• 제목/요약/키워드: H-bonding

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통전압접을 활용한 알루미늄 소재 간 고상접합에 관한 연구 (Study on Electrically Assisted Pressure Solid State Joining Between Aluminum Alloys)

  • 최호욱;이시환;김이재;홍성태;한흥남
    • 소성∙가공
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    • 제31권6호
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    • pp.337-343
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    • 2022
  • Electrically assisted pressure joining (EAPJ) utilizes electric current-induced kinetic enhancement to achieve solid state diffusion bonding within a short time. In this study, aluminum alloy specimens, which are known as a hard-to-weld metal, were successfully solid-state joined through EAPJ. The bonding process was performed in two ways: continuous direct current (CDC), which applies relatively low current density, and pulsed direct current (PDC), which applies high current density. It was observed that the bonding strength was higher in PDC than in CDC. The microstructure of the joint was characterized using 3D X-ray microscopy (XRM) and electron backscatter diffraction (EBSD).

Kinetic Study on Aminolysis of Y-Substituted-Phenyl Picolinates: Effect of H-Bonding Interaction on Reactivity and Transition-State Structure

  • Kim, Min-Young;Kang, Tae-Ah;Yoon, Jung Hwan;Um, Ik-Hwan
    • Bulletin of the Korean Chemical Society
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    • 제35권8호
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    • pp.2410-2414
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    • 2014
  • A kinetic study is reported on nucleophilic substitution reactions of Y-substituted-phenyl picolinates (7a-7h) with a series of cyclic secondary amines in 80 mol % $H_2O$/20 mol % DMSO at $25.0{\pm}0.1^{\circ}C$. Comparison of the kinetic results with those reported previously for the corresponding reactions of Y-substituted-phenyl benzoates (1a-1f) reveals that 7a-7h are significantly more reactive than 1a-1f. The Br${\o}$nsted-type plot for the aminolysis of 4-nitrophenyl picolinate (7a) is linear with ${\beta}_{nuc}=0.78$, which is typical for reactions proceeding through a stepwise mechanism with expulsion of the leaving group being the rate-determining step. The Br${\o}$nsted-type plots for the piperidinolysis of 7a-7h and 1a-1f are also linear with ${\beta}_{lg}=-1.04$ and -1.39, respectively, indicating that the more reactive 7a-7h are less selective than the less reactive 1a-1f to the leaving-group basicity. One might suggest that the enhanced reactivity of 7a-7h is due to the inductive effect exerted by the electronegative N atom in the picolinyl moiety, while the decreased selectivity of the more reactive substrates is in accord with the reactivity-selectivity principle. However, the nature of intermediate (e.g., a stabilized cyclic intermediate through the intramolecular H-bonding interaction for the reactions of 7a-7h, which is structurally not possible for the reactions of 1a-1f) is also responsible for the enhanced reactivity with a decreased selectivity.

접착레진의 추가도포가 자가부식형 접착제의 상아질에 대한 미세인장접착강도에 미치는 영향 (Effect of additional coating of bonding resin on the microtensile bond strength of self-etching adhesives to dentin)

  • 정문경;조병훈;손호현;엄정문;한영철;정세준
    • Restorative Dentistry and Endodontics
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    • 제31권2호
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    • pp.103-112
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    • 2006
  • 본 실험에서는 자가부식형 접착제와 콤포짓트 레진 사이의 산도의 차이를 완화시킬 수 있는 접착레진을 자가부식형 접착제 위에 추가적으로 도포할 경우, 상아질에 대한 접착력을 개선할 수 있는지를 연구하였다. 자가부식형 접착제로는 실험실에서 직접 제작한 실험용 자가부식형 접착제 (pH: 1.96)와 Adper Prompt (3M ESPE, VSA, pH: 1.0)를 사용하였으며, 중성의 접착레진으로 All-Bond 2의 D/E bonding resin (Bisco Inc., USA, pH: 6.9)을 사용하였다. 두 대조군에서는 두 가지 자가부식형 접착제를 각각 두번씩 도포하였으며, 두 실험군에서는 각 자가부식형 접착제를 한번 도포한 후 그 위에 D/E bonding resin을 추가 도포하였다. Z-250 하이브리드 복합레진을 쌓아올려 모레시계 형태의 시편을 제작하여 미세인장강도를 측정하고 t-test를 이용하여 비교하였다. 파절 양상은 입체현미경과 주사전자현미경을 이용하여 관찰하였다. D/E bonding resin을 추가 도포한 미세 인장접착강도는 유의하게 증가되었고, 접착층과 복합레진 또는 접착층과 상아질 사이의 파절을 보인 시편의 수는 감소하고, 접착층 내의 파절을 보인 시편의 수는 증가되었다. 따라서 자가부식형 접착제와 복합레진의 산도의 차이를 완화할 수 있는 중성의 접착레진을 추가 도포할 경우 미세인장접착강도를 증가시킬 수 있음을 확인하였다.

