• Journal of Welding and Joining
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• v.16 no.4
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• pp.117-124
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• 1998

During the reflow process in SMT, the molten solder has been observed to move upward and solidify along the gullwing lead, which is called the wicking phenomenon. In this paper, possible causes of the wicking are investigated, and its effects on the solder joint profile are quantitatively estimated by introducing the wicking constant. The free energy reduction by intermetallic formation between the copper and tin seems to be the major source of wicking action. The joint profiles of the gullwing lead are calculated using the previous finite element formulation incorporated with the wicking constant. The calculated results show reasonably good agreements with the experimental data when the wicking effects are considered.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.109-116
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• 1998

The three-dimensional profile of a solder fillet is predicted by minimizing the surface tension and gravity energies of the solder joint using finite element modeling. Geometric complexity stemming from the inclined plane of the gullwing lead is resolved by employing three element types. These element types are used to describe the joint profile formed on the vertical, inclined and interfacial planes. The predicted solder joint profiles show good agreements with the experimental data provided that the solder volume is adjusted considering the wicking effects. Effects of the pad length, inclined lead angle and solder volume on joint profiles are also investigated.

• Journal of Welding and Joining
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• v.14 no.2
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• pp.71-78
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• 1996

In order to rpovide proper SMT design criteria in a systematic way, a mathematical formulation has been developed to predict the configuration of the solder fillet formed between the gullwing type lead and rectangular pad. Effects of SMT design parameters such as the solder volume and pad dimension on the solder profile are investigated using the FEM that calculates the 3D configuration by minimizing the energy due to surface tension and gravity in the equilibrium state. Design criteria of QFP and SOP are illustrated by plotting the acceptable range of the solder volume with respect to the length and width ratios of the pad and lead. The results show that the acceptable design range increases with increase in the pad length and width. The pad length has more significant effects on design criteria compared with the pad width, and Bond number can be utilized to predict the joint quality.

• Proceedings of the KWS Conference
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• 1995.10a
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• pp.145-148
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• 1995

To provide better understanding of a solder joint design criteria, mathematical models have been developed to calculate the shape of the solder fillets formed between the pad and lead. The effects of parameters such as solder volume and pad dimensions are described with this model. In this study, a systematic way to determine the design criteria of the SMT from the predicted 3D solder joint profile is proposed. The solder joint profile is calculated using the available 3D FEM code which minimizes the system energy due to the surface tension and gravity. The solder joint profiles of gullwing-type lead such as QFP and SOP are calculated for design parameters, and acceptable ranges are obtained. The result shows that the pad length is the most significant factor compared with the pad width and pad area.