• Title/Summary/Keyword: H-bonding

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Theoretical Study on the Hydrogen-Bonding Effect of H2On-H2Om (n=1-4, m=1-4) Dimers (H2On-H2Om (n=1-4, m=1-4) 이중합체의 수소결합에 따른 구조적 특성 및 결합에너지에 관한 이론 연구)

  • Song, Hui-Seong;Seo, Hyun-Il;Shin, Chang-Ho;Kim, Seung-Joon
    • Journal of the Korean Chemical Society
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    • v.59 no.2
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    • pp.117-124
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    • 2015
  • The DFT and ab initio calculations have been performed to elucidate hydrogen interaction of hydrogen polyoxide dimers, $H_2O_n-H_2O_m$ (n=1-4, m=1-4). The optimized geometries, harmonic vibrational frequencies, and binding energies are predicted at various levels of theory. The harmonic vibrational frequencies of the molecules considered in this study show all real numbers implying true minima. The higher-order correlation effect were discussed to compare MP2 result with CCSD(T) single point energy. The binding energies were corrected for the zero-point vibrational energy (ZPVE) and basis set superposition errors (BSSE). The largest binding energy predicted at the CCSD(T)/cc-pVTZ level of theory is 8.18 kcal/mol for $H_2O_4-H_2O_3$ and the binding energy of water dimer is predicted to be 3.00 kcal/mol.

Heat Processing and Dyeing Properties of Fabrics by Using Composite Fancy Yarn Containing Low Melting PET Yarn (저온융착 폴리에스테르사 함유 팬시사 직물의 열처리 특성 및 염색성)

  • Sung, Woo Kyung
    • Fashion & Textile Research Journal
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    • v.14 no.6
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    • pp.1024-1031
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    • 2012
  • The thermal bonding PET fabrics were produced through high temperature steaming (HTS) of low melting PET yarn as warp and composite fancy yarn containing low melting PET yarn as weft. The low melting PET yarn of sheath-core structure consisted of a regular PET in core portion and low melting PET in sheath portion. The composite fancy yarn consisted of regular PET yarn as inner part and effect part and low melting PET yarn as binding part. This study was carried out to investigate the melting behavior of thermal bonded PET fabric, the effect of HTS on the thermal bonding, mechanical properties, and dyeing properties. The melting peak of low melting PET yarn showed two melting peaks caused by sheath-core structure. Almost the entire thermal bonding of the fancy PET fabrics containing low melting PET yarn has formed at $200^{\circ}C{\times}3min$ of HTS. The tensile strength in warp and weft direction of the fancy PET fabrics slightly decreased as temperature of HTS increased. The total K/S value of the fancy PET fabrics decreased slightly to $180^{\circ}C{\times}3min$ of HTS, while increased slightly above $200^{\circ}C{\times}3min$ of HTS. The changes in the hue angle ($H^{\circ}$) of the thermal bonded fancy PET fabrics dyed with disperse dyes hardly ever happened.

Effect of Post Heat Treatment on Bonding Interfaces in Ti/STS409L/Ti Cold Rolled Clad Materials (Ti/STS409L/Ti 냉연 클래드재의 접합계면특성에 미치는 후열처리의 영향)

  • Bae, D.S.;Kim, W.J.;Eom, S.C.;Park, J.H.;Lee, S.P.;Kim, M.J.;Kang, C.Y.
    • Transactions of Materials Processing
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    • v.20 no.2
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    • pp.140-145
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    • 2011
  • The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.

Vapor Permeation Separation of MTBE-Methanol Mixtures Using Cross-linked PVA Membranes (가교된 PVA 막을 이용한 MTBE/methanol 혼합물의 증기투과(Vapor Permeation)분리)

