• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.110-114
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• 2020

In this paper, a heat pump using a Peltier device was developed for heat dissipation in a sealed electric box. The heat pump was designed with a cooling fin attached to both sides of the Peltier device, and a fan was mounted on the cooling fin on the hot side to increase the efficiency. The heat dissipation efficiency could be improved by directly connecting the electronic component having high heat to the cooling fin using a heat conducting wire. The fabricated heat pump was designed to operate only in the temperature range set by the temperature control system to improve the problem of high power consumption of the Peltier element.

• Journal of Korea Foundry Society
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• v.29 no.6
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• pp.277-283
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• 2009

Recently an increase in production cost of 300 series stainless steel with a sudden increase in nickel cost has caused a decrease in demand for 300 series stainless steel so that 400 series stainless steel has begun to make a mark. Although 400 series stainless steel has good properties, it has a problem of lack of corrosion resistance. There is Ti in 400 series stainless steel alloys to solve the problem above and it has lower density than the others. For that reason, wire feeding process has been applied for adding Ti alloy in 400 series stainless steel. This paper presents consideration of variation on the depth of wire dissolution by conditions of wire feeding which are wire injection speed, the temperature of molten steel, wire diameter and bubble generation rate. The computer program for solution of conducting wire feeding has been developed in Flow3D.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.11
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• pp.755-759
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• 2016

The use of heat pipes in the electronic telecommunication field is increasing. Among the various types of heat pipes, the thin flat heat pipe has relatively high applicability compared with the circular heat pipe in the electronic packaging application. The thin flat heat pipe based on extrusion fabrication has a simple capillary wick structure consisting of rectangular cross sectional grooves on the inner wall of the pipe. Although the groove serves as a simple capillary wick, and many such grooves are provided on the inner wall, it is difficult for the grooves to realize a sufficiently high capillary force. In the present study, a thin flat heat pipe with a wire bundle was developed to overcome the drawback of poor capillary force in the thin flat heat pipe with grooves, and was evaluated by conducting tests. In the performance test, the thin flat heat pipe with the wire bundle showed a lower thermal resistance of approximately 3.4 times, and a higher heat transfer rate of approximately 3.8 times with respect to the thin flat heat pipe with grooves as the capillary wick respectively. The possibility of using the wire bundle as a capillary wick in the heat pipe was validated in the present study; further study for commercializing this concept will be taken up in the future.