Fe-H…H-C 이수소 결합: trans-[FeH(NCSe)(dppe)2](dppe=Ph2 PCH2 CH2 PPh2의 합성 및 구조 (Fe-H…H-C Dihydrogen Bondings: Synthesis and Structure of trans-[FeH(NCSe)(dppe)2](dppe=Ph2 PCH2 CH2 PPh2)

  • 백지영;한원석;이순원
    • 대한화학회지
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    • 제46권5호
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    • pp.427-436
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    • 2002
  • trans-[FeHCl$(dppe)_2$](1)과 KSeCN의 반응으로부터 trans-[FeH(NCSe)$(dppe)_2$](2)가 합성되었다. 화합물 2-$CH_2Cl_2$의 구조가 X-ray회절법으로 규명되었다. 화합물 2 내에서 수소 리간드가 M-H${\cdots}$H-C유형의 이수소 (dihydro gen) 결합에 참여하고 있다.

THE ANALYSIS OF THE FT-NIR SPECTRA OF WATER ON THE BASIS OF TWO-STATE MODEL

  • Boguslawa, Czarnik-Matusewicz
    • 한국근적외분광분석학회:학술대회논문집
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    • 한국근적외분광분석학회 2001년도 NIR-2001
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    • pp.1181-1181
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    • 2001
  • Robinson with ${coworkers}^{1}$ have introduced two-state outer-neighbor bonding model to explain the anomalies of water. The studies on the properties of water as a function of temperature and pressure revealed that, unlike other ideas, all $H_2O$ molecules in liquid are tetrabonded. On the average they are forming two different bonding types. One type is the regular tetrahedral water-water bonding similar to that found in the ordinary ice Ih, whereas the other is a more dense nonregular tetrahedral bonding similar to that appearing in the ice II. The transformation between these two bonding forms is evidenced by FT-NIR experiment. The FT-NIR measurements were done for liquid water in the temperature range from $20^{\circ}C$ up to $80^{\circ}C$ in a wide extent of frequencies: 12 000 - 4000 $cm^{-1}$ /. Temperature dependent variations in the volume fraction of these two structures are directly related to the spectral changes. The absorbance variations are explored by means of the two-dimensional correlation spectroscopy (2DCOS), principal component analysis (PCA), curve fitting and second derivatives. The presence of the isosbestic points in a range of the combination and overtone transitions indicates that the experimental spectra are a superposition of two temperature independent components. One component of diminishing intensity with temperature increase, is assigned to a stronger hydrogen bonds occurred in the Ih type, whereas the second component showing an opposite behavior, one can attribute to a weaker H-bonds characteristic for the II type. The understanding of the hydrogen bonding network in the liquid water is very important in interpretation of the interaction between water and protein chain. The two-state model of water surrounding the protein surface could advance an understanding of the hydration process.