  • 김연국;임지원
    • Membrane Journal
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    • v.10 no.3
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    • pp.148-154
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    • 2000
  • Poly(vinyl alcohol)(PVA)/sulfur-siccinic acid(SSA) membrane performances have been studied for the vapor permeation separation of methyl tort-butyl ether(MTBE)/methanol mixtures with varying operation temperatures, amount of cross-linking agents, and feed compositions. 1'here are two factors, the membrane network and the hydrogen bonding, in the swelling measurements of PVA/SSA membranes. These two factors act interdependently on the membrane swelling. The sulfuric acid group in SSA took an important role in the membrane performance. The cross-linking effect might be more dominant than the hydrogen bonding effect due to the sulfuric acid group at 7% SSA membrane. Hydrogen bonding effect was more important for 5% SSA membrane. In vapor permeation, density or concentration of methanol in vapor feed is lower than that of methanol in liquid feed, as a result, the hydrogen bonding portion between the solvent and the hydroxyl group in PVA is reduced in vapor permeation. In this case, the 7% SSA membrane shows the highest separation factor of 2187 with the flux of 4.84g/$m^2$hr for MTBE/methanol=80/20 mixtures at 3$0^{\circ}C$.

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Warpage Characteristics Analysis for Top Packages of Thin Package-on-Packages with Progress of Their Process Steps (공정 단계에 따른 박형 Package-on-Package 상부 패키지의 Warpage 특성 분석)

  • Park, D.H.;Jung, D.M.;Oh, T.S.
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.2
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    • pp.65-70
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    • 2014
  • Warpage of top packages to form thin package-on-packages was measured with progress of their process steps such as PCB substrate itself, chip bonding, and epoxy molding. The $100{\mu}m$-thick PCB substrate exhibited a warpage of $136{\sim}214{\mu}m$. The specimen formed by mounting a $40{\mu}m$-thick Si chip to such a PCB using a die attach film exhibited the warpage of $89{\sim}194{\mu}m$, which was similar to that of the PCB itself. On the other hand, the specimen fabricated by flip chip bonding of a $40{\mu}m$-thick chip to such a PCB possessed the warpage of $-199{\sim}691{\mu}m$, which was significantly different from the warpage of the PCB. After epoxy molding, the specimens processed by die attach bonding and flip chip bonding exhibited warpages of $-79{\sim}202{\mu}m$ and $-117{\sim}159{\mu}m$, respectively.

Development of medium resolution cross-dispersed silicon grisms in the Near Infrared ; Direct Silicon wafer bonding technique

  • Jeong, Hyeon-Ju;Wang, Wei-Song;Gully-Santiago, Michael;Deen, Casey;Pak, Soo-Jong;Jaffe, Daniel T.
    • The Bulletin of The Korean Astronomical Society
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    • v.36 no.2
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    • pp.125.2-125.2
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    • 2011
  • We are developing medium resolution cross-dispersed silicon grisms in the near IR region ($1.45{\sim}5.2{\mu}m$). The grisms will be installed in MIMIR, a multifunction instrument at the Lowel Observatory, USA. The two devices are designed to cover H and K band and L and M band simultaneously. Our goal is to make grism with R=3000 at 1.2 arcsec slit. The Silicon has high refractive index (n=3.4 at $1.5{\mu}m$) which enhances the resolving power by up to 5 times when compared to conventional material such as BK-7 (n=1.5 at 1.5 ${\mu}m$). The bonded grisms will be installed in a filter wheel for the uses switch from spectroscopic mode to imaging mode easily. Our device is compact and light weighted while it provides a decent resolving power. We produce monolithic grisms using e-beam lithography at the NASA JPL and chemically etching the grooves on the silicon prisms. Moreover, the main-disperser and cross-disperser will be contacted together by direct Si-Si bonding technique and eventually turn into one piece. The bonded pair offers more stability in terms of the layout of the spectrum and removes the Fresnel loss at the intersection of two grisms. We report on the proper wafer bonding steps through this research, and inspected the bonding quality thermally, optically and mechanically.

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Microstructure and Mechanical Properties of AA1050/Mg(AZ91)/AA1050 Complex Sheet Fabricated by Roll Bonding Process (접합압연공정에 의해 제조된 AA1050/Mg(AZ91)/AA1050 복합판재의 미세조직 및 기계적 특성)

