• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.8
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• pp.853-859
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• 2014

This study presents a technique for extracting all the extrinsic parameters of HEMTs by minimizing the residual errors between a pinch-off cold-FET's gate and drain pad de-embedded Z-parameters and its modeled Z-parameters calculated by the cold-FET's remaining parameters. The presented technique allows us to successfully extract the remaining extrinsic parameter values as well as the gate and drain pad capacitance value without the additional fabrications of the gate and drain dummy pad.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.48 no.1
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• pp.97-101
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• 2011

Quad band p-HEMT SP6T switch for handset applications was developed. To achieve the low insertion loss and high isolation, trade-off between "On" state and "Off" state was considered by optimization of unit cell. Especially, in case isolation between transmit port and receive port, it was achieved by large capacitors and miniaturization of chip size was achieved by common voltage control and ground using back via process. Designed SP6T switch has size of $950um{\times}100um$ and take into consideration the gate recess error, excellent loss and isolation was confirmed in operating frequency.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.145-145
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• 2008

갈륨-질화물(GaN) 기반의 고속전자이동도 트랜지스터(high electron mobility transistor, HEMT)는 최근 마이크로파 또는 밀리미터파 등의 차세대 고주파용 전력소자로 각광받고 있다. AlGaN/GaN HEMT는 이종접합구조(heterostructure) 로부터 발생하는 이차원 전자가스(two-dimensional electron gas, 2DEG) 채널을 이용하여 높은 전자 이동도, 높은 항복전압 및 우수한 고출력 특성을 얻는 것이 가능하다. AlGaN/GaN HEMT에서 ohmic 전극 부분과 채널이 형성되는 부분과의 거리에 의한 저항의 성분을 줄이고 전자의 터널링의 확률을 증가시키기 위해서 recess된 구조가 많이 사용되고 있다. 그러나 이 구조에서는 recess된 소스와 드레인에 의해 AlGaN층의 제거로 AlGaN층의 두께에 영향을 미치며 그에 따라 채널에 생성되는 전자의 농도를 변화시키게 된다. 본 논문에서는 소스와 드레인의 Trench 구조를 제안하였다. ohmic 전극 부분과 채널간의 거리의 감소로 특성을 향상시켜서 recess 구조의 장점이 유지된다. 그리고 recess되는 소스와 드레인 영역에서 AlGaN층을 전체적으로 제거하는 것이 아니고 Trench 즉 일부분만 제거하면서 AlGaN층의 두께의 변화에 따른 문제점도 줄일 수 있다. 따라서 이러한 전극 부분을 Trench구조화 시킨 AlGaN/GaN HEMT의 DC특성을 $ATLAS^{TM}$를 이용하여 전산모사하고 최적화된 구조를 제안하였다.

• Proceedings of the IEEK Conference
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• 2000.11a
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• pp.369-372
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• 2000

본 논문에서는 P-HEMT Gate-바이어스 튜닝에 의한 위상동기 마이크로파 발진기를 설계하였다. 설계된 유전체 발진기는 병렬궤환공진 형태로서 P-HEMT의 게이트단에서 전압을 제어하여 전압제어발진기 형태로 주파수를 가변시키므로서 안정된 위상동기신호를 나타나도록 하였다. 위상동기방식은 외부에서 제공되는 125㎒의 기준주파수를 SRD로 체배시켜 하모닉 신호를 이용한 마이크로파 샘플링 위상검파 방식으로 설계하였으며, 유전체 발진기의 자유발진신호와 샘플링 신호사이의 위상비교에 의하여 ±1㎒ 범위의 고안정 특성을 갖는 13.25㎓대역의 위상고정 발진기의 동기화와 저 위상잡음을 나타내었다.

• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.313-319
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• 2017

In this paper, we present a design technique that miniaturises the DC-DC converter, a key component in the electric vehicle system, using the advanced material (Ga-N HEMT) in the LLC resonant converter and freely changes the resonant frequency. This design is also proposed to improve the efficiency and temperature characteristics by adding SR Topology in the secondary side output during the operation of power supply. In this experiment, as a consequence of the constructed circuit with the operation of high switching frequency of 200 kHz, the size of LLC and PFC was able to be minimised by 40[%]. Thus, the characteristics of operating temperature demonstrated $60-65^{\circ}C$ without a heat sink, when the temperature was measured at 250W (12V/20A). The features were all due to the advantages of the change of switching frequency, switching circuits implementation, and the maximisation of switching frequency. Based on these design results, we would like to implement more than 1 [kW].

