal tunnels were designed. And the heating and cooling performance of the heat sink with internal tunnel structure was compared and analyzed through ANSYS. The heat sink of the A type had better heat transfer than the heat sink of the B type. Which is about 70% improved.

• 설비공학논문집
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• 제14권8호
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• pp.664-670
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• 2002

A heat sink (HS) system using heat pipes for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150w at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. To do so, however, the interior temperature distribution had to be verified by experimental results. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.

• 한국CDE학회지
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• 제21권2호
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• pp.39-49
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• 2015

This paper presents the single objective design optimization of plate-fin heat sink equipped with fan cooling system using Genetic Algorithm. The proper heat sink and fan model are selected based on the previous studies. And the thermal resistance of heat sinks and fan efficiency during operation are calculated according to specific design parameters. The objective function is combination of thermal resistance and fan efficiency which have been taken to measure the performance of the heat sink. And Decision making procedure is suggested considering life time of semiconductor and Fan Operating cost. And also Analytical Model used for optimization is validated by Fluent, Ansys 13.0 and this model give a quite reasonable and reliable design.

• Transactions on Electrical and Electronic Materials
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• 제13권6호
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• pp.292-296
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• 2012

An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found. The simulated temperature of the heat sink when operating the LED down-light is $55.9^{\circ}C$, which is only a difference of $2^{\circ}C$ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is $3^{\circ}C$ lower than without the copper spreader.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• 제3권2호
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• pp.147-156
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• 1999

A numerical simulation has been carried out for the performance characterization of heat sinks in electronic equipment. Heat transfer characteristics have been analyzed for various design parameters including the shape of heat sink, thickness of fin base and fin pitches. A commercial program called Flotherm has been employed for the numerical calculation. Optimal design of the heat sink has been persued which is closely related with the reduction of heat resistance involved in conduction and convection of heat.

• 한국산학기술학회논문지
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• 제14권2호
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• pp.523-528
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• 2013

본 실험에서는 산업용 발전 설비에 사용되는 인버터 내부의 압입형과 압출형 두 종류 히트싱크의 방열 성능을 평가하였다. 실험에 사용된 압입형 히트싱크는 62개의 핀을 가지고 있고, 압출형은 38개의 핀을 가지고 있으며 두 히트싱크의 외형의 크기는 같다. 반면 압출형 히트싱크는 핀의 표면에 반경 1mm의 곡률을 주어 전열면적을 압입형과 같게 하였다. 결과적으로 압입형과 압출형 히트싱크는 전체 입력열량에 대해 각각 70.7%, 63.8%를 방열하였다. 입력열량 중 나머지는 자연대류 및 복사를 통해 외부로 방열되었다. 압출형 히트싱크는 단순히 핀의 개수로 보면 압입형 히트싱크보다 40% 감소했지만, 방열양은 6.9% 만 감소하였다. 이는 표면 곡률을 통한 유효 전열면적의 증가와 압출형 히트싱크의 상대적으로 우수한 전열특성의 효과로 판단하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1472-1475
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• 2004

Current processor power consumption has dramatically increased and already reached 115 Watts. Therefore, Heat sink design needs more high accuracy in 1U server. The target performance of heat sink is very dependent of fin geometry and it is also seriously affected by design conditions such as fan type, air duct shape and heatsink design parameters. The present paper investigates the behavior of heat sink performance under various conditions. The present work addresses pressurized type plane fin heat sinks having dimension of 40 mm by 40 mm by 56 mm fan.