• Title/Summary/Keyword: H-bonding

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Comparison of Coverage-Dependent Adsorption Structures of Alanine and Leucine on Ge(100): Bonding Configuration and Adsorption Stability

  • Park, Yeong-Chan;Yang, Se-Na;Kim, Jeong-Won;Lee, Han-Gil
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.215-215
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    • 2011
  • The bonding configuration and adsorption stability of alanine and leucine adsorbed on Ge(100)-2${\times}$1 surface were investigated and compared using core-level photoemission spectroscopy (CLPES) and density functional theory (DFT) calculations. The bonding configuration, stability, and adsorption energies were evaluated for two different coverage levels. In both cases, the C 1s, N 1s, and O 1s core-level spectra at a low coverage (0.30 ML) indicated that the carboxyl and amine groups participated in bonding with the Ge(100) surface in an "O-H dissociated-N dative bonded structure". At high coverage levels (0.60 ML), both this structure and an "O-H dissociation bonded structure" were present. As a result, we found that alanine adsorbs more easily (lower adsorption energy) than leucine on Ge(100) surfaces due to less steric hindrance of side chain.

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III-V/Si Optical Communication Laser Diode Technology (광통신 III-V/Si 레이저 다이오드 기술 동향)

  • Kim, H.S.;Kim, D.J.;Kim, D.C.;Ko, Y.H.;Kim, K.J.;An, S.M.;Han, W.S.
    • Electronics and Telecommunications Trends
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    • v.36 no.3
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    • pp.23-33
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    • 2021
  • Two main technologies of III-V/Si laser diode for optical communication, direct epitaxial growth, and wafer bonding were studied. Until now, the wafer bonding has been vigorously studied and seems promising for the ideal III-V/Si laser. However, the wafer bonding process is still complicated and has a limit of mass production. The development of a concise and innovative integration method for silicon photonics is urgent. In the future, the demand for high-speed data processing and energy saving, as well as ultra-high density integration, will increase. Therefore, the study for the hetero-junction, which is that the III-V compound semiconductor is directly grown on Si semiconductor can overcome the current limitations and may be the goal for the ideal III-V/Si laser diode.

Antibacterial and remineralization effects of orthodontic bonding agents containing bioactive glass

  • Kim, You-Min;Kim, Dong-Hyun;Song, Chang Weon;Yoon, Seog-Young;Kim, Se-Yeon;Na, Hee Sam;Chung, Jin;Kim, Yong-Il;Kwon, Yong Hoon
    • The korean journal of orthodontics
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    • v.48 no.3
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    • pp.163-171
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    • 2018
  • Objective: The aim of this study was to evaluate the mechanical and biological properties of orthodontic bonding agents containing silver- or zinc-doped bioactive glass (BAG) and determine the antibacterial and remineralization effects of these agents. Methods: BAG was synthesized using the alkali-mediated solgel method. Orthodontic bonding agents containing BAG were prepared by mixing BAG with flowable resin. $Transbond^{TM}$ XT (TXT) and $Charmfil^{TM}$ Flow (CF) were used as controls. Ion release, cytotoxicity, antibacterial properties, the shear bond strength, and the adhesive remnant index were evaluated. To assess the remineralization properties of BAG, micro-computed tomography was performed after pH cycling. Results: The BAG-containing bonding agents showed no noticeable cytotoxicity and suppressed bacterial growth. When these bonding agents were used, demineralization after pH cycling began approximately 200 to $300{\mu}m$ away from the bracket. On the other hand, when CF and TXT were used, all surfaces that were not covered by the adhesive were demineralized after pH cycling. Conclusions: Our findings suggest that orthodontic bonding agents containing silver- or zinc-doped BAG have stronger antibacterial and remineralization effects compared with conventional orthodontic adhesives; thus, they are suitable for use in orthodontic practice.

Joining of Multi Nodes of a Titanium Bicycle by the Superplastic Hydroforming and Diffusion Bonding Technology (티타늄 자전거의 다중 조인트 접합을 위한 초소성 하이드로포밍과 확산 접합 기술)

  • Yoo, Y.H.;Lee, S.Y.
    • Transactions of Materials Processing
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    • v.28 no.1
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    • pp.15-20
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    • 2019
  • The superplastic forming/diffusion bonding process has been developed to fabricate a core frame structure with joint nodes out of tubes, for the development of a titanium high performance bicycle. The hydroforming process has been applied for bulging of a tube in the superplastic condition before, and during the diffusion bonding process. In this experiment, a commercial Ti-3Al-2.5V tube was selected as raw material for the study. The forming experiment has been performed using a servo-hydraulic press with a capacity of 200 ton. Next, nitrogen gas was used to acquire necessary pressure for the bulging and bonding of the tubes to fabricate the joint nodes. The pertinent processing temperature was $870^{\circ}C$ for the superplastic hydroforming/diffusion bonding (SHF/DB) process, using the Ti-3Al-2.5V tube. The bonding quality and the progress of bulging and diffusion bonding have been observed by the investigation of the joining interfaces at the cross section of the joint structure. The control of the nitrogen pressure throughout the SHF/DB process, was an important factor to avoid any significant defects in the joint structure. The whole progress stage of the diffusion bonding could be observed at a joint interface. A core structure with 5 joint nodes to manufacture a titanium bicycle could be obtained in a SHF/DB process.

Bonding Stress Analysis of Cable Fairings used in Small Guided Missiles and Strength Tests of Bonding Materials (유도무기 케이블 페어링의 강도 해석 및 접착재 강도 시험)

  • Goo, N.-S.;Yoo, K.-J.;Shin, Y.-S.;Lee, Y.-H.;Cheong, H.-Y.;Kim, B.-H.
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.33 no.6
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    • pp.76-82
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    • 2005
  • Cable fairings of guided missiles are generally used for protection of electric cables under aerodynamic heating and mechanical loading. The stress distributions between a cable fairing and missile main body along a cable fairing are necessary for its design. In this paper, a method for bonding stress and strength analysis of a cable fairing has been investigated and its computer program developed. Tensile and three-point bending tests of generally used bonding materials were also conducted to supply basic material properties for design of cable fairings.

Study About Measurement of Interfacial Bonding Strength of STS/Al Clad sheet by Blanking Process (블랭킹 공정을 이용한 STS/Al 클래드 판재의 계면 접합력 측정에 관한 연구)

  • Kim, T.H.;Lee, K.S.;Kim, J.H.;Moon, Y.H.;Lee, Y.S.;Yoon, E.Y.
    • Transactions of Materials Processing
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    • v.27 no.5
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    • pp.267-275
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    • 2018
  • The clad sheet material is produced by a roll-bonding process of one or more materials with different properties. Good formability of clad sheet material is an essential property in to deform a clad metal sheet into a part or component. Performance of the clad sheet material largely depends on interfacial bond strength between different materials. In this study, interfacial bond strength of STS/Al clad sheet was analyzed by varying experimental parameters using a blanking process. Experimental parameters are the punching speed, clearance, and stacking order of plate materials. In addition, blanking test results were compared with bond strengths measured by the T-peel test, that analyzes interface bonding strength of the standard clad sheet. The blanking process was analyzed by the finite element method under the sticking condition of interface of different materials, and experimental results and analysis results were compared.