• Journal of Ocean Engineering and Technology
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• v.13 no.2 s.32
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• pp.58-65
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• 1999

The effect of specimen thickness on fatigue crack growth rate was studied. The objective of the present study is to investigate the effect of specimen thickness on the fatigue crack growth behavior at various stress intensity factor ranges and also the variation of material restance to fatigue crack growth. The fatigue crack growth resistance was treated as a spatial stochastic process, which varies randomly on the crack path, Compact tension specimens with a LT orientation for structural steel were used. All testing was done at a constant stress intensity level. The experimental data were analyzed for the size effect to determine the Weibull distributions of the material resistance.

• Journal of Surface Science and Engineering
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• v.44 no.4
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• pp.131-136
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• 2011

A kinetic study has been made for the growth of nanocrystalline diamond (NCD) particles to a continuous thin film on silicon substrate in a microwave plasma chemical vapor deposition reactor. Parameters of deposition have been microwave power of 1.2 kW, the chamber pressure of 110 Torr, and the Ar/$CH_4$ ratio of 200/2 sccm. The deposition has been carried out at temperatures in the range of $400\sim700^{\circ}C$ for the times of 0.5~16 h. It has been revealed that a continuous diamond film evolves from the growth and coalescence of diamond crystallites (or particles), which have been heterogeneously nucleated at the previously scratched sites. The diamond particles grow following an $h^2$ = k't relationship, where h is the height of particles, k' is the particle growth rate constant, and t is the deposition time. The k' values at the different deposition temperatures satisfy an Arrhenius equation with the apparent activation energy of 4.37 kcal/mol or 0.19 eV/ atom. The rate limiting step should be the diffusion of carbon species over the Si substrate surface. The growth of diamond film thickness (H) shows an H = kt relationship with deposition time, t. The film growth rate constant, k, values at the different deposition temperatures show another Arrhenius-type expression with the apparent activation energy of 3.89 kcal/mol or 0.17 eV/atom. In this case, the rate limiting step might be the incorporation reaction of carbon species from the plasma on the film surface.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.2
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• pp.208-214
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• 1986

To establish the evaluation of the fatigue crack growth behavior in 5083-O aluminum alloy, constant load-amplitude fatigue crack growth tests were carried out under the small scale yielding conditions. Crack length and closure of this material were measured by the compliance method using a clip-on gage. The main results obtained as follows: The fatigue crack growth rate against stress intensity factor range .DELTA.K exhibits the trilinear form with two transitions at the growth rate 5.5*10$^{-6}$ and 5.5*10$^{-5}$ mm/cycle, in the so-caled Region II. The trilinear form appears still in the plot of growth rate versus effective stress intensity factor range .DELTA. $K_{eff}$. Stress ratio R affects the relationship of crack growth rates versus .DELTA.K but does not affect the reation of crack growth rate versus .DELTA. $K_{eff}$. The experimental results indicate that the effective stress intensity range ratio U depends on the maximum stress intensity factor $K_{max}$, but not on the stress ratio R.o R.R.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.6
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• pp.775-782
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• 2013

In this study, as a series of studies aimed at investigating the spatial randomness of fatigue crack growth for friction stir welded (FSWed) 7075-T651 aluminum alloy joints, the fatigue crack growth behavior of FSWed 7075-T651 aluminum alloy joints was investigated for LT orientation specimens. Fatigue crack growth tests were conducted under constant stress intensity factor range (SIFR) control for 5 specimens of the FSWed 7075-T651 aluminum alloy, including base metal (BM), heat affected zone (HAZ), and weld metal (WM) specimens. The mean fatigue crack growth rate of WM specimens was found to be the highest, whereas that of HAZ and WM specimens was the lowest. Furthermore, the variability of fatigue crack growth rate was found to be the highest in WM specimens and lowest in BM specimens.

• Journal of Korean Vacuum Science & Technology
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• v.3 no.1
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• pp.16-23
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• 1999

Deposition of parylene (PA) films has been explored at substrate temperatures below 2$0^{\circ}C$ and pressures below 4 torr. The film thickness was measured using AFM and the film thickness measured was 3,500-12,000$\AA$ and the growth rate was 20-70$\AA$/min. T도 dielectric constant of the deposited PA films was found to be 2.66 and the dielectric strength was in excess of 2$\times$105V/cm. The growth rate became a maximum at a precursor decomposition temperature of $600^{\circ}C$. It was found that the growth rate decreased with increasing substrate temperature, whereas it increased with increasing pressure. At a precursor decomposition temperature of 75$0^{\circ}C$ or at a deposition pressure above 1 Torr the film surface became rough due to particle formation in the gas phase. The condensation of a p-xylylene monomer on the substrate surface turned out to be a rate-limiting step in the growth of the PA films.

