• 제목/요약/키워드: Heat Dissipation Design

검색결과 149건 처리시간 0.025초

적외선 열화상을 활용한 리튬 이온 ESS의 방열설계 성능평가에 관한 연구 (A Performance Evaluation of a Heat Dissipation Design for a Lithium-Ion Energy Storage System Using Infrared Thermal Imaging)

  • 김은지;이경일;김재열
    • 한국기계가공학회지
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    • 제19권5호
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    • pp.105-110
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    • 2020
  • The global battery market is rapidly growing due to the development of vehicles(EV) and wireless electronic products. In particular logistics robots, which hielp to produce EVs, have attracted much interest in research in Korea Because logistics sites and factories operate continuously for 24 hours, the technology that can dramatically increase the operation time of the logistics equipment is rapidly developing, and various high-level technologies are required for the batteries used in. for example, logistics robots. These required technologies include those that enable rapid battery charging as well wireless charging to charge batteries while moving. The development of these technologies, however, result in increasing explosions and topical accidents involving rapid charging batteries These accidents due to the thermal shock caused by the heat generated during the charging of the battery cell. In this study, a performance evaluation of a heat dissipation design using infrared thermal imaging was performed on an energy storage systrm(Ess) applied with an internal heat conduction cooling method using a heating plate.

히트싱크 및 히트 스프레더를 이용한 고밀도 발열 전자부품의 방열 구조에 관한 연구 (A Study on Cooling for High Thermal Density Electronics Using Heat Sink and Heat Spreader)

  • 강성욱;김호용;김진천
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2286-2291
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    • 2008
  • Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

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Thermal Characteristics of the Optimal Design on 20W COB LED Down Light Heat Sink

  • Kwon, Jae-Hyun;Lee, Jun-Myung;Huang, Wei;Park, Keon-Jun;Kim, Yong-Kab
    • International journal of advanced smart convergence
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    • 제2권2호
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    • pp.19-22
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    • 2013
  • As the demand of the LED for lighting that emits light by p-n junction is increasing, studies on heatproof plate technology is being conducted to minimize the temperature of the LED lighting. As for the temperature of the LED devices, their light emitting efficiency decreases and the maximum lifespan drops down to 1/5. Therefore there are heat dissipation studies going on to minimize the heat. For LED heat dissipation, aluminum heat sink plates are mostly used. For this paper, we designed heat sink that fits residential 20W COB LED Down Light; packaged the heat sink and 20W COB and analyzed and evaluated the thermal properties through a Solidworks flow simulation. We are planning to design the optimal heat sink plate to solve the thermal agglomeration considering TIM(Thermal Interface material).

Analysis of the experimental cooling performance of a high-power light-emitting diode package with a modified crevice-type vapor chamber heat pipe

  • Kim, Jong-Soo;Bae, Jae-Young;Kim, Eun-Pil
    • Journal of Advanced Marine Engineering and Technology
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    • 제39권8호
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    • pp.801-806
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    • 2015
  • The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.

고 용융점 소재의 압출적층성형을 위한 우수한 방열특성을 갖는 3차원 프린터 nozzle부 기구설계 (Structural Design of 3D Printer Nozzle with Superior Heat Dissipation Characteristics for Deposition of Materials with High Melting Point)

  • 김완진;이상욱
    • 한국전자통신학회논문지
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    • 제15권2호
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    • pp.313-318
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    • 2020
  • 300도 이상의 높은 용융점을 갖는 소위 엔지니어링 플라스틱은 기구적인 강성과 내화학성 및 마찰 및 마모성능이 우수하여 여러 산업에서 금속을 대체하는 소재로 각광받고 있다. 본 연구에서는 용융적층모델링 공법을 기반으로 하는 3D 프린터에서 높은 용융점을 갖는 엔지니어링 플라스틱을 조형할 수 있도록 방열특성이 우수한 3D 프린터 nozzle부의 구조를 설계하고 이를 해석적으로 검증하였다. 높은 온도로 가열되는 heat block과 필라멘트가 이송되는 nozzle상부 간의 단열 및 신속한 냉각을 위하여, 열전도계수가 낮은 열차단부(heat brake부)를 2중으로 구성하였고, 열차단부에 생성되는 열이 냉각핀을 통해 대기에 의해 냉각되는 구조를 적용하였다. 개선된 nozzle부 구조설계를 통해 종래 3D 프린터의 BCnozzle과 비교할 때, heat sink부에서의 온도를 50% 가량 낮출 수 있었으며, heat block에 직접적으로 연결된 heat brake부 최종단의 정상상태 온도를 14% 가량 낮출 수 있었다.

