• 오토저널
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• 제11권5호
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• pp.65-75
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• 1989

A method for analyzing the heat dissipation rates of automotive radiators has been proposed and also a new model equation of heat transfer rate of louvered fins has been proposed and tested. With the method, the effect of various design parameters on the performance of a radiator has also been studied. The proposed model equation for air-side heat transfer has made fair predictions which agree well with the experiments. Also the design value of heat dissipation rate with various fin pitches and radiator size has a good agreement with the heat dissipation of the commercial automotive radiators. Thus, the method of analyzing the radiator performance proposed in this study might be used to design new automotive radiators.

• 전력전자학회논문지
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• 제9권4호
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• pp.350-355
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• 2004

본 논문에서는 열원인 전력용 반도체 소자와 방열판 및 팬으로 구성된 강제 냉각방식 방열 시스템을 먼저 해석 가능한 요소로 나눈 후 각 요소에 대한 해석적이거나 실험적인 설계 식을 제시하고 이를 적용한 설계 방법을 제안하였다. 제안한 방법으로 400kW급 IGBT 인버터용 강제 냉각방식 방열 시스템을 설계하고 제작하였다. 실험결과는 설계 온도가 실험치에 대해 10［%］ 오차 범위 내에서 잘 일치함을 검증하여 제안한 해석적인 정상상태 설계방법의 타당성을 보였다.

• 한국전기전자재료학회논문지
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• 제29권2호
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• pp.125-130
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• 2016

In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $25^{\circ}C$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $55^{\circ}C$ when the optimal heat dissipation design was applied.

• 대한기계학회논문집B
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• 제29권4호
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• pp.526-536
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• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• 한국수소및신에너지학회논문집
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• 제31권1호
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• pp.112-121
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• 2020

In this work energy and entransy characteristics of heat exchangers are analyzed for 12 different flow arrangements of heat exchangers. The dimensionless parameters are number of entransy dissipation (Ng), number of entransy dissipation-based thermal resistance (Nr), and entransy dissipation-based effectiveness of heat-exchanger (εg). The dimensionless parameters are expressed analytically in terms of the effectiveness of heat exchanger (ε), heat capacity ratio (c), and number of transfer unit (N) for optimal performance of heat exchangers. Results showed that the dimensionless parameters based on the entransy dissipation can be useful concepts for optimal design of heat exchangers.

• 한국전산유체공학회지
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• 제11권2호
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• pp.32-39
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• 2006

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

• 전자통신동향분석
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• 제38권6호
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• 한국항행학회논문지
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• 제24권4호
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• pp.261-266
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• 2020

항공기 장착물에 KW급 전력변환장치가 탑재되는 경우, 전력 변환 시 발생하는 대량의 발열에 대한 방열설계가 고려되어야 한다. 적절한 방열을 하지 못하는 경우, 장비 오작동 및 화재의 우려가 발생하며 이는 항공기 운항에 있어 치명적인 요인이 될 수 있다. 본 논문은 항공기 장착물에 탑재되는 KW급 전력변환장치의 방열설계에 관하여 기술하였다. 전산해석을 통한 설계 및 제작 후 시험을 수행하였으며, 고전력 변환에 따른 발열부품의 급격한 발열 현상을 확인하여 해석 모델을 보정하였다. 모델 보정 후 방열구조가 개선된 형상으로 설계를 개선하였으며, 미 군사규격인 MIL-STD-810G 의 고온동작 시험을 수행하여 개선된 형상의 타당성을 검증하였다.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2005년도 춘계 학술대회논문집
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• 한국전기전자재료학회논문지
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• 제28권2호
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.