  • Lee, Seong-Hee;You, Hyo-Sang;Lim, Cha-Yong
    • Korean Journal of Materials Research
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    • v.26 no.3
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    • pp.154-159
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    • 2016
  • A roll-bonding process was applied to fabricate an AA1050/AZ91/AA1050 laminate complex sheet. Two AA1050 and one AZ91 magnesium sheets of 2 mm thickness, 30 mm width and 200 mm length were stacked up after surface treatment that included degreasing and wire brushing; material was then reduced to a thickness of 3 mm by one-pass cold rolling. The laminate sheet bonded by the rolling was further reduced to 2 mm in thickness by conventional rolling. The rolling was performed at 623K without lubricant using a 2-high mill with a roll diameter of 210 mm. The rolling speed was 15.9 m/min. The AA1050/AZ91/AA1050 laminate complex sheet fabricated by roll bonding was then annealed at 373~573K for 0.5h. The microstructure of the complex sheets was revealed by electron back scatter diffraction (EBSD) measurement; the mechanical properties were investigated by tensile testing and hardness testing. The strength of the complex sheet was found to increase by 11 % and the tensile elongation decreased by 7%, compared to those values of the starting material. In addition, the hardness of the AZ91 Mg region was slightly higher than those of the AA1050 regions. Both AA1050 and AZ91 showed a typical deformation structure in which the grains were elongated in the rolling direction; however, the mis-orientation distribution of grain boundaries varied greatly between the two materials.

A Study on Improvement of Adhesion HTPB Propellant/Liner/Insulation (HTPB계 추진제/라이너/내열재의 접착력 향상에 관한 연구)

  • Park, Sungjun;Song, Jongkwon;Park, Euiyong;Rho, Taeho;Choi, Sunghan
    • Journal of the Korean Society of Propulsion Engineers
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    • v.23 no.4
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    • pp.92-97
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    • 2019
  • A study was conducted to improve the adhesion of propellant, liner,and insulation. Insulation was shown to be more advantageous in improving the adhesion when a barrier coat was applied compared to a bare insulation layer. It was confirmed that the adhesion strength between the insulation and the propellant improves as the thickness of the liner coating increases. The liner was cured for 24 h. If the liner is cured for a long time, it will adversely affect adhesion. Adhesion is also improved when a bonding agent is applied. As the bonding agent content increases, the adhesion improves. There is a change in the adhesive strength depending on the type of bonding agent used. HX-868 shows slightly more improved adhesion than HX-752.

Fabrication of High-Temperature Si Hall Sensors Using Direct Bonding Technology (직접접합기술을 이용한 고온용 Si 홀 센서의 제작)

  • Chung, G.S.;Kim, Y.J.;Shin, H.K.;Kwon, Y.S.
    • Proceedings of the KIEE Conference
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    • 1995.07c
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    • pp.1431-1433
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    • 1995
  • This paper describes the characteristics of Si Hall sensors fabricated on a SOI(Si-on-insulator} structure, in which the SOI structure was forrmed by SDB(Si-wafer direct bonding) technology. The Hall voltage and the sensitivity of implemented Si Hall devices show good linearity with respect to the applied magnetic flux density and supplied current. The product sensitivity of the SDB SOI Hall device is average $600V/A{\cdot}T$. In the temperature range of 25 to $300^{\circ}C$, the shifts of TCO(Temperature Coefficient of the Offset Voltage) and TCS(Temperature Coefficient of the product Sensitivity) are less than ${\pm}6.7{\times}10^{-3}/^{\circ}C$ and ${\pm}8.2{\times}10^{-4}/^{\circ}C$, respectively. From these results, Si Hall sensors using the SOI structure presented here are very suitable for high-temperature operation.

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A Naked Eye Detection of Fluoride with Urea Receptors Which have both an Azo Group and a Nitrophenyl Group as a Signaling Group

  • Dang, Nhat Tuan;Park, Jin-Joo;Jang, Soon-Min;Kang, Jong-Min
    • Bulletin of the Korean Chemical Society
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    • v.31 no.5
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    • pp.1204-1208
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    • 2010
  • Anion recognition via hydrogen-bonding interactions could be monitored with changes in UV-vis absorption spectra and in some cases easily monitored with naked eye. Urea receptors 1 and 2 connected with both an azo group and a nitrophenyl group as a signaling group for color change proved to be an efficient naked eye receptor for the fluoride ion. The anion recognition phenomena of the receptors 1 and 2 via hydrogen-bonding interactions were investigated through UV-vis absorption and $^1H$ NMR spectra.