• Title/Summary/Keyword: Heat Aging

Search Result 580, Processing Time 0.026 seconds

Effect of TESPT Silane Coupling Agent on Mechanical Properties of Precipitated Silica Filled NBR Compound for Oil Seal (TESPT 실란커플링제가 침전 실리카로 보강된 오일씰용 NBR복합소재의 기계적 물성에 미치는 영향)

  • Lee, Young-Seok;Hwang, Ki-Seob;Lee, Jong-Cheol;Kim, Tae-Geun;Ha, Ki-Ryong
    • Elastomers and Composites
    • /
    • v.46 no.1
    • /
    • pp.45-53
    • /
    • 2011
  • The effect of the silane coupling agent, bis(triethoxysilypropyl)tetrasulfide (TESPT), on mechanical properties of a silica-filled NBR compound for oilseal was investigated. Curing behavior and crosslinking density of the compounds were measured using ODR (oscillating disk rheometer) and swelling ratio in toluene. UTM (universal testing machine) and shore A hardness tester were used in order to study the characteristics of mechanical properties of original vulcanizates and aged ones with heated air and ASTM No. 3. oil. Recovery of elasticity which influences the performance and service life of oilseal was investigated by giving bending deformation to vulcanizates in aging condition. After bending aging test, recovery distance was measured and calculated angle of recovery from it. TR (temperature retraction) test was performed on these vulcanizates to determine the low temperature recovery behavior. Wear resistance was measured by Taber type abrasion tester. In addition, SEM was used to characterize the morphology of the worn surface of vulcanizates. The result showed that addition of TESPT into silica-filled compound improves not only compound flow-ability, interaction between NBR and silica and crosslinking density, but also hardness, 100% modulus, recovery of elasticity, wear resistance, heat resistance and ASTM No.3 oil resistance of vulcanizates.

Quality Characteristics and Volatile Flavor Compounds of Oriental Melon Wine Using Freeze Concentration (동결농축 참외와인의 품질 특성과 휘발성 향기 성분)

  • Hwang, Hee-Young;Hwang, In-Wook;Chung, Shin-Kyo
    • Journal of the Korean Society of Food Science and Nutrition
    • /
    • v.44 no.9
    • /
    • pp.1347-1355
    • /
    • 2015
  • In this study, the physicochemical properties, antioxidant capacities, and volatile flavor compounds of oriental melon wine prepared by freeze concentration after heat treatment (HA), ascorbic acid treatment (AAT), and heat and ascorbic acid treatment (HAAT) were investigated. During fermentation period, the melon wine by HAAT showed greater reduction of soluble solids and reducing sugar contents compared to other treatments. In addition, the melon wine treated with HAAT also showed a higher L value and lower browning index compared to other treatments. After aging, free sugar including fructose, and organic acids including citric acid, succinic acid, and malic acid were detected in all samples. For antioxidant activities and contents, HAAT treated wine showed greater antioxidant activities and total phenolic contents than those of others. In GC/MS analysis, a total of 33 volatile flavor compounds were identified. In the principal component analysis of volatile flavor compounds, principal components 1 and 2 represented 88.15% of the whole date distribution and showed opposite tendencies. Taken together, HAAT enhanced the antioxidant activities and sensory properties of oriental melon wine. Moreover, freeze concentration gave the different volatile flavor characteristics in oriental melon wine.

LASER SURFACE ANNEALING FOR IMPROVING HYDROGEN EMBRlTTLEMENT RESISTANCE OF AGED INCONEL 718: EVALUATION OF THE EFFECTS OF PRECIPITATES

