• Title/Summary/Keyword: H-bonding

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Characteristics of porous 3C-SiC thins formed by anodization (양극 산화법으로 형성된 다공질 3C-SiC 막의 특성)

  • Kim, Kang-San;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.45-45
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    • 2009
  • This paper describes the formation of porous 3C-SiC by anodization. 3C-SiC thin films were deposited on p-type Si(100) substrates by APCVD using HMDS (Hexamethyildisilane: $Si_2(CH_3)_6$). UV-LED(380 nm) was used as a light source. The surface morphology was observed by SEM and the pore size was increased with increase of current density. Pore diameter of 70 ~ 90 nm was achieved at 7.1 $mA/cm^2$ current density and 90 sec anodization time. FT-IR was conducted for chemical bonding of thin film and porous 3C-SiC. The Si-H bonding was observed in porous 3C-SiC around wavenumber 2100 $cm^{-1}$. PL shows the band gap enegry of thin film (2.5 eV) and porous 3C-SiC (2.7 eV).

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Synthesis of Cysteine Capped Silver Nanoparticles by Electrochemically Active Biofilm and their Antibacterial Activities

  • Khan, Mohammad Mansoob;Kalathil, Shafeer;Lee, Jin-Tae;Cho, Moo-Hwan
    • Bulletin of the Korean Chemical Society
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    • v.33 no.8
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    • pp.2592-2596
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    • 2012
  • Cysteine capped silver nanoparticles (Cys-AgNPs) have been synthesized by employing electrochemically active biofilm (EAB), $AgNO_3$ as precursor and sodium acetate as electron donor in aqueous solution at $30^{\circ}C$. Cys-AgNPs of 5-10 nm were synthesized and characterized by UV-Vis, FT-IR, XRD and TEM. Capping of the silver nanoparticles with cysteine provides stability to nanoparticles by a thiolate bond between the amino acid and the nanoparticle surface and hydrogen bonding among the Cys-AgNPs. In addition, the antibacterial effects of as-synthesized Cys-AgNPs have been tested against two pathogenic bacteria Escherichia coli (O157:H7) and Pseudomonas aeruginosa (PAO1). The results demonstrate that the as-synthesized Cys-AgNPs can proficiently inhibit the growth and multiplication of E. coli and P. aeruginosa.

Static analysis of a multilayer piezoelectric actuator with bonding layers and electrodes

  • Xiang, H.J.;Shi, Z.F.
    • Smart Structures and Systems
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    • v.5 no.5
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    • pp.547-564
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    • 2009
  • Based on the theory of piezoelasticity, an analytical solution for a typical multilayer piezoelectric composite cantilever is obtained by the Airy function method. The piezoelectric cantilever may consist of any number of layers. Moreover, the material and thickness for different layers may be different. The solution obtained in the present paper is concise and can be easily applied for the bending analysis of multilayer piezoelectric actuators considering the effect of bonding layers and electrodes. At last, a comprehensive parametric study is conducted to show the influence of electromechanical coupling (EMC), the number of piezoelectric layers, the elastic modulus of elastic layer and the thickness ratio on the bending behavior of actuators. Some interesting results for the design of multilayer piezoelectric actuators are presented.

Application of Protecting Methods for Single Point Bonding on Underground Transmission Cable (지중 송전 케이블의 편단접지 시스템에서의 계통 보호 방안)

  • Ha, C.W.;Kim, J.N.;Lee, I.H.;Kim, J.C.;Lee, K.Y.
    • Proceedings of the KIEE Conference
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    • 2005.07a
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    • pp.15-17
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    • 2005
  • The protection of underground cables against transient overvoltages resulting from lightning and other causes is important in cable-line which is connected with overhead line and underground cable. This paper investigates the failure of SVL(Sheath Voltage Limiter) and presents the application of protection methods for single point bonding on underground transmission cable system. EMTP(Electromagnetic Transient Program) is used in order to study the overvoltages and modeling of components of the system such as, underground cables, SVLs and towers.

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Study on the nucleophilic reaction on Orgniac Thin Films (유기물 박막에서 일어나는 친핵성 반응에 대한 연구)

  • Oh, Teresa;Kim, Hong-Bae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.170-171
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    • 2006
  • The chemical shift of SiOC film was observed according to the flow rate ratio. SiOC film has the broad main band of $880{\sim}1190cm^{-1}$ and the sharp Si-$CH_3$ bond at $1252cm^{-1}$, and the infrared spectra in the Si-O-C bond moved to low frequency according to the increasing of an oxygen flow rate. The chemical shift affected the carbon content in the SiOC film, and the decreasing of carbon atoms elongated the C-H bonding length, relatively. The main bond without the sharp Si-$CH_3$ bond at $1252cm^{-1}$ consisted of Si-C, C-O and Si-O bonds, and became the bonding structure of the Si-O-C bond.