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.11
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• pp.1-8
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• 2011

One of the most important parameters that limit maximum output power of transistor is breakdown. InAlAs/InGaAs/GaAs Metamorphic HEMTs (MHEMTs) have some advantages, especially for cost, compared with InP-based ones. However, GaAs-based MHEMTs and InP-based HEMTs are limited by lower breakdown voltage for output power even though they have good microwave and millimeter-wave frequency performance with lower minimum noise figure. In this paper, InAlAs/$In_xGa_{1-x}As$/GaAs MHEMTs are simulated and analyzed for breakdown. The parameters affecting breakdown are investigated in the fabricated 0.1-${\mu}m$ ${\Gamma}$-gate MHEMT device having the modulation-doped $In_{0.52}Al_{0.48}As/In_{0.53}Ga_{0.47}As$ heterostructure on the GaAs wafer using the hydrodynamic transport model of a 2D commercial device simulator. The impact ionization and gate field effect in the fabricated device including deep-level traps are analyzed for breakdown. In addition, Indium mole-fraction-dependent impact ionization rates are proposed empirically for $In_{0.52}Al_{0.48}As/In_xGa_{1-x}As$/GaAs MHEMTs.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.11
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• pp.1064-1073
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• 2013

In this paper, a compact 370 W high efficiency GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor) power amplifier(PA) using internal harmonic manipulation circuits is presented for cellular and L-band. We employed a new circuit topology for simultaneous high efficiency matching at both fundamental and 2nd harmonic frequency. In order to minimize package size, new 41.8 mm GaN HEMT and two MOS(Metal Oxide Semiconductor) capacitors are internally matched and combined package size $10.16{\times}10.16{\times}1.5Tmm^3$ through package material changes and wire bonded in a new package to improve thermal resistance. When drain biased at 48 V, the developed GaN HEMT power amplifier has achieved over 80 % Drain Efficiency(DE) from 770~870 MHz and 75 % DE at 1,805~1,880 MHz with 370 W peak output power(Psat.). This is the state-of-the-art efficiency and output power of GaN HEMT power amplifier at cellular and L-band to the best of our knowledge.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.10A
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• pp.1579-1587
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• 1999

Bias-dependent noise models of $0.2\mu\textrm{m}$ gate length P-HEMT's which are scalable with gate width are proposed. To predict S-parameters of the P-HEMT's the intrinsic parameters except for $\tau$ subtracted the offsets introduced in this paper are normalized to the gate width and then scaled. The small-signal model parameters are expressed as fitting functions of the drain current to $\textrm{I}_{dss}$ ratio and gate width. In addition, to estimate accurately noise parameters the noise temperature $\textrm{T}_{g}$ of the intrinsic resistance, the equivalent noise conductance $\textrm{G}_{ni}$ of the gate current noise source, and the equivalent noise conductance $\textrm{G}_{no}$ of the drain current noise source are adopted as the noise model parameters. The extracted values of $\textrm{T}_{g}$ are nearly independent of drain current and gate width and their average is around the ambient temperature. The extracted values of $\textrm{G}_{ni}$ are small enough to be neglected to the circuit characteristics. From the comparison of the noise model with only $\textrm{G}_{no}$ and that having $\textrm{T}_{g}$, $\textrm{G}_{ni}$ and $\textrm{G}_{no}$ to the measured data it is fund that even the former model is in good agreement with the measured noise parameters. Thus, from a practical point of view the noise model having only the drain current noise source is confirmed as a scalable bias-dependent model.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.4
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• pp.401-410
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• 2014

This paper presents a high-efficiency concurrent dual-band Class-E power amplifier(PA) that is based on a multi-harmonic matching network(MHMN). The proposed MHMN controls the impedance at 1.3 GHz, 2.1 GHz, and their second and third harmonics, respectively, by using transmission lines only rather than switches or lumped components. The dual-band Class-E PA is implemented using Avago ATF-50189 GaAs p-HEMT. The PA exhibits a measured output power of 27.1 dBm and 25.7 dBm, a power gain of 6.1 dB and 4.7 dB, and a drain efficiency of 71.2 % and 60.1 % at 1.3 GHz and 2.1 GHz, respectively.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.2
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• pp.83-90
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• 2000

A simple low-cost and small size 1.88-198 GHz Band RF power amplifier module is developed for IMT2000 repeater. The power amplifier consists of two stage amplifiers that the first stage amplifier is drive amplifier using discrete type P-HEMT (ATF-34143, 800 micron gate width, Agilent Technologies) and the second is power amplifier with 300Bm 1dB gain compression point using GaAs FET(EFA240D-SOT89, 2400 micron gate width, Excelics Semiconductor). this power amplifier module feature a 29.5dBm 1dB gain compression point, 29.5dB gain, 42dBm 3rd order intercept point(OIP3) and -10dB/-l2dB input/output return loss over the 1880-1980 MHz. This PA module is fully integrated using MIC technology into a small size and design by full nonlinear design technologies. The dimensions of this PA module are 42(L) $\times$ 34(W) mm.