  • Liu, Liufa;Tanaka, Katsumi;Hirose, Akio;Kobayashi, Kojiro F.
    • Proceedings of the KWS Conference
    • /
    • 2002.10a
    • /
    • pp.570-576
    • /
    • 2002
  • Application of the aged Inconel 718 in hydrogen environment is seriously restraint by its high hydrogen embrittlement (HE) sensitivity. m previous researches, we have suggested the possibility and applicability of the laser surface annealing (LSA) process in improving the HE resistance of this alloy. Sequentially, a study on the effects of the precipitates in the Inconel 718 on its HE sensitivity was conducted in this research. Firstly, flat bar specimens were heat-treated to obtain various kinds of precipitation microstructures concerning the ${\gamma}$" phase and the 6 phase. Hydrogen was charged into the specimen by a cathodic charging process. The loss in reduction of area (RA) caused by hydrogen charging was used to assess the HE sensitivity. The HE sensitivity of the alloy was lowered with decreasing the volume fraction of ${\gamma}$". Moreover, it was possible to increase the HE resistance of the aged alloy by dissolving the $\delta$ phase, keeping the strength at the same level as that of the common aged alloy. Thus, we concluded that both the $\delta$ phase and the ${\gamma}$" phase affected the HE sensitivity of Inconel 718. Next, two kinds of notch tensile specimens were fabricated, one kind having $\delta$ phase and the other having no $\delta$ phase. All these specimens were aged via the same aging heat treatment process. The LSA process annealed a thin layer of the notch bottom of each specimen. One specimen of each kind was charged with hydrogen by the cathodic hydrogen charging process. Loss in the notch tensile strength (NTS) caused by hydrogen was used to evaluate the HE sensitivity. It was found that while the HE sensitivity of conventionally aged Inconel 718 was decreased by the LSA process, the HE sensitivity of the $\delta$-free aged Inconel 718 could further be decreased. Therefore, for applications in hydrogen environments, it is possible to fabricate alloys with both good HE resistance and high strength by controlling the precipitation conditions, and to improve HE resistance further via applying the LSA process.

  • PDF

Effect of Press Temperature and Time on Physical Properties of Larch Particleboard (압체온도(壓締温度)와 시간(時間)이 낙엽송(落葉松) 파티클 보오드의 물리적(物理的) 특성(特性)에 미치는 영향(影響))

  • Lee, Phil Woo;Chung, Gyun
    • Journal of Korean Society of Forest Science
    • /
    • v.63 no.1
    • /
    • pp.12-20
    • /
    • 1984
  • This research was performed to estimate the properties of particleboard based on the press time and temperature which was made of chip of larch that grows in Korea. The results in this study were as follows: 1) Even though the chips, 1:1-35 ratio between length and thickness, are relatively bad condition, the surface smoothness that can easily spread the adhesive evenly and thoroughly and bonding ability of chips can give proper physical properties. 2) It shows more mechanical properties at the press time of 10 min. in MOR (Modulus of Rupture), MOE (Modulus of Elasticity) and SHA (Screw Holding Ability). 3) It is not significant according to the press time 20 min. in MOR, IBS (Internal Bonding Strength) and SHA, for the reciprocal actions between the accelerating aging effect of chip and the softening effect of adhesion are occured. 4) IBS is rising according to the increasing temp at the press time of 10 min. Because it needs to transfer the plate heat to make the proper hardening temp. In the layer. 5) The heat treatment effects have greatly influenced the stahility of dimension by falling the absorption, anisotropy and inhomegenity. As a result of these the values of thickness and linear expansion ratio were respectively dropped by the increase of press temp and the time and so did absorption.

  • PDF

An Experimental Study on the Effect of Reduced Slag and Gypsum on Concrete at Low Temperature(-5℃) (저온(-5℃)에서의 환원슬래그 및 석고가 콘크리트에 미치는 영향에 관한 실험적 연구)

  • Kim, Hyeong-Cheol;Choi, Hyun-Kuk;Min, Tae-Beom;An, Dong-Hee;Choi, Si-Hyun;Lee, Han-Seung
    • Journal of the Korea Institute of Building Construction
    • /
    • v.17 no.3
    • /
    • pp.279-285
    • /
    • 2017
  • In this study, the development of concrete preventing initial frost damage and durability about that were evaluated by using anti-aging agent and admixture(reduced slag). As a result of experiment, initial hydration heat was increased by $C_{12}A_7$ of reduced slag components but it was not effective to development of strength. Also fluidity decreased with increasing replacement of reduced slag. This suggested that fluidity was low by rapid setting due to absent of gypsum in reduced slag components. In case of CR2G specimen that added 4% gypsum, the flow ability was higher than plain. It is considered that concrete developed using reduced slag should use $SO_3$. Result of durability experiments, the durability decreased with increasing replacement amount of reduced slag.

