• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.1
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• pp.7-11
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• 2010

The reduction of optical losses in mono-crystalline silicon solar cell by surface texturing is a critical step to improve the overall cell efficiency. In this study, we have changed the sub-micrometer structure on the micrometer pyramidal structure by 2-step texturing. The Ag particles were coated on the micrometer pyramid surface in $AgNO_3$ solution, and then the etching with hydrogen fluoride and hydrogen peroxide created even smaller nano-pyramids in these pyramids. As a result, we observed that the changes of size and thickness of nano structure on pyramidal surface were determined by $AgNO_3$ concentration and etching time. Using 2-step texturing, the surface of wafers is etched to resemble the rough surface of a lotus leaf. Lotus surface can reduce average reflectance from 10% to below 3%. This reflectance is less than conventional textured wafer including anti-reflection coating.

• Korean Chemical Engineering Research
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• v.44 no.5
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• pp.513-519
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• 2006

We developed two kinds of the microchip for application to electrophoresis based on both glass and quartz employing the MEMS fabrications. The poly-Si layer deposited onto the bonding interface apart from channel regions can play a role as the optical slit cutting off the stray light in order to concentrate the UV ray, from which it is possible to improve the signal-to-noise (S/N) ratio of the detection on a chip. In the glass chip, the deposited poly-Si layer had an important function of the etch mask and provided the bonding surface properly enabling the anodic bonding. The glass wafer including more impurities than quartz one results in the higher surface roughness of the channel wall, which affects subsequently on the microflow behavior of the sample solutions. In order to solve this problem, we prepared here the mixed etchant consisting HF and $NH_4F$ solutions, by which the surface roughness was reduced. Both the shape and the dimension of each channel were observed, and the electroosmotic flow velocities were measured as 0.5 mm/s for quartz and 0.36 mm/s for glass channel by implementing the microchip electrophoresis. Applying the optical slit with poly-Si layer provides that the S/N ratio of the peak is increased as ca. 2 times for quartz chip and ca. 3 times for glass chip. The maximum UV absorbance is also enhanced with ca. 1.6 and 1.7 times, respectively.

• Membrane Journal
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• v.30 no.1
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• pp.38-45
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• 2020

Although Lithium metal battery (LMB) has a very large theoretical capacity, it has a critical problem such as formation of dendrite which causes short circuit and short cycle life of the LMB. In this study, PDMS/GO composite with evenly dispersed graphene oxide (GO) nanosheets in poly (dimethylsiloxane) (PDMS) was synthesized and coated into a thin film, resulting in the effect that can physically suppress the formation of dendrite. However, PDMS has low ion conductivity, so that we attained improved ion conductivity of PDMS/GO thin film by etching technic using 5wt% hydrofluoric acid (HF), to facilitate the movement of lithium (Li) ions by forming the channel of Li ions. The morphology of the PDMS/GO thin film was observed to confirm using SEM. When the PDMS/GO thin film was utilized to lithium metal battery system, the columbic efficiency was maintained at 87.4% on average until the 100^th cycles. In addition, voltage profiles indicated reduced overpotential in comparison to the electrode without thin film.

• Korean Journal of Materials Research
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• v.8 no.10
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• pp.890-897
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• 1998

The direct wafer bonding between n-InP(001) wafer and the ${Si}_3N_4$(200 nm) film grown on the InP wafer by PECVD method was investigated. The surface states of InP wafer and ${Si}_3N_4$/InP which strongly depend upon the direct wafer bonding strength between them when they are brought into contact, were characterized by the contact angle measurement technique and atomic force microscopy. When InP wafer was etched by $50{\%}$ HF, contact angle was $5^{\circ}$ and RMS roughness was $1.54{\AA}$. When ${Si}_3N_4$ was etched by ammonia solution, RMS roughness was $3.11{\AA}$. The considerable amount of initial bonding strength between InP wafer and ${Si}_3N_4$/InP was observed when the two wafer was contacted after the etching process by $50{\%}$ HF and ammonia solution respectively. The bonded specimen was heat treated in $H^2$ or $N^2$, ambient at the temperature of $580^{\circ}C$-$680^{\circ}C$ for lhr. The bonding state was confirmed by SAT(Scannig Acoustic Tomography). The bonding strength was measured by shear force measurement of ${Si}_3N_4$/InP to InP wafer increased up to the same level of PECVD interface. The direct wafer bonding interface and ${Si}_3N_4$/InP PECVD interface were chracterized by TEM and AES.