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PMD(Pre-Metal Dielectric) 선형 질화막 공정의 최적화 (Optimization of PMD(Pre-Metal Dielectric) Linear Nitride Process)

  • 정소영;서용진;김상용;이우선;이철인;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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    • pp.38-41
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    • 2001
  • In this work, we have been studied the characteristics of each nitride film for the optimization of PMD(pre-metal dielectric) liner nitride process, which can applicable in the recent semiconductor manufacturing process. The deposition conditions of nitride film were splited by PO (protect overcoat) nitride, baseline, low hydrogen, high stress and low hydrogen, respectively. And also we tried to catch hold of correlation between BPSG(boro-phospho silicate glass) deposition and densification. Especially, we used FTIR area method for the analysis of density change of Si-H bonding and Si-NH-Si bonding, which decides the characteristics of nitride film. To judge whether the deposited films were safe or not, we investigated the crack generation of wafer edge after BPSG densification, and the changes of nitride film stress as a function of RF power variation.

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A Magneto-Optic Waveguide Isolator Using Multimode Interference Effect

  • Yang, J.S.;Roh, J.W.;Lee, W.Y.;Ok, S.H.;Woo, D.H.;Byun, Y.T.;Jhon, Y.M.;Mizumoto T.;Lee,S.
    • Journal of Magnetics
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    • 제10권2호
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    • pp.41-43
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    • 2005
  • We have investigated an optical waveguide isolator with a multimode interference section by wafer direct bonding, operating at a wavelength $1.55\;{\mu}m$. In order to fabricate the device for monolithic integration, the wafer direct bonding between a magnetic garnet material as a cladding layer and a semiconductor guiding layer has been achieved. We found that wafer direct bonding between InP and GGG $(Gd_3Ga_5O_{12})$ is effective for the integration of a waveguide optical isolator. The isolation ratio was obtained to be 2.9 dB in the device.

수종의 상아질 결합체의 전단강도 및 결합부의 형태에 관한 비교연구 (THE COMPARATIVE STUDY ON THE SHEARBOND STRENGTH AND THE MORPHOLOGY OF RESIN-DENTIN INTERFACE BONDED BY SEVERAL DENTINAL BONDING SYSTEM)

  • 김윤철;김용기
    • 대한소아치과학회지
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    • 제23권4호
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    • pp.867-886
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    • 1996
  • The purpose of this study was to evaluate the shearbond strength and resin-dentin interface of three different dentinal bonding systems in primary and permanent teeth. Thirty extracted human primary molars and premolars, which were non-carious and free of obvious defect, were selected for this study. All specimens were divided into six groups with two groups allocated for each of the three dentinal bonding system(All-bond 2, Scotchbond Multi-Purpose, Gluma bonding system). After completion of bonding composite to dentin using each tested dentin bonding system, bond strength measurement and histological observation were performed. The results are as follows: 1. All-bond 2 and Scotchbond Multi-Purpose, A good quality hybrid layer was identified, the morphology of which could be equated with the zone of H-E and Brown-Brenn staining. In Gluma bonding system, hybrid layer was very thin, and separated from the solid polymer. 2. All-bond 2 had the highest mean shearbond strength, followed by Scotchbond Multi-Purpose and Gluma bonding system in both primary and permanent teeth. There was no statistically significant difference between All-bond 2 and Scotchbond Multi-Purpose. Statistically significant difference could be found between Gluma bonding system and the other two groups(p<0.05). 3. The fracture patterns observed were mainly the mixture of adhesive failure and dentin dettachment pattern in All-bond 2 and Scotchbond Multi-Purpose while adhesive failure prevailed in Gluma bonding system.

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MEMS 적용을 위한 비정질 상 탄소박막의 나노 스케일 마찰력 특성연구 (A study on nano-scale friction of hydrogenated amorphous carbon for application in MEMS)

  • 고명균;박종완
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1211-1214
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    • 2003
  • The film is prepared by electron cyclotron resonance chemical vapor deposition (ECRCVD) employing CH$_4$ and H$_2$ gases. It is deposited by the control of microwave plasma power, gas flow ratio, deposition pressure, and In-situ thermal treatment temperature. The structure of a-C:H (hydrogenated amorphous carbon) thin film is analysed by FT-IR spectroscopy. The fraction sp$^3$ versus sp$^2$ bonding is very important to clear up the surface and interrace of a-C:H film properties such as nano-scale friction behavior. The sp$^3$ versus sp$^2$ bonding of a-C:H thin film is dependent on the deposition conditions, therefore. nano-scale friction behavior is dependent on the deposition conditions.

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