Magnetic Susceptibility depending on the Thermal Degradation of HK-40 Steel (HK-40강의 열화도에 따른 자화율의 변화)

  • Kim, Jeong-Min;Son, De-Rac;Park, Jong-Seo;Nahm, Seung-Hoon;Kim, Dong-Gyun;Han, Sang-In;Choi, Song-Chun;Ryu, Dae-Hyun
    • Journal of the Korean Society for Nondestructive Testing
    • /
    • v.24 no.1
    • /
    • pp.22-28
    • /
    • 2004
  • Since the used materials of furnace heater tube with different kinds of thermal degradation were not commonly available, the HK-40 steel specimens were heat-treated isothermally at elevated temperature to simulate the microstructure at the service temperature. HK-40 steel specimens with five different aging time were prepared by isothermal heat treatment at $1050^{\circ}C$. The characteristics of the magnetic susceptibility have been investigated for the degradation evaluation of HK-40 steel. The magnetic susceptibility at room temperature increases as the extent of degradation of the materials increases. The variation of magnetic susceptibility was compared with the variation of tensile properties and Vickers hardness. To investigate the effect of the microsturctural change on the characteristics of tensile properties, hardness and magnetic susceptibility, the microstructures were examined by a scanning electron microscope(SEM) and the chemical compositions were analyzed by a energy spectrometer of SEM. As a result, the magnetic susceptibility method can be suggested as one of the nondestructive evaluation methods for the degradation of the HK-40 steel.

New Generation of Lead Free Paste Development

  • Albrecht Hans Juergen;Trodler K. G.
    • Proceedings of the International Microelectronics And Packaging Society Conference
    • /
    • 2004.09a
    • /
    • pp.233-241
    • /
    • 2004
  • A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

  • PDF

New Generation of Lead Free Solder Spheres 'Landal - Seal'

  • Walter H.;Trodler K. G.
    • Proceedings of the International Microelectronics And Packaging Society Conference
    • /
    • 2004.09a
    • /
    • pp.211-219
    • /
    • 2004
  • A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

  • PDF

Robust Wheel Slip Control for Brake-by-Wire System (Brake-by-Wire 시스템을 위한 강인한 휠 슬립 제어)

  • Hong Daegun;Huh Kunsoo;Kang Hyung-Jin;Yoon Paljoo;Hwang Inyong
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.13 no.3
    • /
    • pp.102-109
    • /
    • 2005
  • Wheel-slip control systems are able to control the braking force more accurately and can be adapted to different vehicles more easily than conventional ABS systems. But, in order to achieve the superior braking performance through the wheel-slip control, real-time information such as the tire braking force is required. For example, in the case of EHB (Electro-Hydraulic Brake) systems, the tire braking force cannot be measured directly, but can be approximated based on the characteristics of the brake disk-pad friction. The friction characteristics can change significantly depending on aging of the brake, moisture on the contact area, heat etc. In this paper, a wheel slip The proposed wheel slip control system is composed of two subsystems: braking force monitor and robust slip controller In the brake force monitor subsystem, the tire braking forces as well as the brake disk-pad friction coefficient are estimated considering the friction variation between the brake pad and disk. The robust wheel slip control subsystem is designed based on sliding mode control methods and follows the target wheel-slip using the estimated tire braking forces. The proposed sliding mode controller is robust to the uncertainties in estimating the braking force and brake disk-pad friction. The performance of the proposed wheel-slip control system is evaluated in various simulations.

Fatigue Crack Growth Behavior of a Continuous Alumina Fiber Reinforced Metal Matrix Composite Materials (알루미나 장섬유 강화 복합금속재의 피로균열성장거동)

  • Doo Hwan, Kim;Lavernia, E.J.;Earthman, J.C.
    • KSCE Journal of Civil and Environmental Engineering Research
    • /
    • v.11 no.1
    • /
    • pp.29-36
    • /
    • 1991
  • The effects of heat treatment on fatigue crack growth behavior were studied in continuously reinfored, magnesium-based composite (FP/ZE41A). Following an earlier TEM investigation, specimens were thermally aged to modify the interfacial zone between the alumina fibers and mg alloy matrix. The fatigue crack growth experiments were conducted with specimens having the fiber orientation normal to the crack growth direction(longitudinal) and also specimens with the fibers oriented parallel to the crack growth direction(transverse). A comparision of the fatigue crack growth behavior indicates that aged longitudinal specimens are more resistant to fatigue crack growth than as-fabricated longitudinal specimens. Conversely, as-fabricated transverse specimens are more resistant to fatigue crack growth than aged transverse specimens. SEM observations of fiber pullout and ductile tearing on the fatigue fracture surfaces indicate that the aging weakens the strength of the fiber/matrix interface, giving rise to the observed fatigue crack growth behavior.

  • PDF