밀폐 형 전장 박스 온도 제어를 위한 히트 펌프 설계 (Design of Heat Pump for Temperature Control of Sealed Electric Box)

  • 이영태
    • 반도체디스플레이기술학회지
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    • 제19권2호
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    • pp.110-114
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    • 2020
  • In this paper, a heat pump using a Peltier device was developed for heat dissipation in a sealed electric box. The heat pump was designed with a cooling fin attached to both sides of the Peltier device, and a fan was mounted on the cooling fin on the hot side to increase the efficiency. The heat dissipation efficiency could be improved by directly connecting the electronic component having high heat to the cooling fin using a heat conducting wire. The fabricated heat pump was designed to operate only in the temperature range set by the temperature control system to improve the problem of high power consumption of the Peltier element.

실리콘 고분자 복합소재의 열전도도와 기계적 물성에 관한 연구 (A Study on the Thermal Conductivity and Mechanical Properties of Electrical Insulation Polymer Composite Materials)

  • 최원일;최계광
    • Design & Manufacturing
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    • 제18권3호
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    • pp.37-43
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    • 2024
  • With the development of technology in the electrical and electronic field, research on heat dissipation materials that can efficiently emit and control heat to solve the heat generation problem is being actively conducted. Since heat dissipation materials require electrical insulation and thermal conductivity, the polymer composite material was manufactured by mixing chemically stable silicone resins and ceramic fillers, and thermal conductivity and mechanical properties were observed. At the same filling amount, the larger the particle size and the higher the high thermal conductivity filler was added, the higher the thermal conductivity was, mechanical properties were confirmed to have higher tensile strength and elongation as the particles were smaller and the tissue was denser. After selecting materials in consideration of thermal conductivity and mechanical properties, an appropriate mixing ratio is considered important.

Study on heat transfer characteristics and structural parameter effects of heat pipe with fins based on MOOSE platform

  • Xiaoquan Chen;Peng Du;Rui Tian;Zhuoyao Li;Hongkun Lian;Kun Zhuang;Sipeng Wang
    • Nuclear Engineering and Technology
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    • 제55권1호
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    • pp.364-372
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    • 2023
  • The space reactor is the primary energy supply for future space vehicles and space stations. The radiator is one of the essential parts of a space reactor. Therefore, the research on radiators can improve the heat dissipation power, reduce the quality of radiators, and make the space reactor smaller. Based on MOOSE multi-physics numerical calculation platform, a simulation program for the combination of heat pipe and fin at the end of heat pipe radiator is developed. It is verified that the calculation result of this program is accurate and the calculation speed is fast. Analyze the heat transfer characteristics of the combination with heat pipe and fin, and obtain its internal temperature field. Based on the calculation results, the influence of structural parameters on the heat dissipation power is analyzed. The results show that when the fin width is 0.25 m, fin thickness is 0.002 m, condensing section length is 0.5425 m and heat pipe radius is 0.014 m, the power-mass ratio is the highest. When the temperature is 700K-900K, the heat dissipation power increases 41.12% for every 100K increase in the operating temperature. Smaller fin width and thinner fin thickness can improve the power-mass ratio and reduce the radiator quality.

Concepts of heat dissipation of a disposal canister and its computational analysis

  • Minseop Kim;Minsoo Lee;Jinseop Kim;Seok Yoon
    • Nuclear Engineering and Technology
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    • 제55권11호
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    • pp.4173-4180
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    • 2023
  • The stability of engineered barriers in high-level radioactive waste disposal systems can be influenced by the decay heat generated by the waste. This study focuses on the thermal analysis of various canister designs to effectively lower the maximum temperature of the engineered barrier. A numerical model was developed and employed to investigate the heat dissipation potential of copper rings placed across the buffer. Various canister designs incorporating copper rings were presented, and numerical analysis was performed to identify the design with the most significant temperature reduction effect. The results confirmed that the temperature of the buffer material was effectively lowered with an increase in the number of copper rings penetrating the buffer. Parametric studies were also conducted to analyze the impact of technical gaps, copper thickness, and collar height on the temperature reduction. The numerical model revealed that the presence of gaps between the components of the engineered barrier significantly increased the buffer temperature. Furthermore, the reduction in buffer temperature varied depending on the location of the gap and collar. The methods proposed in this study for reducing the buffer temperature hold promise for contributing to cost reduction in radioactive waste disposal.

히트파이프 및 스택핀을 이용한 50W급 옥외용 LED 모듈개발 (Development of Outdoor 50W-LED Module using Heat-pipe and Stack-fin)

  • 홍석기;정희석;염정덕
    • 조명전기설비학회논문지
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    • 제29권12호
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    • pp.15-21
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    • 2015
  • We proposed 50W-LED modules of using Heat-pipe and Stack-fin and produced LED modules was evaluated heat dissipation characteristics with comparison of the conventional die-casting type. It verified the application of products by applying it to 150W-LED road luminaires through simulation. The LED module was measures aimed design temperature of the Stack-fin and showed 26% upward heat dissipation effect than a conventional die-casting type. The luminous efficacy of 150W-LED road luminaires using this LED module reached over 112lm/W, and the simulation results showed average of horizontal luminance, overall luminance uniformity($U_O$) and lane luminance uniformity($U_I$) that is suitable for five-lane road with the KS standards.