• Journal of Korean Vacuum Science & Technology
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• v.7 no.2
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• pp.33-38
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• 2003

Fluorinated amorphous carbon thin films (a-C:F) for the use of low dielectric constant intermetallic layer dielectrics are deposited by plasma enhanced chemical vapor deposition with $C_4$F$_{8}$ and Si$_2$H$_{6}$/He gas mixture as precursors. To characterize and improve film properties, we changed various conditions such as deposition temperature, and RF power, and we measured the thickness and refractive indexes and FT-IR spectrum before and after annealing. At low temperatures the film properties were very poor although the growth rate was very high. On the other hand, the growth rate was low at high temperature. The growth rate increased in accordance with the deposition pressure. The dielectric constants of samples were in the range of 1.5∼5.5∼5.

• Journal of the Korean Ceramic Society
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• v.36 no.1
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• pp.15-20
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• 1999

Elevated temperature static fatigue behavior of silicon has been investigated by stress intensity/life test method. Static fatigue crack growth rate increase with the increase of temperature. Such tendency is found to be mainly related to the decrease of fracture toughness with the increase of temperature. That is, when static fatigue crack growth rate, da/dt is expressed by da/dt=AK1m, a constant A is a function of fracture toughness Kc and the exponent m is a constant which is independent of temperature or Kc. However, in the case of high temperature that glass phase is softened, the crack growth rate is found to be deviated from the above relation. This reason is, thus, discussed.

• Journal of the Korean Ceramic Society
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• v.33 no.11
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• pp.1260-1266
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• 1996

The effects of SiO2 MnO2 and sintering atmospheres (O2, N2) on the piezoelectric properties and densification behaviors of Pb0.98Cd0.02Zr0.36Ti0.39Ni0.083Nb0.167O3 were investigated. The addition of SiO2 to the system enhanced the rate of densification but supressed the rate of grain growth. On the other hand the addition of MnO2 to the system did not nearly affect the rate of densification but increased slightly the rate of grain growth The densification of Pb0.98Cd0.02Zr0.36Ti0.39Ni0.083Nb0.167O3 containing of SiO2 or MnO2 was promoted with increasing the partial pressure of O2. The relative dielectric constant ($\varepsilon$r) and piezoelectric constant (d33) of Pb0.98Cd0.02Zr0.36Ti0.39Ni0.083Nb0.167O3 containing of SiO2 or MnO2 sintered under O2 atmosphere were higher than under N2 atmosphere. Whereas the mechanical quality factor (Qm) of specimens sintered under O2 atmosphere were lower than under N2 atmosphere. Thus the sintering atmosphere of O2 and N2 in Pb0.98Cd0.02Zr0.36Ti0.39Ni0.083Nb0.167O3 containing of SiO2 or MnO2 acted as donor and acceptor respectively. As the amount of SiO2 increased the relative dielectric constant ($\varepsilon$r) and piezoelectric constant (d33) of Pb0.98Cd0.02Zr0.36Ti0.39Ni0.083Nb0.167O3 but the mechanical quality factor (Qm) did not nearly change, In the case of the addition of MnO2 to the system the relative dielectric constant ($\varepsilon$r) and piezoelectric constant (d33) of Pb0.98Cd0.02Zr0.36Ti0.39Ni0.083Nb0.167O3 sintered under O2 atmosphere decreased rapidly with increasing the amount of MnO2 but they were unchanged with increasing the amount of MnO2 under N2 sintering atmosphere. Therefore the differences of the relative dielect-ric constant ($\varepsilon$r) and piezoelectric constant (d33) due to sintering atmosphere were diminished as the amount of MnO2 increased.

• Journal of the Korean Society of Combustion
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• v.11 no.2
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• pp.28-36
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• 2006

A constant volume combustion chamber was used to investigate the combustion characteristics. of homogeneous charge of methane-air mixture under various initial pressure, equivalence ratio and ignition times. The constant volume combustion chamber(CVCC) mostly has been studied by the experiments of visualization until now. So it is needed the numerical analysis of fluid and combustion characteristics in chamber by the more detail simulation. In this paper, the numerical analysis is tried to approach basically the homogeneous charge combustion phenomena under the various conditions, and the combustion phenomena in chamber is numerically analyzed by the commercial FIRE code. As a results, the combustion phenomena which were mean temperature, OH radical and reaction rate in chamber were investigated and it showed that the smallest flame growth occurs for the lean state and the increase of initial charged pressure condition due to the reduced OH radical.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.15 no.3
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• pp.179-184
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• 1982

The behavior of continuous flow culture of Lartobacillus bulgricus was investigated by application of Monod's kinetic model. The parameters obtained from Monod's chemostat theory successfully predicted the behavior of the chemostat. Then, it was found that Monod's kinetics were applicable to the growth rate dependence on glucose concentration. Under steady-state condition, the maximum growth rate, saturation constant, and wash out were found to be 0.62/hr, 7.69 g/1, 0.51/hr of continuous culture. And the optimum condition for the highest cell production was 0.41/hr in dilution rate, and at that point the cell production rate was 0.178g/1 hr.