Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Thermal Analysis for Improvement of Heat Dissipation Performance of the Rail Anchoring Failure Detection Module

레일 체결구 결함 검측 모듈의 방열성능 개선을 위한 열 해석

  • Chae, Won kyu (Department of Electronic Electrical & Computer Engineering, Sungkyunkwan University) ;
  • Park, Young (Institute of Korea Railroad Research) ;
  • Kwan, Sam young (Institute of Korea Railroad Research) ;
  • Lee, Jaehyeong (Department of Electronic Electrical & Computer Engineering, Sungkyunkwan University)
  • 채원규 (성균관대학교 전자전기공학부) ;
  • 박영 (한국철도기술연구원) ;
  • 권삼영 (한국철도기술연구원) ;
  • 이재형 (성균관대학교 전자전기공학부)
  • Received : 2015.10.27
  • Accepted : 2016.01.24
  • Published : 2016.02.01
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Abstract

In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $25^{\circ}C$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $55^{\circ}C$ when the optimal heat dissipation design was applied.

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References

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