• Analytical Science and Technology
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• v.13 no.4
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• pp.403-411
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• 2000

This study described a method of thermoluminescence dating of pottery shards using subtraction method. TL measurement was achieved using two different types of samples prepared by quartz inclusion method and fine-grain technique. Fine grains (size range: $5-10{\mu}m$) were separated by suspending grounded pottery samples into acetone solution and sedimentation quantitatively. In quartz inclusion method quartz grains in the size range of 90 to $125{\mu}m$ diameter were obtained by extracting the quartz crystals embed in the pottery shards and etching them with 1.0 M HF solutions. The archaeological dose of both the quartz and fine grains was determined from the dose calibration curves obtained from sequential irradiation of $^{137}Cs$ gamma and $^{241}Am$ alpha source to the samples and TL measurement of natural samples, in which the alpha dose of 4.60 Gy for the Packjae pottery was obtained using subtraction method. Annual alpha dose rates ($3.05{\pm}0.11$ mGy/yr.) were determined by the analysis of U, Th contents in the pottery shards and evaluation of the values with Bell's equation. Dividing the alpha dose accumulated in the pottery shards by the annual alpha dose rate, we found age of approximately $1508{\pm}80$ years B.P. (AD. ca. 492 yr.) for the Packjae pottery. It matches well with the archeological age estimate (middle of 5th century) within 10 percent uncertainty and thereby conforms the age of the pottery sample.

• Applied Chemistry for Engineering
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• v.29 no.1
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• pp.10-17
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• 2018

POU (point of use) scrubbers were applied for the treatment of waste gases including PFCs (perfluorocompounds) exhausted from the CVD (chemical vapor deposition), etching, and cleaning processes of semiconductor and display manufacturing plant. The GWP (global warming potential) and atmosphere lifetime of PFCs are known to be a few thousands higher than that of $CO_2$, and extremely high temperature more than 3,000 K is required to thermally decompose PFCs. Therefore, POU gas scrubbers based on the thermal plasma technology were developed for the effective control of PFCs and industrial application of the technology. The thermal plasma technology encompasses the generation of powerful plasma via the optimization of the plasma torch, a highly stable power supply, and the matching technique between two components. In addition, the effective mixture of the high temperature plasma and waste gases was also necessary for the highly efficient abatement of PFCs. The purpose of this paper was to provide not only a useful technical information of the post-treatment process for the waste gas scrubbing but also a short perspective on R&D of POU plasma gas scrubbers.

• Journal of Dental Rehabilitation and Applied Science
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• v.22 no.3
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• pp.221-230
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• 2006

Recently, the need for esthetic results has increased the interest for all-ceramic crown prosthesis. Furthermore, the development of zirconium core via CAD/CAM system has allowed the all ceramic restorations to be applied to almost all fixed prosthesis situations. But, the increased strength has been reported to increase in proportion with the bond strength of cement, and recently, the tribochemical system which increases the bond strength through, silica coating and silanization has been introduced. The purpose of this study was to compare the $Rocatec^{TM}$ system and $CoJet^{TM}$ system with the traditional acid etching and silanization method of the irconium based ceramic. The surface character was observed via SEM(X2000), and the bond strength with the resin cement were measured. 50 In-Ceram Zirconia (Adens, Korea) discs were fabricated and embedded in resin, group 1 was treated with glass-bead blasting and cleaning, group 2 was treated with 20% HF for 10 minutes and silanized, group 3 was treated with the $Rocatec^{TM}$ system, and group 4 was treated with the $CoJet^{TM}$ system. Each group was comprised of 10 specimens. The specimens were cemented to a $3mm{\times}5mm$ resin block with Super-Bond C&B. The shear bond strength was measured with the $Instron^{(R)}$ 8871 at a crosshead speed of 0.5mm/min. The results were as follows. 1. According to SEM results, there were little difference between group 1 & group 2, but in group 3 and 4, silica coating was detected and there was increase in surface roughness. 2. The shear bond strength decreased in the order of group 3(46.28MPa), group 4(42.04MPa), group 2(31.56MPa), and group 1(27.46MPa). 3. There was significant differnce between group 1&2 and group 3&4(p<0.05). From the results above, it can be considered that the conventional method of acid etching and silane treatment cannot increase the bond strength with resin cements, and that by applying the tribochemical system of $Rocatec^{TM}$ system and $CoJet^{TM}$ system, we can achieve a stronger all ceramic restoration. Further studies on surface treatments to increase the bond strength are thought to be needed.