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The consolidation of CNT/Cu mixture powder using equal channel angular pressing (Equal Channel Angular Pressing 공정을 이용한 CNT/Cu 복합분말의 고형화)

  • Yoon, S.C.;Quang, P.;Kim, H.S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.05a
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    • pp.119-122
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    • 2006
  • In this study, bottom-up type powder processing and top-down type SPD (severe plastic deformation) approaches were combined in order to achieve full density of 1 vol.% carbon nanotube (CNT)-metal matrix composites with superior mechanical properties by improved particle bonding and least grain growth, which were considered as a bottle neck of the bottom-up method using the conventional powder metallurgy of compaction and sintering. ECAP (equal channel angular pressing), the most promising method in SPD, was used for the CNT-Cu powder consolidation. The powder ECAP processing with 1, 2, 4 and 8 route C passes was conducted at room temperature. It was found by mechanical testing of the consolidated 1 vol.% CNT-Cu that high mechanical strength could be achieved effectively as a result of the Cu matrix strengthening and improved particle bonding during ECAP. The ECAP processing of powders is a viable method to achieve fully density CNT-Cu nanocomposites.

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ENGINEERING PROPERTIES OF NATURAL FIBER USED NONWOVEN GEOTEXTILES (천연섬유 부직포 지오텍스타일의 공학적 특성)

  • Jeon, H.Y.;Jang, Y.S.;Lee, K.W.
    • Proceedings of the Korean Geotechical Society Conference
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    • 2008.03a
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    • pp.267-272
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    • 2008
  • The purpose of this study is to improve the environmental applicability of nonwovens by using special composition. Polypropylene spunbonded and needle punched nonwovens which have the lower cost than polyester nonwovens were used as the raw materials to manufacture the natural fiber used nonwoven geotextiles. These geotextiles were made by use of the thermal bonding methods and composed of jute(or flax)/polypropylene staple fiber blends were obtained in consideration of environmental application. Finally, the engineering properties of natural fiber used nonwoven geotextiles were investigated as eco-friendly materials.

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Study on the Biocompability of Hydroxyapatite Bioceramics(I) Bonding between Hydroxyapatite Bioceramics in Simulated Body Fluid (Hydroxyapatite Bioceramics의 생체 친화성에 관한 연구(I) 인공체액에서의 Hydroxyapatite Bioceramics간의 결합)

  • 고형열;김양수;송종택;최상흘
    • Journal of the Korean Ceramic Society
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    • v.27 no.3
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    • pp.311-320
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    • 1990
  • Hydroxyapatite powders were synthesized with Ca/P=1.67, 1.70 and pH=7, 11 by precipitation method and fluorine substituted hydroxyapatite ceramics were prepared using these powders. After characterization of these hydorxyapatite bioceramics, chemical bonding between these sepcimens in simulated body fluid was investigated. Bysubstitution of 7.5% of fluorine, hydroxyapatite was prevented to decompose into β-tricalcium phosphate and its sintered density and mechanical strength were increased. The bending strength of these hydroxyapatite ceramics was 137MPa. The hydroxyapatite ceramics chemically bonded each other in Ringer's solution and the component of bonded layer was also hydroxyapatite.

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Titanium thin film modified silica substrate to enhance the bonding properties of nanosilver

  • Lin, H.M.;Liu, Y.T.;Lin, K.N.;Chang, W.S.;Wu, C.Y.;Liu, P.Y.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1733-1736
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    • 2006
  • Nanosilver has intrinsic problem to adhesion on the surface of silica. To improve interfacial properties between nanosilver and silica substrate, a thin titanium film is introduced in this study. The titaniumcoated silica substrates are prepared by sputter technique. The commercial silver nanopaste with size around 3-7nm is used in this study. The results indicate thin layer of titanium can improve the bonding properties of nanosilver and expect to be used in fabrication of TFT display panel.

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A Study on the Shear Deformation Behavior of Inner Structure-Bonded Sheet Metal (접합판재의 전단 변형거동에 관한 연구)

  • Kim J. Y.;Chung W. J.;Yang D. Y.;Kim J. H.
    • Transactions of Materials Processing
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    • v.14 no.3 s.75
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    • pp.257-262
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    • 2005
  • In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.