• Korean Journal of Materials Research
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• v.23 no.7
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• pp.379-384
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• 2013

In order to produce size-controllable Ag nanoparticles and a nanomesh-patterned Si substrate, we introduce a rapid thermal annealing(RTA) method and a metal assisted chemical etching(MCE) process. Ag nanoparticles were self-organized from a thin Ag film on a Si substrate through the RTA process. The mean diameter of the nanoparticles was modulated by changing the thickness of the Ag film. Furthermore, we controlled the surface energy of the Si substrate by changing the Ar or $H_2$ ambient gas during the RTA process, and the modified surface energy was evaluated through water contact angle test. A smaller mean diameter of Ag nanoparticles was obtained under $H_2$ gas at RTA, compared to that under Ar, from the same thickness of Ag thin film. This result was observed by SEM and summarized by statistical analysis. The mechanism of this result was determined by the surface energy change caused by the chemical reaction between the Si substrate and $H_2$. The change of the surface energy affected on uniformity in the MCE process using Ag nanoparticles as catalyst. The nanoparticles formed under ambient Ar, having high surface energy, randomly moved in the lateral direction on the substrate even though the etching solution consisting of 10 % HF and 0.12 % $H_2O_2$ was cooled down to $-20^{\circ}C$ to minimize thermal energy, which could act as the driving force of movement. On the other hand, the nanoparticles thermally treated under ambient $H_2$ had low surface energy as the surface of the Si substrate reacted with $H_2$. That's why the Ag nanoparticles could keep their pattern and vertically etch the Si substrate during MCE.

• Journal of Sensor Science and Technology
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• v.5 no.5
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• pp.21-29
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• 1996

A piezoresistive silicon acceleration sensor with 8 beams, utilized by an unique silicon micromachining technique using porous silicon etching method which was fabricated on the selectively diffused (111)-oriented $n/n^{+}/n$ silicon subtrates. The width, length, and thickness of the beam was $100\;{\mu}m$, $500\;{\mu}m$, and $7\;{\mu}m$, respectively, and the diameter of the mass paddle (the region suspended by the eight beams) was 1.4 mm. The seismic mass on the mass paddle was formed about 2 mg so as to measure accelerations of the range of 50g for automotive applications. For the formation of the mass, the solder mass was loaded on the mass paddle by dispensing Pb/Sn/Ag solder paste. After the solder paste is deposited, Heat treatment was carried out on the 3-zone reflow equipment. The decay time of the output signal to impulse excitation of the fabricated sensor was observed for approximately 30 ms. The sensitivity measured through summing circuit was 2.9 mV/g and the nonlinearity of the sensor was less than 2% of the full scale output. The output deviation of each bridge was ${\pm}4%$. The cross-axis sensitivity was within 4% and the resonant frequency was found to be 2.15 KHz from the FEM simulation results.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.89-89
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• 2009

높은 소수반송자 수명(life-time)을 가지는 고품위 실리콘 기판은 고효율 실리콘 이종접합 태양전지 제작을 위한 중요 요소 기술 중 하나이다. 본 연구에서는 n-type c-Si 기판을 이용한 고효율 실리콘 이종접합 태양전지제작을 위해 hot water oxidation(HWO) 공정을 이용하여 고품위 실리콘 기판을 제작하였다. 실리콘 기판의 특성 분석은 Qusi-steady state photoconductance (QSSPC)를 이용하여 소수반송자 수명을 측정하였으며, 기판의 면저항 및 wetting angle을 측정하여 공정에 따른 특성변화를 분석하였다. Saw damage etching 된 기판을 웨이퍼 표면으로부터 particle, 금속 불순물, 유기물 등의 오염을 제거하기 위해 $60{\sim}85^{\circ}C$로 가열된 Ammonia수, 과산화수소수($NH_4OH/H_2O_2/H_2O$), 염산 과산화수소수($HCL/H_2O_2/H_2O$) 및 실온 희석불산(DHF) 중에 기판을 각각 10분 정도씩 침적하여, 각각의 약액 처리 후에 매회 10분 정도씩 순수(DI water)에서 rinse하여 RCA 세정을 진행한 후 HWO 공정을 통해 기판 표면에 얇은 산화막 을 형성시켜 패시베이션 해주었다. HF를 이용하여 자연산화막을 제거시 HWO 공정을 거친 기판은 매끄러운 표면과 패시베이션 영향으로 기판의 소수 반송자 수명이 증가하며, 태양전지 제작시 접촉저항을 감소시켜 효율을 증가 시킬수 있다. HWO 공정은 반응조 안의 DI water 온도와 반응 시간에 따라 life-time을 측정하여 진행하였으며, 이후 PE-CVD법으로 증착된 a-Si:H layer 및 투명전도 산화막, 금속전극을 증착하여 실리콘 이종접합 태양전지를 제작하였다.